Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0420T-R22M
0.22
30
0.007
22
12
0.160 [4.06mm]
0.177 [4.50mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 216
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0420T-R33M
0.33
20
0.0105
16
95
0.160 [4.06mm]
0.177 [4.50mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 217
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0420T-R47M
0.47
20
0.014
11
75
0.160 [4.06mm]
0.177 [4.50mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 218
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0420T-R56M
0.56
20
0.018
9.5
65
0.160 [4.06mm]
0.177 [4.50mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 219
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0420T-R68M
0.68
20
0.02
9.5
65
0.160 [4.06mm]
0.177 [4.50mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 220
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0420T-1R0M
1
20
0.027
8
45
0.160 [4.06mm]
0.177 [4.50mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 221
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0420T-1R5M
1.5
20
0.033
6.5
4
0.160 [4.06mm]
0.177 [4.50mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 222
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0420T-2R2M
2.2
20
0.058
6.5
35
0.160 [4.06mm]
0.177 [4.50mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 223
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0420T-3R3M
3.3
20
0.087
3.5
33
0.160 [4.06mm]
0.177 [4.50mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 224
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0420T-4R7M
4.7
20
0.14
3.5
2
0.160 [4.06mm]
0.177 [4.50mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 225
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0420T-6R8M
6.8
20
0.175
2.8
19
0.160 [4.06mm]
0.177 [4.50mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 226
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0420T-8R2M
8.2
20
0.2
2.3
16
0.160 [4.06mm]
0.177 [4.50mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 227
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0420T-100M
10
20
0.2
2.1
14
0.160 [4.06mm]
0.177 [4.50mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 228
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0518T-R20M
0.2
20
0.0041
23
13
0.205 [5.21mm]
0.216 [5.50mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 229
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0518T-R22M
0.22
20
0.005
20
12
0.205 [5.21mm]
0.216 [5.50mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 230
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0518T-R33M
0.33
20
0.0086
14
10
0.205 [5.21mm]
0.216 [5.50mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 231
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0518T-R47M
0.47
20
0.0113
13
95
0.205 [5.21mm]
0.216 [5.50mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 232
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0518T-R56M
0.56
20
0.013
12.5
9
0.205 [5.21mm]
0.216 [5.50mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 233
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0518T-R68M
0.68
20
0.0143
12
85
0.205 [5.21mm]
0.216 [5.50mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 234
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0518T-1R0M
1
20
0.021
9.5
63
0.205 [5.21mm]
0.216 [5.50mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 235
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0518T-1R5M
1.5
20
0.03
8.5
55
0.205 [5.21mm]
0.216 [5.50mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 236
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0518T-2R2M
2.2
20
0.048
7
4
0.205 [5.21mm]
0.216 [5.50mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 237
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0518T-3R3M
3.3
20
0.069
4.5
33
0.205 [5.21mm]
0.216 [5.50mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 238
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0518T-4R7M
4.7
20
0.098
4
28
0.205 [5.21mm]
0.216 [5.50mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 239
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0518T-5R6M
5.6
20
0.127
3.5
23
0.205 [5.21mm]
0.216 [5.50mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 240
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0518T-6R8M
6.8
20
0.137
3.2
22
0.205 [5.21mm]
0.216 [5.50mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 241
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0518T-8R2M
8.2
20
0.165
2.8
21
0.205 [5.21mm]
0.216 [5.50mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 242
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0518T-100M
10
20
0.19
2.6
21
0.205 [5.21mm]
0.216 [5.50mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 243
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0518T-150M
15
20
0.318
2.1
15
0.205 [5.21mm]
0.216 [5.50mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 244
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0520T-R22M
0.22
20
0.006
15.5
12
0.205 [5.21mm]
0.216 [5.50mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 245
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0520T-R33M
0.33
20
0.009
14
11
0.205 [5.21mm]
0.216 [5.50mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 246
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0520T-R47M
0.47
20
0.009
11
105
0.205 [5.21mm]
0.216 [5.50mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 247
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0520T-1R0M
1
20
0.02
7.5
55
0.205 [5.21mm]
0.216 [5.50mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 248
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0520T-1R5M
1.5
20
0.026
6.5
45
0.205 [5.21mm]
0.216 [5.50mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 249
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0520T-2R2M
2.2
20
0.05
5.5
35
0.205 [5.21mm]
0.216 [5.50mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 250
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0520T-3R3M
3.3
20
0.07
4.5
33
0.205 [5.21mm]
0.216 [5.50mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 251
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0520T-4R7M
4.7
20
0.095
3.5
3
0.205 [5.21mm]
0.216 [5.50mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 252
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0520T-6R8M
6.8
20
0.15
2.6
23
0.205 [5.21mm]
0.216 [5.50mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 253
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0520T-100M
10
20
0.19
1.8
16
0.205 [5.21mm]
0.216 [5.50mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 254
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0530T-R10N
0.1
30
0.003
25
21
0.205 [5.21mm]
0.216 [5.50mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 255
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0530T-R20N
0.2
30
0.0032
23
15
0.205 [5.21mm]
0.216 [5.50mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 256
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0530T-R22M
0.22
20
0.0044
19
145
0.205 [5.21mm]
0.216 [5.50mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 257
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0530T-R33M
0.33
20
0.005
17
13
0.205 [5.21mm]
0.216 [5.50mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 258
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0530T-R47M
0.47
20
0.0074
15
11
0.205 [5.21mm]
0.216 [5.50mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 259
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0530T-R68M
0.68
20
0.012
13
8
0.205 [5.21mm]
0.216 [5.50mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 260
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0530T-1R0M
1
20
0.014
10
65
0.205 [5.21mm]
0.216 [5.50mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 261
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0530T-1R2M
1.2
20
0.016
10
6
0.205 [5.21mm]
0.216 [5.50mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 262
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0530T-1R5M
1.5
20
0.025
9.5
55
0.205 [5.21mm]
0.216 [5.50mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 263
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0530T-2R2M
2.2
20
0.035
8.5
5
0.205 [5.21mm]
0.216 [5.50mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 264
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0530T-3R3M
3.3
20
0.038
7.5
45
0.205 [5.21mm]
0.216 [5.50mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 265
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0530T-3R6M
3.6
20
0.054
6.5
44
0.205 [5.21mm]
0.216 [5.50mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 266
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0530T-4R7M
4.7
20
0.057
5.5
41
0.205 [5.21mm]
0.216 [5.50mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 267
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0530T-5R6M
5.6
20
0.063
4
38
0.205 [5.21mm]
0.216 [5.50mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 268
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0530T-6R8M
6.8
20
0.076
3.8
35
0.205 [5.21mm]
0.216 [5.50mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 269
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0530T-100M
10
20
0.128
3.3
26
0.205 [5.21mm]
0.216 [5.50mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 270
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0530T-150M
15
20
0.19
2.4
19
0.205 [5.21mm]
0.216 [5.50mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 271
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0530T-180M
18
20
0.23
2.1
18
0.205 [5.21mm]
0.216 [5.50mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 272
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0530T-220M
22
20
0.25
1.5
17
0.205 [5.21mm]
0.216 [5.50mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 273
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0530T-330M
33
20
0.44
1.4
14
0.205 [5.21mm]
0.216 [5.50mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 274
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0618T-R15N
0.15
30
0.0026
28
15
0.260 [6.60mm]
0.275 [7.00mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 275
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0618T-R18N
0.18
30
0.003
27
14
0.260 [6.60mm]
0.275 [7.00mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 276
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0618T-R22M
0.22
20
0.003
22
13
0.260 [6.60mm]
0.275 [7.00mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 277
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0618T-R33M
0.33
20
0.0058
18
11
0.260 [6.60mm]
0.275 [7.00mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 278
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0618T-R47M
0.47
20
0.0074
15
95
0.260 [6.60mm]
0.275 [7.00mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 279
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0618T-R56M
0.56
20
0.01
14
9
0.260 [6.60mm]
0.275 [7.00mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 280
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0618T-R68M
0.68
20
0.011
14
85
0.260 [6.60mm]
0.275 [7.00mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 281
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0618T-R82M
0.82
20
0.014
13
74
0.260 [6.60mm]
0.275 [7.00mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 282
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0618T-1R0M
1
20
0.017
11
6
0.260 [6.60mm]
0.275 [7.00mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 283
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0618T-1R2M
1.2
20
0.024
10
55
0.260 [6.60mm]
0.275 [7.00mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 284
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0618T-1R5M
1.5
20
0.0252
10
5
0.260 [6.60mm]
0.275 [7.00mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 285
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0618T-2R2M
2.2
20
0.035
9.5
5
0.260 [6.60mm]
0.275 [7.00mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 286
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0618T-3R3M
3.3
20
0.046
7.5
4
0.260 [6.60mm]
0.275 [7.00mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 287
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0618T-4R7M
4.7
20
0.076
5.5
34
0.260 [6.60mm]
0.275 [7.00mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 288
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0618T-5R6M
5.6
20
0.086
4.5
29
0.260 [6.60mm]
0.275 [7.00mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 289
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0618T-6R8M
6.8
20
0.104
4
24
0.260 [6.60mm]
0.275 [7.00mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 290
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0618T-8R2M
8.2
20
0.14
3.6
2
0.260 [6.60mm]
0.275 [7.00mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 291
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0618T-100M
10
20
0.16
2.9
18
0.260 [6.60mm]
0.275 [7.00mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 292
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0618T-150M
15
20
0.28
2.5
15
0.260 [6.60mm]
0.275 [7.00mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 293
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0618T-220M
22
20
0.36
1.9
13
0.260 [6.60mm]
0.275 [7.00mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 294
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0620T-R10N
0.1
30
0.0024
38
19
0.260 [6.60mm]
0.275 [7.00mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 295
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0620T-R15N
0.15
30
0.0027
37
17
0.260 [6.60mm]
0.275 [7.00mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 296
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0620T-R16N
0.16
30
0.0027
36
17
0.260 [6.60mm]
0.275 [7.00mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 297
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0620T-R18N
0.18
30
0.0029
34
17
0.260 [6.60mm]
0.275 [7.00mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 298
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0620T-R20N
0.2
30
0.003
33
17
0.260 [6.60mm]
0.275 [7.00mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 299
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0620T-R22N
0.22
30
0.004
30
14
0.260 [6.60mm]
0.275 [7.00mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 300
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0620T-R33M
0.33
20
0.005
23
13
0.260 [6.60mm]
0.275 [7.00mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 301
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0620T-R47M
0.47
20
0.0083
19
107
0.260 [6.60mm]
0.275 [7.00mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 302
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0620T-R56M
0.56
20
0.0093
17
10
0.260 [6.60mm]
0.275 [7.00mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 303
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0620T-R68M
0.68
20
0.01
15
95
0.260 [6.60mm]
0.275 [7.00mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 304
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0620T-1R0M
1
20
0.018
13
75
0.260 [6.60mm]
0.275 [7.00mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 305
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0620T-1R2M
1.2
20
0.023
12
7
0.260 [6.60mm]
0.275 [7.00mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 306
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0620T-1R5M
1.5
20
0.027
11
65
0.260 [6.60mm]
0.275 [7.00mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 307
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0620T-2R2M
2.2
20
0.037
9.5
55
0.260 [6.60mm]
0.275 [7.00mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 308
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0620T-3R3M
3.3
20
0.048
7.5
45
0.260 [6.60mm]
0.275 [7.00mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 309
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0620T-4R7M
4.7
20
0.06
6.5
4
0.260 [6.60mm]
0.275 [7.00mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 310
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0620T-5R6M
5.6
20
0.068
5.5
35
0.260 [6.60mm]
0.275 [7.00mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 311
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0620T-6R8M
6.8
20
0.073
5
35
0.260 [6.60mm]
0.275 [7.00mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 312
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0620T-8R2M
8.2
20
0.116
4.5
3
0.260 [6.60mm]
0.275 [7.00mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 313
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0620T-100M
10
20
0.154
3.5
26
0.260 [6.60mm]
0.275 [7.00mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 314
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0620T-150M
15
20
0.21
3.1
19
0.260 [6.60mm]
0.275 [7.00mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 315
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0620T-220M
22
20
0.28
2.3
13
0.260 [6.60mm]
0.275 [7.00mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 316
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0624T-R10N
0.1
30
0.0017
67
28
0.260 [6.60mm]
0.275 [7.00mm]
0.079 [2.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 317
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0624T-R15N
0.15
30
0.0023
43
28
0.260 [6.60mm]
0.275 [7.00mm]
0.094 [2.40mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 318
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0624T-R20M
0.2
20
0.0028
38
21
0.260 [6.60mm]
0.275 [7.00mm]
0.094 [2.40mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 319
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0624T-R22M
0.22
20
0.0032
32
19
0.260 [6.60mm]
0.275 [7.00mm]
0.094 [2.40mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 320
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0624T-R33M
0.33
20
0.0044
28
17
0.260 [6.60mm]
0.275 [7.00mm]
0.094 [2.40mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 321
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0624T-R36M
0.36
20
0.0046
27
16
0.260 [6.60mm]
0.275 [7.00mm]
0.094 [2.40mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 322
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0624T-R47M
0.47
20
0.0051
24
14
0.260 [6.60mm]
0.275 [7.00mm]
0.094 [2.40mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 323
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0624T-R56M
0.56
20
0.0065
22
12
0.260 [6.60mm]
0.275 [7.00mm]
0.094 [2.40mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 324
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0624T-R60M
0.6
20
0.0069
20
12
0.260 [6.60mm]
0.275 [7.00mm]
0.094 [2.40mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 325
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0624T-R68M
0.68
20
0.0072
19
12
0.260 [6.60mm]
0.275 [7.00mm]
0.094 [2.40mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 326
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0624T-R82M
0.82
20
0.0095
16
10
0.260 [6.60mm]
0.275 [7.00mm]
0.094 [2.40mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 327
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0624T-1R0M
1
20
0.0135
15
10
0.260 [6.60mm]
0.275 [7.00mm]
0.094 [2.40mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 328
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0624T-1R5M
1.5
20
0.02
14
85
0.260 [6.60mm]
0.275 [7.00mm]
0.094 [2.40mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 329
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0624T-2R2M
2.2
20
0.028
13
65
0.260 [6.60mm]
0.275 [7.00mm]
0.094 [2.40mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 330
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0624T-3R3M
3.3
20
0.039
9.5
55
0.260 [6.60mm]
0.275 [7.00mm]
0.094 [2.40mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 331
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0624T-4R7M
4.7
20
0.05
8.5
5
0.260 [6.60mm]
0.275 [7.00mm]
0.094 [2.40mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 332
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0624T-5R6M
5.6
20
0.062
7.5
45
0.260 [6.60mm]
0.275 [7.00mm]
0.094 [2.40mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 333
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0624T-6R8M
6.8
20
0.072
6.5
35
0.260 [6.60mm]
0.275 [7.00mm]
0.094 [2.40mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 334
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0624T-8R2M
8.2
20
0.095
5.5
34
0.260 [6.60mm]
0.275 [7.00mm]
0.094 [2.40mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 335
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0624T-100M
10
20
0.101
4.5
3
0.260 [6.60mm]
0.275 [7.00mm]
0.094 [2.40mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 336
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0624T-150M
15
20
0.18
3.3
23
0.260 [6.60mm]
0.275 [7.00mm]
0.094 [2.40mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 337
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0624T-220M
22
20
0.215
2.8
16
0.260 [6.60mm]
0.275 [7.00mm]
0.094 [2.40mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 338
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0630T-R10M
0.1
20
0.0015
57
305
0.260 [6.60mm]
0.275 [7.00mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 339
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0630T-R15M
0.15
20
0.0025
49
28
0.260 [6.60mm]
0.275 [7.00mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 340
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0630T-R20M
0.2
20
0.0027
39
22
0.260 [6.60mm]
0.275 [7.00mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 341
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0630T-R22M
0.22
20
0.0032
38
21
0.260 [6.60mm]
0.275 [7.00mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 342
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0630T-R33M
0.33
20
0.0035
28
19
0.260 [6.60mm]
0.275 [7.00mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 343
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0630T-R47M
0.47
20
0.005
24
165
0.260 [6.60mm]
0.275 [7.00mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 344
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0630T-R56M
0.56
20
0.0055
23.5
155
0.260 [6.60mm]
0.275 [7.00mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 345
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0630T-R68M
0.68
20
0.0055
23
145
0.260 [6.60mm]
0.275 [7.00mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 346
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0630T-R75M
0.75
20
0.0055
22.5
13
0.260 [6.60mm]
0.275 [7.00mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 347
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0630T-R82M
0.82
20
0.0085
22
12
0.260 [6.60mm]
0.275 [7.00mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 348
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0630T-1R0M
1
20
0.0086
20
10
0.260 [6.60mm]
0.275 [7.00mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 349
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0630T-1R2M
1.2
20
0.0086
19
95
0.260 [6.60mm]
0.275 [7.00mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 350
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0630T-1R5M
1.5
20
0.015
17
85
0.260 [6.60mm]
0.275 [7.00mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 351
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0630T-2R0M
2
20
0.02
13
77
0.260 [6.60mm]
0.275 [7.00mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 352
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0630T-2R2M
2.2
20
0.02
13
75
0.260 [6.60mm]
0.275 [7.00mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 353
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0630T-2R5M
2.5
20
0.02
13
65
0.260 [6.60mm]
0.275 [7.00mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 354
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0630T-3R3M
3.3
20
0.022
12.5
55
0.260 [6.60mm]
0.275 [7.00mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 355
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0630T-4R7M
4.7
20
0.033
9.5
5
0.260 [6.60mm]
0.275 [7.00mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 356
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0630T-6R8M
6.8
20
0.06
7.5
4
0.260 [6.60mm]
0.275 [7.00mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 357
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0630T-8R2M
8.2
20
0.066
7.5
35
0.260 [6.60mm]
0.275 [7.00mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 358
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0630T-100M
10
20
0.1
6.5
28
0.260 [6.60mm]
0.275 [7.00mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 359
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0640T-R12N
0.12
30
0.001
61
30
0.260 [6.60mm]
0.275 [7.00mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 360
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0640T-R15N
0.15
30
0.0012
52
28
0.260 [6.60mm]
0.275 [7.00mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 361
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0640T-R22M
0.22
20
0.0021
32
23
0.260 [6.60mm]
0.275 [7.00mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 362
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0640T-R33M
0.33
20
0.0026
32
23
0.260 [6.60mm]
0.275 [7.00mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 363
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0640T-R36M
0.36
20
0.0031
29
23
0.260 [6.60mm]
0.275 [7.00mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 364
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0640T-R47M
0.47
20
0.0034
26
21
0.260 [6.60mm]
0.275 [7.00mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 365
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0640T-R56M
0.56
20
0.0043
24
19
0.260 [6.60mm]
0.275 [7.00mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 366
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0640T-R68M
0.68
20
0.0045
22
15
0.260 [6.60mm]
0.275 [7.00mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 367
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0640T-1R0M
1
20
0.008
20
13
0.260 [6.60mm]
0.275 [7.00mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 368
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0640T-1R5M
1.5
20
0.012
19
11
0.260 [6.60mm]
0.275 [7.00mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 369
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0640T-2R2M
2.2
20
0.014
13
85
0.260 [6.60mm]
0.275 [7.00mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 370
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0640T-3R3M
3.3
20
0.027
11
75
0.260 [6.60mm]
0.275 [7.00mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 371
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0640T-4R7M
4.7
20
0.0325
10
55
0.260 [6.60mm]
0.275 [7.00mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 372
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0640T-5R6M
5.6
20
0.038
8.5
45
0.260 [6.60mm]
0.275 [7.00mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 373
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0640T-6R8M
6.8
20
0.05
8
4
0.260 [6.60mm]
0.275 [7.00mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 374
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0640T-8R2M
8.2
20
0.064
7.5
4
0.260 [6.60mm]
0.275 [7.00mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 375
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0640T-100M
10
20
0.072
6.5
35
0.260 [6.60mm]
0.275 [7.00mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 376
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0640T-150M
15
20
0.09
3.3
28
0.260 [6.60mm]
0.275 [7.00mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 377
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0640T-220M
22
20
0.145
3.3
23
0.260 [6.60mm]
0.275 [7.00mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 378
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0640T-330M
33
20
0.21
3
16
0.260 [6.60mm]
0.275 [7.00mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 379
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0640T-470M
47
20
0.35
2.3
16
0.260 [6.60mm]
0.275 [7.00mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 380
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0650T-R10N
0.1
30
0.0008
62
30
0.260 [6.60mm]
0.275 [7.00mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 381
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0650T-R11N
0.11
30
0.0008
62
30
0.260 [6.60mm]
0.275 [7.00mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 382
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0650T-R15N
0.15
30
0.0017
48
28
0.260 [6.60mm]
0.275 [7.00mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 383
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0650T-R22M
0.22
20
0.0019
33
23
0.260 [6.60mm]
0.275 [7.00mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 384
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0650T-R33M
0.33
20
0.003
30
23
0.260 [6.60mm]
0.275 [7.00mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 385
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0650T-R40M
0.4
20
0.0037
29
21
0.260 [6.60mm]
0.275 [7.00mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 386
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0650T-R47M
0.47
20
0.0039
28
20
0.260 [6.60mm]
0.275 [7.00mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 387
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0650T-R56M
0.56
20
0.0042
25
19
0.260 [6.60mm]
0.275 [7.00mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 388
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0650T-R60M
0.6
20
0.0043
23
18
0.260 [6.60mm]
0.275 [7.00mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 389
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0650T-R68M
0.68
20
0.0045
22
17
0.260 [6.60mm]
0.275 [7.00mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 390
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0650T-R82M
0.82
20
0.0049
20
155
0.260 [6.60mm]
0.275 [7.00mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 391
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0650T-1R0M
1
20
0.0065
19
14
0.260 [6.60mm]
0.275 [7.00mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 392
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0650T-1R2M
1.2
20
0.0075
17
13
0.260 [6.60mm]
0.275 [7.00mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 393
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0650T-1R5M
1.5
20
0.009
15.5
11
0.260 [6.60mm]
0.275 [7.00mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 394
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0650T-1R8M
1.8
20
0.011
14
11
0.260 [6.60mm]
0.275 [7.00mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 395
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0650T-2R2M
2.2
20
0.012
13
95
0.260 [6.60mm]
0.275 [7.00mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 396
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0650T-3R3M
3.3
20
0.021
11
75
0.260 [6.60mm]
0.275 [7.00mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 397
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0650T-4R7M
4.7
20
0.031
9.5
6
0.260 [6.60mm]
0.275 [7.00mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 398
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0650T-4R9M
4.9
20
0.038
9
58
0.260 [6.60mm]
0.275 [7.00mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 399
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0650T-5R6M
5.6
20
0.049
8.5
55
0.260 [6.60mm]
0.275 [7.00mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 400
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0650T-6R8M
6.8
20
0.0515
8
5
0.260 [6.60mm]
0.275 [7.00mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 401
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0650T-8R2M
8.2
20
0.063
7.5
45
0.260 [6.60mm]
0.275 [7.00mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 402
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0650T-100M
10
20
0.069
7
35
0.260 [6.60mm]
0.275 [7.00mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 403
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0650T-120M
12
20
0.08
6.2
35
0.260 [6.60mm]
0.275 [7.00mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 404
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0650T-150M
15
20
0.092
5.5
33
0.260 [6.60mm]
0.275 [7.00mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 405
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0650T-220M
22
20
0.17
5
23
0.260 [6.60mm]
0.275 [7.00mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 406
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0650T-330M
33
20
0.2
3.3
18
0.260 [6.60mm]
0.275 [7.00mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 407
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0650T-420M
42
20
0.245
2.6
18
0.260 [6.60mm]
0.275 [7.00mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 408
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0650T-470M
47
20
0.33
2.5
17
0.260 [6.60mm]
0.275 [7.00mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 409
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0650T-560M
56
20
0.396
1.9
14
0.260 [6.60mm]
0.275 [7.00mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 410
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL0650T-680M
68
20
0.445
1.8
1
0.260 [6.60mm]
0.275 [7.00mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 411
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1040T-R22M
0.22
20
0.001
57
33
0.402 [10.2mm]
0.433 [11.0mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 412
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1040T-R27M
0.27
20
0.001
57
31
0.402 [10.2mm]
0.433 [11.0mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 413
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1040T-R36M
0.36
20
0.0012
57
29
0.402 [10.2mm]
0.433 [11.0mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 414
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1040T-R39M
0.39
20
0.0013
57
28
0.402 [10.2mm]
0.433 [11.0mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 415
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1040T-R45M
0.45
20
0.0015
43
27
0.402 [10.2mm]
0.433 [11.0mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 416
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1040T-R56M
0.56
20
0.0018
38
23
0.402 [10.2mm]
0.433 [11.0mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 417
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1040T-1R0M
1
20
0.0033
34
17
0.402 [10.2mm]
0.433 [11.0mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 418
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1040T-1R5M
1.5
20
0.0046
31
15
0.402 [10.2mm]
0.433 [11.0mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 419
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1040T-2R2M
2.2
20
0.007
25
11
0.402 [10.2mm]
0.433 [11.0mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 420
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1040T-3R3M
3.3
20
0.0118
19
10
0.402 [10.2mm]
0.433 [11.0mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 421
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1040T-4R7M
4.7
20
0.0155
16
935
0.402 [10.2mm]
0.433 [11.0mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 422
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1040T-6R8M
6.8
20
0.0233
12.5
8
0.402 [10.2mm]
0.433 [11.0mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 423
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1040T-8R2M
8.2
20
0.0245
11.5
75
0.402 [10.2mm]
0.433 [11.0mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 424
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1040T-100M
10
20
0.03
11
7
0.402 [10.2mm]
0.433 [11.0mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 425
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1040T-150M
15
20
0.045
9.5
58
0.402 [10.2mm]
0.433 [11.0mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 426
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1040T-330M
33
20
0.112
4.5
33
0.402 [10.2mm]
0.433 [11.0mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 427
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1050T-R22M
0.22
20
0.0006
67
43
0.402 [10.2mm]
0.433 [11.0mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 428
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1050T-R30M
0.3
20
0.0008
62
36
0.402 [10.2mm]
0.433 [11.0mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 429
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1050T-R56M
0.56
20
0.0015
41
245
0.402 [10.2mm]
0.433 [11.0mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 430
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1050T-R90M
0.9
20
0.003
30
23
0.402 [10.2mm]
0.433 [11.0mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 431
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1050T-1R0M
1
20
0.0035
28
20
0.402 [10.2mm]
0.433 [11.0mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 432
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1050T-1R2M
1.2
20
0.0035
26
19
0.402 [10.2mm]
0.433 [11.0mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 433
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1050T-1R3M
1.3
20
0.0037
26
19
0.402 [10.2mm]
0.433 [11.0mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 434
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1050T-1R5M
1.5
20
0.0041
25
18
0.402 [10.2mm]
0.433 [11.0mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 435
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1050T-1R8M
1.8
20
0.0047
23.5
165
0.402 [10.2mm]
0.433 [11.0mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 436
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1050T-2R2M
2.2
20
0.006
22
15
0.402 [10.2mm]
0.433 [11.0mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 437
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1050T-3R3M
3.3
20
0.0104
20
13
0.402 [10.2mm]
0.433 [11.0mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 438
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1050T-4R7M
4.7
20
0.0125
18
12
0.402 [10.2mm]
0.433 [11.0mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 439
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1050T-5R0M
5
20
0.015
17
11
0.402 [10.2mm]
0.433 [11.0mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 440
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1050T-5R6M
5.6
20
0.0168
15
95
0.402 [10.2mm]
0.433 [11.0mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 441
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1050T-6R8M
6.8
20
0.021
14
9
0.402 [10.2mm]
0.433 [11.0mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 442
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1050T-8R2M
8.2
20
0.024
13.5
85
0.402 [10.2mm]
0.433 [11.0mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 443
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1050T-100M
10
20
0.029
12.5
75
0.402 [10.2mm]
0.433 [11.0mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 444
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1050T-120M
12
20
0.035
9.5
55
0.402 [10.2mm]
0.433 [11.0mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 445
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1050T-150M
15
20
0.045
9
5
0.402 [10.2mm]
0.433 [11.0mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 446
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1050T-220M
22
20
0.06
8.5
45
0.402 [10.2mm]
0.433 [11.0mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 447
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1050T-240M
24
20
0.071
7.2
41
0.402 [10.2mm]
0.433 [11.0mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 448
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1050T-330M
33
20
0.092
7
38
0.402 [10.2mm]
0.433 [11.0mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 449
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1050T-470M
47
20
0.145
6
36
0.402 [10.2mm]
0.433 [11.0mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 450
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1050T-680M
68
20
0.205
3.5
23
0.402 [10.2mm]
0.433 [11.0mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 451
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1050T-101M
100
20
0.38
2.8
18
0.402 [10.2mm]
0.433 [11.0mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 452
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1235T-1R5M
1.5
20
0.0055
33
18
0.504 [12.8mm]
0.531 [13.5mm]
0.138 [3.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 453
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1235T-1R8M
1.8
20
0.007
28
16
0.504 [12.8mm]
0.531 [13.5mm]
0.138 [3.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 454
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1235T-2R2M
2.2
20
0.008
27
15
0.504 [12.8mm]
0.531 [13.5mm]
0.138 [3.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 455
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1235T-3R3M
3.3
20
0.0135
25
11
0.504 [12.8mm]
0.531 [13.5mm]
0.138 [3.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 456
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1235T-4R7M
4.7
20
0.0185
22
95
0.504 [12.8mm]
0.531 [13.5mm]
0.138 [3.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 457
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1235T-5R6M
5.6
20
0.022
18
9
0.504 [12.8mm]
0.531 [13.5mm]
0.138 [3.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 458
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1235T-6R8M
6.8
20
0.024
17
85
0.504 [12.8mm]
0.531 [13.5mm]
0.138 [3.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 459
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1235T-8R2M
8.2
20
0.028
15
8
0.504 [12.8mm]
0.531 [13.5mm]
0.138 [3.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 460
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1235T-100M
10
20
0.034
13
7
0.504 [12.8mm]
0.531 [13.5mm]
0.138 [3.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 461
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1235T-150M
15
20
0.065
9.5
6
0.504 [12.8mm]
0.531 [13.5mm]
0.138 [3.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 462
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1235T-220M
22
20
0.099
6.5
4
0.504 [12.8mm]
0.531 [13.5mm]
0.138 [3.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 463
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1235T-330M
33
20
0.16
5.5
33
0.504 [12.8mm]
0.531 [13.5mm]
0.138 [3.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 464
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1235T-470M
47
20
0.218
5
28
0.504 [12.8mm]
0.531 [13.5mm]
0.138 [3.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 465
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1250T-R15M
0.15
20
0.0006
105
50
0.504 [12.8mm]
0.531 [13.5mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 466
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1250T-R22M
0.22
20
0.0007
105
49
0.504 [12.8mm]
0.531 [13.5mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 467
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1250T-R33M
0.33
20
0.001
72
40
0.504 [12.8mm]
0.531 [13.5mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 468
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1250T-R36M
0.36
20
0.001
67
40
0.504 [12.8mm]
0.531 [13.5mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 469
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1250T-R40M
0.4
20
0.001
61
39
0.504 [12.8mm]
0.531 [13.5mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 470
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1250T-R47M
0.47
20
0.0013
57
36
0.504 [12.8mm]
0.531 [13.5mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 471
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1250T-R56M
0.56
20
0.0013
52
34
0.504 [12.8mm]
0.531 [13.5mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 472
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1250T-R68M
0.68
20
0.0017
51
32
0.504 [12.8mm]
0.531 [13.5mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 473
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1250T-R82M
0.82
20
0.0021
49
29
0.504 [12.8mm]
0.531 [13.5mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 474
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1250T-1R0M
1
20
0.0025
48
27
0.504 [12.8mm]
0.531 [13.5mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 475
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1250T-1R2M
1.2
20
0.0025
45
26
0.504 [12.8mm]
0.531 [13.5mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 476
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1250T-1R5M
1.5
20
0.0041
45
19
0.504 [12.8mm]
0.531 [13.5mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 477
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1250T-2R2M
2.2
20
0.0055
35
19
0.504 [12.8mm]
0.531 [13.5mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 478
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1250T-3R3M
3.3
20
0.0084
30
14
0.504 [12.8mm]
0.531 [13.5mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 479
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1250T-4R7M
4.7
20
0.015
25
11
0.504 [12.8mm]
0.531 [13.5mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 480
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1250T-6R8M
6.8
20
0.0185
19
10
0.504 [12.8mm]
0.531 [13.5mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 481
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1250T-8R2M
8.2
20
0.0225
17
9
0.504 [12.8mm]
0.531 [13.5mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 482
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1250T-100M
10
20
0.0255
16
85
0.504 [12.8mm]
0.531 [13.5mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 483
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1250T-150M
15
20
0.038
12
77
0.504 [12.8mm]
0.531 [13.5mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 484
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1250T-220M
22
20
0.058
9.5
6
0.504 [12.8mm]
0.531 [13.5mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 485
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1250T-330M
33
20
0.065
9.5
45
0.504 [12.8mm]
0.531 [13.5mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 486
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1250T-470M
47
20
0.1
5.5
35
0.504 [12.8mm]
0.531 [13.5mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 487
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1250T-680M
68
20
0.18
4.5
33
0.504 [12.8mm]
0.531 [13.5mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 488
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1250T-101M
100
20
0.27
4
28
0.504 [12.8mm]
0.531 [13.5mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 489
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1265T-R15M
0.15
20
0.0006
113
52
0.504 [12.8mm]
0.531 [13.5mm]
0.256 [6.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 490
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1265T-R22M
0.22
20
0.0006
107
50
0.504 [12.8mm]
0.531 [13.5mm]
0.256 [6.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 491
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1265T-R30M
0.3
20
0.0007
69
46
0.504 [12.8mm]
0.531 [13.5mm]
0.256 [6.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 492
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1265T-R33M
0.33
20
0.0008
65
44
0.504 [12.8mm]
0.531 [13.5mm]
0.256 [6.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 493
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1265T-R36M
0.36
20
0.0008
63
43
0.504 [12.8mm]
0.531 [13.5mm]
0.256 [6.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 494
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1265T-R40M
0.4
20
0.001
61
42
0.504 [12.8mm]
0.531 [13.5mm]
0.256 [6.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 495
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1265T-R47M
0.47
20
0.0012
60
39
0.504 [12.8mm]
0.531 [13.5mm]
0.256 [6.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 496
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1265T-R50M
0.5
20
0.0013
55
38
0.504 [12.8mm]
0.531 [13.5mm]
0.256 [6.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 497
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1265T-R56M
0.56
20
0.0013
55
35
0.504 [12.8mm]
0.531 [13.5mm]
0.256 [6.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 498
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1265T-R68M
0.68
20
0.0015
52
33
0.504 [12.8mm]
0.531 [13.5mm]
0.256 [6.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 499
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1265T-R82M
0.82
20
0.0019
48
31
0.504 [12.8mm]
0.531 [13.5mm]
0.256 [6.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 500
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1265T-1R0M
1
20
0.0023
46
28
0.504 [12.8mm]
0.531 [13.5mm]
0.256 [6.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 501
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1265T-1R2M
1.2
20
0.0024
45
26
0.504 [12.8mm]
0.531 [13.5mm]
0.256 [6.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 502
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1265T-1R5M
1.5
20
0.003
43
25
0.504 [12.8mm]
0.531 [13.5mm]
0.256 [6.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 503
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1265T-1R8M
1.8
20
0.004
38
22
0.504 [12.8mm]
0.531 [13.5mm]
0.256 [6.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 504
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1265T-2R2M
2.2
20
0.0042
35
20
0.504 [12.8mm]
0.531 [13.5mm]
0.256 [6.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 505
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1265T-2R7M
2.7
20
0.0055
30
19
0.504 [12.8mm]
0.531 [13.5mm]
0.256 [6.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 506
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1265T-3R3M
3.3
20
0.0068
28
17
0.504 [12.8mm]
0.531 [13.5mm]
0.256 [6.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 507
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1265T-4R7M
4.7
20
0.0084
26
125
0.504 [12.8mm]
0.531 [13.5mm]
0.256 [6.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 508
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1265T-5R6M
5.6
20
0.01
21
115
0.504 [12.8mm]
0.531 [13.5mm]
0.256 [6.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 509
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1265T-6R8M
6.8
20
0.0115
17
105
0.504 [12.8mm]
0.531 [13.5mm]
0.256 [6.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 510
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1265T-8R2M
8.2
20
0.0155
15
95
0.504 [12.8mm]
0.531 [13.5mm]
0.256 [6.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 511
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1265T-100M
10
20
0.0165
14.5
95
0.504 [12.8mm]
0.531 [13.5mm]
0.256 [6.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 512
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1265T-130M
13
20
0.024
12
85
0.504 [12.8mm]
0.531 [13.5mm]
0.256 [6.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 513
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1265T-150M
15
20
0.028
12
85
0.504 [12.8mm]
0.531 [13.5mm]
0.256 [6.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 514
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1265T-220M
22
20
0.037
11
85
0.504 [12.8mm]
0.531 [13.5mm]
0.256 [6.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 515
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1265T-330M
33
20
0.058
10
75
0.504 [12.8mm]
0.531 [13.5mm]
0.256 [6.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 516
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1265T-470M
47
20
0.09
9
6
0.504 [12.8mm]
0.531 [13.5mm]
0.256 [6.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 517
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1265T-680M
68
20
0.13
7.3
43
0.504 [12.8mm]
0.531 [13.5mm]
0.256 [6.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 518
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1265T-101M
100
20
0.165
5
37
0.504 [12.8mm]
0.531 [13.5mm]
0.256 [6.50mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 519
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1770T-1R0M
1
20
0.0015
67
38
0.669 [17.0mm]
0.689 [17.5mm]
0.276 [7.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 520
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1770T-1R5M
1.5
20
0.0025
49
33
0.669 [17.0mm]
0.689 [17.5mm]
0.276 [7.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 521
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1770T-2R2M
2.2
20
0.003
45
28
0.669 [17.0mm]
0.689 [17.5mm]
0.276 [7.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 522
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1770T-3R3M
3.3
20
0.0035
43
23
0.669 [17.0mm]
0.689 [17.5mm]
0.276 [7.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 523
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1770T-4R7M
4.7
20
0.005
38
20
0.669 [17.0mm]
0.689 [17.5mm]
0.276 [7.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 524
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1770T-6R8M
6.8
20
0.0075
33
18
0.669 [17.0mm]
0.689 [17.5mm]
0.276 [7.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 525
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1770T-100M
10
20
0.013
30
155
0.669 [17.0mm]
0.689 [17.5mm]
0.276 [7.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 526
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1770T-150M
15
20
0.018
21
12
0.669 [17.0mm]
0.689 [17.5mm]
0.276 [7.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 527
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1770T-220M
22
20
0.025
17
11
0.669 [17.0mm]
0.689 [17.5mm]
0.276 [7.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 528
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1770T-330M
33
20
0.042
14
97
0.669 [17.0mm]
0.689 [17.5mm]
0.276 [7.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 529
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1770T-470M
47
20
0.052
13
82
0.669 [17.0mm]
0.689 [17.5mm]
0.276 [7.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 530
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MPL1770T-680M
68
20
0.085
9.5
65
0.669 [17.0mm]
0.689 [17.5mm]
0.276 [7.00mm]
Termination Options:
RoHS-compliant, lead-free (standard)
Tin-Lead (SnPb) termination available; add suffix “S” to part number (e.g., MPL0640T-6R8MS)
Operating Temperature Range: –40°C to +125°C
Storage Temperature Range: –40°C to +125°C
Packaging Temperature Range (Tape & Reel): 40°C to +125°C.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at <30°C / 85% RH)
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 531
Adhesion Strength: 5N test is each axis, 60 sec. Part inductance shall be within +/- 10% from initial inductance.
Vibration: 1.5mm amplitude, 10-55Hz for 1 hour in each axis. Part inductance shall be within +/- 10% from initial inductance.
Mechanical Shock: 981 m/S2 pulse, 6ms, 3 times in each axis. art inductance shall be within +/- 10% from initial inductance.
Solderability: MIL-STD-202, method 208 Dielectric Strength: 100Vdc applied for 60 seconds, core and terminal.
Temperature Cycle: 500 cycles, -40°C to +125°C, 30 minutes to each extreme, 2 minute transit. Part inductance shall be within +/- 10% from initial inductance.
MLCL0603C-1N0
0.001
B,C,D.H.J
0.11
4
100 / 0.250
13.000
47
0.024 [0.60mm]
0.012 [0.30mm]
0.012 [0.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL0603C-1N2
0.0012
B,C,D.H.J
0.12
4
100 / 0.250
13.000
45
0.024 [0.60mm]
0.012 [0.30mm]
0.012 [0.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL0603C-1N5
0.0015
B,C,D.H.J
0.13
4
100 / 0.250
13.000
43
0.024 [0.60mm]
0.012 [0.30mm]
0.012 [0.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL0603C-1N8
0.0018
B,C,D.H.J
0.16
4
100 / 0.250
13.000
39
0.024 [0.60mm]
0.012 [0.30mm]
0.012 [0.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL0603C-2N0
0.002
B,C,D.H.J
0.17
4
100 / 0.250
13.000
38
0.024 [0.60mm]
0.012 [0.30mm]
0.012 [0.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL0603C-2N1
0.0021
B,C,D.H.J
0.17
4
100 / 0.250
13.000
38
0.024 [0.60mm]
0.012 [0.30mm]
0.012 [0.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL0603C-2N2
0.0022
B,C,D.H.J
0.19
4
100 / 0.250
12.500
36
0.024 [0.60mm]
0.012 [0.30mm]
0.012 [0.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL0603C-2N4
0.0024
B,C,D.H.J
0.2
4
100 / 0.250
11.700
5
0.024 [0.60mm]
0.012 [0.30mm]
0.012 [0.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL0603C-2N7
0.0027
B,C,D.H.J
0.21
4
100 / 0.250
11.000
34
0.024 [0.60mm]
0.012 [0.30mm]
0.012 [0.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL0603C-3N0
0.003
B,C,D.H.J
0.22
4
100 / 0.250
11.000
33
0.024 [0.60mm]
0.012 [0.30mm]
0.012 [0.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL0603C-3N3
0.0033
B,C,D.H.J
0.23
4
100 / 0.250
9.600
32
0.024 [0.60mm]
0.012 [0.30mm]
0.012 [0.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL0603C-3N6
0.0036
B,C,D.H.J
0.25
4
100 / 0.250
9.100
31
0.024 [0.60mm]
0.012 [0.30mm]
0.012 [0.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL0603C-3N9
0.0039
B,C,D.H.J
0.27
4
100 / 0.250
8.600
3
0.024 [0.60mm]
0.012 [0.30mm]
0.012 [0.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL0603C-4N3
0.0043
B,C,D.H.J
0.3
4
100 / 0.250
8.100
28
0.024 [0.60mm]
0.012 [0.30mm]
0.012 [0.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL0603C-4N7
0.0047
B,C,D.H.J
0.3
4
100 / 0.250
7.600
28
0.024 [0.60mm]
0.012 [0.30mm]
0.012 [0.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL0603C-5N1
0.0051
B,C,D.H.J
0.33
4
100 / 0.250
7.100
27
0.024 [0.60mm]
0.012 [0.30mm]
0.012 [0.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL0603C-5N6
0.0056
B,C,D.H.J
0.36
4
100 / 0.250
6.600
26
0.024 [0.60mm]
0.012 [0.30mm]
0.012 [0.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL0603C-6N2
0.0062
B,C,D.H.J
0.38
4
100 / 0.250
6.100
25
0.024 [0.60mm]
0.012 [0.30mm]
0.012 [0.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL0603C-6N8
0.0068
H,J
0.39
4
100 / 0.250
5.600
25
0.024 [0.60mm]
0.012 [0.30mm]
0.012 [0.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL0603C-7N5
0.0075
H,J
0.41
4
100 / 0.250
5.300
24
0.024 [0.60mm]
0.012 [0.30mm]
0.012 [0.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL0603C-8N2
0.0082
H,J
0.45
4
100 / 0.250
4.900
23
0.024 [0.60mm]
0.012 [0.30mm]
0.012 [0.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL0603C-9N1
0.0091
H,J
0.48
4
100 / 0.250
4.600
22
0.024 [0.60mm]
0.012 [0.30mm]
0.012 [0.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL0603C-10N
0.01
H,J
0.51
4
100 / 0.250
4.200
22
0.024 [0.60mm]
0.012 [0.30mm]
0.012 [0.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL0603C-12N
0.012
H,J
0.68
4
100 / 0.250
3.800
19
0.024 [0.60mm]
0.012 [0.30mm]
0.012 [0.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL0603C-15N
0.015
H,J
0.71
4
100 / 0.250
3.100
18
0.024 [0.60mm]
0.012 [0.30mm]
0.012 [0.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL0603C-18N
0.018
H,J
0.81
4
100 / 0.250
3.000
17
0.024 [0.60mm]
0.012 [0.30mm]
0.012 [0.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL0603C-22N
0.022
H,J
1
4
100 / 0.250
2.600
15
0.024 [0.60mm]
0.012 [0.30mm]
0.012 [0.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL0603C-27N
0.027
H,J
1.35
4
100 / 0.250
2.600
12
0.024 [0.60mm]
0.012 [0.30mm]
0.012 [0.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1005C-1N0
0.001
D
0.4
8
100/0.250
10.000
7
0.039 [1.0mm]
0.020 [0.50mm]
0.020 [0.50mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1005C-1N1
0.0011
D
0.4
8
100/0.250
10.000
8
0.039 [1.0mm]
0.020 [0.50mm]
0.020 [0.50mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1005C-1N2
0.0012
D
0.4
8
100/0.250
10.000
9
0.039 [1.0mm]
0.020 [0.50mm]
0.020 [0.50mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1005C-1N3
0.0013
D
0.4
8
100/0.250
9.000
1
0.039 [1.0mm]
0.020 [0.50mm]
0.020 [0.50mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1005C-1N5
0.0015
D
0.4
8
100/0.250
9.000
1
0.039 [1.0mm]
0.020 [0.50mm]
0.020 [0.50mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1005C-1N6
0.0016
D
0.4
8
100/0.250
8.000
11
0.039 [1.0mm]
0.020 [0.50mm]
0.020 [0.50mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1005C-1N8
0.0018
D
0.4
8
100/0.250
8.000
11
0.039 [1.0mm]
0.020 [0.50mm]
0.020 [0.50mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1005C-2N0
0.002
D
0.4
8
100/0.250
7.700
12
0.039 [1.0mm]
0.020 [0.50mm]
0.020 [0.50mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1005C-2N2
0.0022
D
0.4
8
100/0.250
7.700
13
0.039 [1.0mm]
0.020 [0.50mm]
0.020 [0.50mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1005C-2N4
0.0024
D
0.4
8
100/0.250
7.000
14
0.039 [1.0mm]
0.020 [0.50mm]
0.020 [0.50mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1005C-2N7
0.0027
D
0.4
8
100/0.250
7.000
15
0.039 [1.0mm]
0.020 [0.50mm]
0.020 [0.50mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1005C-3N0
0.003
D
0.4
8
100/0.250
6.700
15
0.039 [1.0mm]
0.020 [0.50mm]
0.020 [0.50mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1005C-3N3
0.0033
D
0.4
8
100/0.250
6.300
15
0.039 [1.0mm]
0.020 [0.50mm]
0.020 [0.50mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1005C-3N6
0.0036
D
0.4
8
100/0.250
6.000
16
0.039 [1.0mm]
0.020 [0.50mm]
0.020 [0.50mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1005C-3N9
0.0039
D
0.4
8
100/0.250
5.800
17
0.039 [1.0mm]
0.020 [0.50mm]
0.020 [0.50mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1005C-4N3
0.0043
D
0.4
8
100/0.250
5.600
18
0.039 [1.0mm]
0.020 [0.50mm]
0.020 [0.50mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1005C-4N7
0.0047
D
0.4
8
100/0.250
5.200
2
0.039 [1.0mm]
0.020 [0.50mm]
0.020 [0.50mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1005C-5N1
0.0051
D
0.4
8
100/0.250
5.000
2
0.039 [1.0mm]
0.020 [0.50mm]
0.020 [0.50mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1005C-5N6
0.0056
D
0.4
8
100/0.250
5.100
22
0.039 [1.0mm]
0.020 [0.50mm]
0.020 [0.50mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1005C-6N2
0.0062
D
0.4
8
100/0.250
4.700
24
0.039 [1.0mm]
0.020 [0.50mm]
0.020 [0.50mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1005C-6N8
0.0068
H,J
0.4
8
100/0.250
4.500
24
0.039 [1.0mm]
0.020 [0.50mm]
0.020 [0.50mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1005C-8N2
0.0082
H,J
0.4
8
100/0.250
4.100
26
0.039 [1.0mm]
0.020 [0.50mm]
0.020 [0.50mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1005C-10N
0.01
H,J
0.4
8
100/0.250
4.000
3
0.039 [1.0mm]
0.020 [0.50mm]
0.020 [0.50mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1005C-12N
0.012
H,J
0.4
8
100/0.250
3.600
3
0.039 [1.0mm]
0.020 [0.50mm]
0.020 [0.50mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1005C-15N
0.015
H,J
0.4
8
100/0.250
3.200
34
0.039 [1.0mm]
0.020 [0.50mm]
0.020 [0.50mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1005C-18N
0.018
H,J
0.4
8
100/0.250
2.800
39
0.039 [1.0mm]
0.020 [0.50mm]
0.020 [0.50mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1005C-22N
0.022
H,J
0.4
8
100/0.250
2.500
39
0.039 [1.0mm]
0.020 [0.50mm]
0.020 [0.50mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1005C-27N
0.027
H,J
0.2
8
100/0.250
2.200
56
0.039 [1.0mm]
0.020 [0.50mm]
0.020 [0.50mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1005C-39N
0.039
H,J
0.15
8
100/0.250
1.700
12
0.039 [1.0mm]
0.020 [0.50mm]
0.020 [0.50mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1005C-56N
0.056
H,J
0.15
8
100/0.250
1.300
13
0.039 [1.0mm]
0.020 [0.50mm]
0.020 [0.50mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1005C-68N
0.068
H,J
0.1
8
100/0.250
1.100
15
0.039 [1.0mm]
0.020 [0.50mm]
0.020 [0.50mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1005C-75N
0.075
H,J
0.1
8
100/0.250
1.080
15
0.039 [1.0mm]
0.020 [0.50mm]
0.020 [0.50mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1005C-85N
0.082
H,J
0.1
8
100/0.250
1.000
16
0.039 [1.0mm]
0.020 [0.50mm]
0.020 [0.50mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1005C-R10
0.1
H,J
0.1
8
100/0.250
900
18
0.039 [1.0mm]
0.020 [0.50mm]
0.020 [0.50mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1005C-R12
0.12
H,J
0.1
8
100/0.250
700
35
0.039 [1.0mm]
0.020 [0.50mm]
0.020 [0.50mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1005C-R15
0.15
H,J
0.1
8
100/0.250
600
35
0.039 [1.0mm]
0.020 [0.50mm]
0.020 [0.50mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1005C-R22
0.22
H,J
0.1
8
100/0.250
300
4
0.039 [1.0mm]
0.020 [0.50mm]
0.020 [0.50mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1005C-R27
0.27
H,J
0.1
8
100/0.250
500
48
0.039 [1.0mm]
0.020 [0.50mm]
0.020 [0.50mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1608C-1N0
0.001
D
0.1
8
100/0.250
10.000
6
0.063 [1.6mm]
0.032 [0.80mm]
0.032 [0.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1608C-1N2
0.0012
D
0.1
8
100/0.250
10.000
6
0.063 [1.6mm]
0.032 [0.80mm]
0.032 [0.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1608C-1N5
0.0015
D
0.1
8
100/0.250
8.000
6
0.063 [1.6mm]
0.032 [0.80mm]
0.032 [0.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1608C-1N8
0.0018
D
0.1
8
100/0.250
8.000
6
0.063 [1.6mm]
0.032 [0.80mm]
0.032 [0.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1608C-2N2
0.0022
D
0.1
8
100/0.250
7.200
6
0.063 [1.6mm]
0.032 [0.80mm]
0.032 [0.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1608C-2N7
0.0027
D
0.1
10
100/0.250
6.200
6
0.063 [1.6mm]
0.032 [0.80mm]
0.032 [0.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1608C-3N3
0.0033
D
0.12
10
100/0.250
5.200
6
0.063 [1.6mm]
0.032 [0.80mm]
0.032 [0.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1608C-3N9
0.0039
D
0.14
10
100/0.250
5.000
6
0.063 [1.6mm]
0.032 [0.80mm]
0.032 [0.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1608C-4N7
0.0047
D
0.16
10
100/0.250
4.750
6
0.063 [1.6mm]
0.032 [0.80mm]
0.032 [0.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1608C-5N6
0.0056
D
0.18
10
100/0.250
4.100
6
0.063 [1.6mm]
0.032 [0.80mm]
0.032 [0.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1608C-6N8
0.0068
H,J
0.22
10
100/0.250
3.750
6
0.063 [1.6mm]
0.032 [0.80mm]
0.032 [0.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1608C-8N2
0.0082
H,J
0.24
10
100/0.250
3.300
6
0.063 [1.6mm]
0.032 [0.80mm]
0.032 [0.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1608C-10N
0.01
H,J
0.26
12
100/0.250
3.000
6
0.063 [1.6mm]
0.032 [0.80mm]
0.032 [0.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1608C-12N
0.012
H,J
0.28
12
100/0.250
2.600
6
0.063 [1.6mm]
0.032 [0.80mm]
0.032 [0.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1608C-15N
0.015
H,J
0.32
12
100/0.250
2.500
6
0.063 [1.6mm]
0.032 [0.80mm]
0.032 [0.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1608C-18N
0.018
H,J
0.35
12
100/0.250
2.400
6
0.063 [1.6mm]
0.032 [0.80mm]
0.032 [0.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1608C-22N
0.022
H,J
0.4
12
100/0.250
2.000
5
0.063 [1.6mm]
0.032 [0.80mm]
0.032 [0.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1608C-27N
0.027
H,J
0.45
12
100/0.250
1.900
5
0.063 [1.6mm]
0.032 [0.80mm]
0.032 [0.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1608C-33N
0.033
H,J
0.55
12
100/0.250
1.600
4
0.063 [1.6mm]
0.032 [0.80mm]
0.032 [0.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1608C-39N
0.039
H,J
0.6
12
100/0.250
1.400
4
0.063 [1.6mm]
0.032 [0.80mm]
0.032 [0.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1608C-47N
0.047
H,J
0.7
12
100/0.250
1.300
4
0.063 [1.6mm]
0.032 [0.80mm]
0.032 [0.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1608C-56N
0.056
H,J
0.75
12
100/0.250
1.100
4
0.063 [1.6mm]
0.032 [0.80mm]
0.032 [0.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1608C-62N
0.062
H,J
0.85
12
100/0.250
1.050
4
0.063 [1.6mm]
0.032 [0.80mm]
0.032 [0.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1608C-68N
0.068
H,J
0.85
12
100/0.250
1.050
4
0.063 [1.6mm]
0.032 [0.80mm]
0.032 [0.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1608C-82N
0.082
H,J
1
12
100/0.250
900
3
0.063 [1.6mm]
0.032 [0.80mm]
0.032 [0.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1608C-R10
0.1
H,J
1.2
12
100/0.250
770
3
0.063 [1.6mm]
0.032 [0.80mm]
0.032 [0.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1608C-R12
0.12
H,J
1.3
8
100/0.250
850
3
0.063 [1.6mm]
0.032 [0.80mm]
0.032 [0.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1608C-R15
0.15
H,J
1.7
8
100/0.250
550
25
0.063 [1.6mm]
0.032 [0.80mm]
0.032 [0.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1608C-R18
0.18
H,J
1.9
8
100/0.250
520
25
0.063 [1.6mm]
0.032 [0.80mm]
0.032 [0.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLCL1608C-R22
0.22
H,J
2
8
100/0.250
500
25
0.063 [1.6mm]
0.032 [0.80mm]
0.032 [0.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -55°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1000 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 265°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
CMWC0603-220
22
K, S
0.08
5
0.063 [1.6mm]
0.033 [0.84mm]
0.043 [1.09mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +85°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Burn-In: Temperature +85°C, 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 60 seconds.Part impedance shall be within +/- 20% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 80% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part impedance shall be within +/- 20% from initial impedance and no body damage.
CMWC0603-450
45
K, S
0.11
5
0.063 [1.6mm]
0.033 [0.84mm]
0.043 [1.09mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +85°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Burn-In: Temperature +85°C, 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 60 seconds.Part impedance shall be within +/- 20% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 80% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part impedance shall be within +/- 20% from initial impedance and no body damage.
CMWC0603-900
90
K, S
0.145
5
0.063 [1.6mm]
0.033 [0.84mm]
0.043 [1.09mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +85°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Burn-In: Temperature +85°C, 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 60 seconds.Part impedance shall be within +/- 20% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 80% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part impedance shall be within +/- 20% from initial impedance and no body damage.
CMWC0603-121
120
K, S
0.175
5
0.063 [1.6mm]
0.033 [0.84mm]
0.043 [1.09mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +85°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Burn-In: Temperature +85°C, 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 60 seconds.Part impedance shall be within +/- 20% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 80% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part impedance shall be within +/- 20% from initial impedance and no body damage.
CMWC0603-181
180
K, S
0.21
5
0.063 [1.6mm]
0.033 [0.84mm]
0.043 [1.09mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +85°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Burn-In: Temperature +85°C, 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 60 seconds.Part impedance shall be within +/- 20% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 80% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part impedance shall be within +/- 20% from initial impedance and no body damage.
CMWC0603-251
250
K, S
0.28
4
0.063 [1.6mm]
0.033 [0.84mm]
0.043 [1.09mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +85°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Burn-In: Temperature +85°C, 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 60 seconds.Part impedance shall be within +/- 20% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 80% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part impedance shall be within +/- 20% from initial impedance and no body damage.
CMWC0805-300
30
K, S
0.2
5
0.081 [2.05mm]
0.049 [1.25mm]
0.047 [1.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +85°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Burn-In: Temperature +85°C, 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 60 seconds.Part impedance shall be within +/- 20% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 80% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part impedance shall be within +/- 20% from initial impedance and no body damage.
CMWC0805-670
67
K, S
0.25
4
0.081 [2.05mm]
0.049 [1.25mm]
0.047 [1.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +85°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Burn-In: Temperature +85°C, 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 60 seconds.Part impedance shall be within +/- 20% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 80% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part impedance shall be within +/- 20% from initial impedance and no body damage.
CMWC0805-900
90
K, S
0.35
33
0.081 [2.05mm]
0.049 [1.25mm]
0.047 [1.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +85°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Burn-In: Temperature +85°C, 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 60 seconds.Part impedance shall be within +/- 20% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 80% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part impedance shall be within +/- 20% from initial impedance and no body damage.
CMWC0805-121
120
K, S
0.3
37
0.081 [2.05mm]
0.049 [1.25mm]
0.047 [1.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +85°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Burn-In: Temperature +85°C, 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 60 seconds.Part impedance shall be within +/- 20% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 80% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part impedance shall be within +/- 20% from initial impedance and no body damage.
CMWC0805-161
160
K, S
0.35
33
0.081 [2.05mm]
0.049 [1.25mm]
0.047 [1.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +85°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Burn-In: Temperature +85°C, 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 60 seconds.Part impedance shall be within +/- 20% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 80% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part impedance shall be within +/- 20% from initial impedance and no body damage.
CMWC0805-181
180
K, S
0.35
33
0.081 [2.05mm]
0.049 [1.25mm]
0.047 [1.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +85°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Burn-In: Temperature +85°C, 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 60 seconds.Part impedance shall be within +/- 20% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 80% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part impedance shall be within +/- 20% from initial impedance and no body damage.
CMWC0805-201
200
K, S
0.35
33
0.081 [2.05mm]
0.049 [1.25mm]
0.047 [1.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +85°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Burn-In: Temperature +85°C, 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 60 seconds.Part impedance shall be within +/- 20% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 80% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part impedance shall be within +/- 20% from initial impedance and no body damage.
CMWC0805-221
220
K, S
0.35
33
0.081 [2.05mm]
0.049 [1.25mm]
0.047 [1.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +85°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Burn-In: Temperature +85°C, 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 60 seconds.Part impedance shall be within +/- 20% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 80% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part impedance shall be within +/- 20% from initial impedance and no body damage.
CMWC0805-261
260
K, S
0.4
3
0.081 [2.05mm]
0.049 [1.25mm]
0.047 [1.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +85°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Burn-In: Temperature +85°C, 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 60 seconds.Part impedance shall be within +/- 20% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 80% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part impedance shall be within +/- 20% from initial impedance and no body damage.
CMWC0805-301
300
K, S
0.45
28
0.081 [2.05mm]
0.049 [1.25mm]
0.047 [1.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +85°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Burn-In: Temperature +85°C, 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 60 seconds.Part impedance shall be within +/- 20% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 80% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part impedance shall be within +/- 20% from initial impedance and no body damage.
CMWC0805-361
360
K, S
0.45
28
0.081 [2.05mm]
0.049 [1.25mm]
0.047 [1.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +85°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Burn-In: Temperature +85°C, 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 60 seconds.Part impedance shall be within +/- 20% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 80% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part impedance shall be within +/- 20% from initial impedance and no body damage.
CMWC0805-371
370
K, S
0.45
25
0.081 [2.05mm]
0.049 [1.25mm]
0.047 [1.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +85°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Burn-In: Temperature +85°C, 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 60 seconds.Part impedance shall be within +/- 20% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 80% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part impedance shall be within +/- 20% from initial impedance and no body damage.
CMWC0805-501
500
K, S
0.6
25
0.081 [2.05mm]
0.049 [1.25mm]
0.047 [1.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +85°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Burn-In: Temperature +85°C, 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 60 seconds.Part impedance shall be within +/- 20% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 80% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part impedance shall be within +/- 20% from initial impedance and no body damage.
CMWC0805-671
670
K, S
0.65
23
0.081 [2.05mm]
0.049 [1.25mm]
0.047 [1.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +85°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Burn-In: Temperature +85°C, 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 60 seconds.Part impedance shall be within +/- 20% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 80% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part impedance shall be within +/- 20% from initial impedance and no body damage.
CMWC0805H-670
67
K, S
0.35
33
0.079 [2.00mm]
0.047 [1.20mm]
0.039 [1.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +85°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Burn-In: Temperature +85°C, 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 60 seconds.Part impedance shall be within +/- 20% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 80% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part impedance shall be within +/- 20% from initial impedance and no body damage.
CMWC0805H-90
90
K, S
0.4
3
0.079 [2.00mm]
0.047 [1.20mm]
0.039 [1.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +85°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Burn-In: Temperature +85°C, 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 60 seconds.Part impedance shall be within +/- 20% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 80% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part impedance shall be within +/- 20% from initial impedance and no body damage.
CMWC0805H-121
120
K, S
0.45
28
0.079 [2.00mm]
0.047 [1.20mm]
0.039 [1.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +85°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Burn-In: Temperature +85°C, 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 60 seconds.Part impedance shall be within +/- 20% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 80% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part impedance shall be within +/- 20% from initial impedance and no body damage.
CMWC0805H-181
180
K, S
0.5
25
0.079 [2.00mm]
0.047 [1.20mm]
0.039 [1.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +85°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Burn-In: Temperature +85°C, 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 60 seconds.Part impedance shall be within +/- 20% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 80% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part impedance shall be within +/- 20% from initial impedance and no body damage.
CMWC1206-900
90
K, S
0.3
37
0.126 [3.2mm]
0.063 [1.6mm]
0.075 [1.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +85°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Burn-In: Temperature +85°C, 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 60 seconds.Part impedance shall be within +/- 20% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 80% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part impedance shall be within +/- 20% from initial impedance and no body damage.
CMWC1206-161
160
K, S
0.4
34
0.126 [3.2mm]
0.063 [1.6mm]
0.075 [1.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +85°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Burn-In: Temperature +85°C, 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 60 seconds.Part impedance shall be within +/- 20% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 80% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part impedance shall be within +/- 20% from initial impedance and no body damage.
CMWC1206-261
260
K, S
0.5
31
0.126 [3.2mm]
0.063 [1.6mm]
0.075 [1.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +85°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Burn-In: Temperature +85°C, 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 60 seconds.Part impedance shall be within +/- 20% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 80% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part impedance shall be within +/- 20% from initial impedance and no body damage.
CMWC1206-601
600
K, S
0.8
26
0.126 [3.2mm]
0.063 [1.6mm]
0.075 [1.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +85°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Burn-In: Temperature +85°C, 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 60 seconds.Part impedance shall be within +/- 20% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 80% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part impedance shall be within +/- 20% from initial impedance and no body damage.
CMWC1206-102
1000
K, S
1
23
0.126 [3.2mm]
0.063 [1.6mm]
0.075 [1.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +85°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Burn-In: Temperature +85°C, 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 60 seconds.Part impedance shall be within +/- 20% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 80% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part impedance shall be within +/- 20% from initial impedance and no body damage.
CMWC1206-222
2200
K, S
1.2
2
0.126 [3.2mm]
0.063 [1.6mm]
0.075 [1.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +85°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Burn-In: Temperature +85°C, 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 60 seconds.Part impedance shall be within +/- 20% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 80% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part impedance shall be within +/- 20% from initial impedance and no body damage.
CMWC3225-220
22
800
Z, N, V, M
0.4
4
0.126 [3.2mm]
0.098 [2.5mm]
0.095 [2.4mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +85°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Burn-In: Temperature +85°C, 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 60 seconds.Part impedance shall be within +/- 20% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 80% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part impedance shall be within +/- 20% from initial impedance and no body damage.
CMWC3225-510
51
2600
Z, N, V, M
1.5
3
0.126 [3.2mm]
0.098 [2.5mm]
0.095 [2.4mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +85°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Burn-In: Temperature +85°C, 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 60 seconds.Part impedance shall be within +/- 20% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 80% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part impedance shall be within +/- 20% from initial impedance and no body damage.
CMWC3225-101
100
5200
Z, N, V, M
3.3
15
0.126 [3.2mm]
0.098 [2.5mm]
0.095 [2.4mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +85°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Burn-In: Temperature +85°C, 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 60 seconds.Part impedance shall be within +/- 20% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 80% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part impedance shall be within +/- 20% from initial impedance and no body damage.
CMWC4532-201
200
10000
Z, N, V, M
4.5
11
0.177 [4.5mm]
0.126 [3.2mm]
0.118 [3.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +85°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Burn-In: Temperature +85°C, 96 hours. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 60 seconds.Part impedance shall be within +/- 20% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 80% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 20% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part impedance shall be within +/- 20% from initial impedance and no body damage.
CMFC1260-701
9
700
0.006
8
0.473 [12.0mm]
0.433 [11.0mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
• Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: Temperature +125°C, 1000 hours, rated current. Part inductance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 6X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 60 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Low Temperature Exposure: MIL-STD-202, Method 108, -40°C for 1000 hours. Part impedance shall be within +/- 50% from initial impedance and no body damage.
CMFC1260-102
12.5
1000
0.014
6
0.473 [12.0mm]
0.433 [11.0mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
• Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: Temperature +125°C, 1000 hours, rated current. Part inductance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 6X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 60 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Low Temperature Exposure: MIL-STD-202, Method 108, -40°C for 1000 hours. Part impedance shall be within +/- 50% from initial impedance and no body damage.
CMFC1560-701
7.5
700
0.01
5
0.354 [9.0mm]
0.276 [7.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
• Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: Temperature +125°C, 1000 hours, rated current. Part inductance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 6X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 60 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Low Temperature Exposure: MIL-STD-202, Method 108, -40°C for 1000 hours. Part impedance shall be within +/- 50% from initial impedance and no body damage.
CMFC7035-301
4
300
0.01
5
0.275 [7.0mm]
0.236 [6.0mm]
0.138 [3.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
• Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: Temperature +125°C, 1000 hours, rated current. Part inductance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 6X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 60 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Low Temperature Exposure: MIL-STD-202, Method 108, -40°C for 1000 hours. Part impedance shall be within +/- 50% from initial impedance and no body damage.
CMFC7035-701
7
700
0.015
4
0.275 [7.0mm]
0.236 [6.0mm]
0.138 [3.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
• Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: Temperature +125°C, 1000 hours, rated current. Part inductance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 6X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 60 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Low Temperature Exposure: MIL-STD-202, Method 108, -40°C for 1000 hours. Part impedance shall be within +/- 50% from initial impedance and no body damage.
CMFC7035-102
7.9
1000
0.023
3
0.275 [7.0mm]
0.236 [6.0mm]
0.138 [3.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
• Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: Temperature +125°C, 1000 hours, rated current. Part inductance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 6X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 60 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Low Temperature Exposure: MIL-STD-202, Method 108, -40°C for 1000 hours. Part impedance shall be within +/- 50% from initial impedance and no body damage.
CMFC7035-132
10.4
1300
0.025
25
0.275 [7.0mm]
0.236 [6.0mm]
0.138 [3.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
• Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: Temperature +125°C, 1000 hours, rated current. Part inductance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 6X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 60 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Low Temperature Exposure: MIL-STD-202, Method 108, -40°C for 1000 hours. Part impedance shall be within +/- 50% from initial impedance and no body damage.
CMFC7035-302
22.6
3000
0.072
12
0.275 [7.0mm]
0.236 [6.0mm]
0.138 [3.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
• Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: Temperature +125°C, 1000 hours, rated current. Part inductance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 6X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 60 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Low Temperature Exposure: MIL-STD-202, Method 108, -40°C for 1000 hours. Part impedance shall be within +/- 50% from initial impedance and no body damage.
CMFC9045-701
7.5
700
0.01
5
0.354 [9.0mm]
0.276 [7.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
• Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: Temperature +125°C, 1000 hours, rated current. Part inductance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 6X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 60 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Low Temperature Exposure: MIL-STD-202, Method 108, -40°C for 1000 hours. Part impedance shall be within +/- 50% from initial impedance and no body damage.
MLFL1608C-R50
0.5
M, K, J
0.9
100
15
0.063 [1.6mm]
0.032 [0.80mm]
0.037 [0.95mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +105°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 105°C for 1008 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -40°C for 1008 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +105°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1008 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55-10Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 235°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLFL1608C-1R0
1
M, K, J
0.75
60
2
0.063 [1.6mm]
0.032 [0.80mm]
0.037 [0.95mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +105°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 105°C for 1008 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -40°C for 1008 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +105°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1008 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55-10Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 235°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLFL1608C-2R2
2.2
M, K, J
0.65
40
3
0.063 [1.6mm]
0.032 [0.80mm]
0.037 [0.95mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +105°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 105°C for 1008 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -40°C for 1008 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +105°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1008 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55-10Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 235°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLFL2012C-1R0
1
M, K, J
0.14
50
1
0.079 [2.0mm]
0.049 [1.25mm]
0.039 [1.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +105°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 105°C for 1008 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -40°C for 1008 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +105°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1008 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55-10Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 235°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLFL2012C-1R5
1.5
M, K, J
0.2
50
8
0.079 [2.0mm]
0.049 [1.25mm]
0.039 [1.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +105°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 105°C for 1008 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -40°C for 1008 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +105°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1008 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55-10Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 235°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLFL2012C-2R2
2.2
M, K, J
0.2
50
8
0.079 [2.0mm]
0.049 [1.25mm]
0.039 [1.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +105°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 105°C for 1008 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -40°C for 1008 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +105°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1008 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55-10Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 235°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLFL2012C-3R3
3.3
M, K, J
0.24
40
7
0.079 [2.0mm]
0.049 [1.25mm]
0.039 [1.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +105°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 105°C for 1008 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -40°C for 1008 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +105°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1008 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55-10Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 235°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLFL2012C-4R7
4.7
M, K, J
0.28
30
7
0.079 [2.0mm]
0.049 [1.25mm]
0.039 [1.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +105°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 105°C for 1008 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -40°C for 1008 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +105°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1008 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55-10Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 235°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLFL2016C-1R0
1
M, K, J
1.3
70
12
0.079 [2.0mm]
0.063 [1.60mm]
0.039 [1.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +105°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 105°C for 1008 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -40°C for 1008 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +105°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1008 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55-10Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 235°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLFL2016C-1R5
1.5
M, K, J
1.2
50
13
0.079 [2.0mm]
0.063 [1.60mm]
0.039 [1.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +105°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 105°C for 1008 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -40°C for 1008 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +105°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1008 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55-10Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 235°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLFL2016C-2R2
2.2
M, K, J
1.2
50
14
0.079 [2.0mm]
0.063 [1.60mm]
0.039 [1.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +105°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 105°C for 1008 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -40°C for 1008 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +105°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1008 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55-10Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 235°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLFL2016C-3R3
3.3
M, K, J
1.1
40
16
0.079 [2.0mm]
0.063 [1.60mm]
0.039 [1.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +105°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 105°C for 1008 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -40°C for 1008 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +105°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1008 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55-10Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 235°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
MLFL2016C-4R7
4.7
M, K, J
0.9
20
2
0.079 [2.0mm]
0.063 [1.60mm]
0.039 [1.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +105°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 105°C for 1008 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -40°C for 1008 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -55°C to +105°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 40°C, 1008 hours, humidity 95%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55-10Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 6 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 235°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
LPPL3818-1R0
1
N, M, K
0.037
165
2.1
36
0.150 [3.80mm]
0.150 [3.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL3818-1R5
1.5
N, M, K
0.047
125
1.6
31
0.150 [3.80mm]
0.150 [3.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL3818-2R2
2.2
N, M, K
0.06
95
1.4
26
0.150 [3.80mm]
0.150 [3.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL3818-2R7
2.7
N, M, K
0.065
90
1.3
25
0.150 [3.80mm]
0.150 [3.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL3818-3R3
3.3
N, M, K
0.085
75
1.15
21
0.150 [3.80mm]
0.150 [3.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL3818-3R9
3.9
N, M, K
0.105
70
1
2
0.150 [3.80mm]
0.150 [3.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL3818-4R7
4.7
N, M, K
0.12
60
0.95
19
0.150 [3.80mm]
0.150 [3.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL3818-6R8
6.8
N, M, K
0.16
50
0.8
16
0.150 [3.80mm]
0.150 [3.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL3818-100
10
N, M, K
0.235
40
0.65
13
0.150 [3.80mm]
0.150 [3.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL3818-150
15
N, M, K
0.34
30
0.55
105
0.150 [3.80mm]
0.150 [3.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL3818-220
22
N, M, K
0.5
25
0.43
8
0.150 [3.80mm]
0.150 [3.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL3818-330
33
N, M, K
0.74
20
0.34
65
0.150 [3.80mm]
0.150 [3.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL3818-470
47
N, M, K
1.03
15
0.3
56
0.150 [3.80mm]
0.150 [3.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL3818-680
68
N, M, K
1.6
13
0.24
48
0.150 [3.80mm]
0.150 [3.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL3818-101
100
N, M, K
2.6
11
0.2
34
0.150 [3.80mm]
0.150 [3.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL3818-221
220
N, M, K
5.7
6
0.16
26
0.150 [3.80mm]
0.150 [3.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL3828-3R3
3.3
N, M, K
0.048
64
1.7
25
0.150 [3.80mm]
0.150 [3.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL3828-4R7
4.7
N, M, K
0.066
55
1.48
24
0.150 [3.80mm]
0.150 [3.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL3828-6R8
6.8
N, M, K
0.11
36
1.16
16
0.150 [3.80mm]
0.150 [3.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL3828-100
10
N, M, K
0.154
27
0.95
15
0.150 [3.80mm]
0.150 [3.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL3828-150
15
N, M, K
0.2
23
0.8
13
0.150 [3.80mm]
0.150 [3.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL3828-220
22
N, M, K
0.33
20
0.68
1
0.150 [3.80mm]
0.150 [3.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL3828-330
33
N, M, K
0.49
19
0.54
7
0.150 [3.80mm]
0.150 [3.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL3828-470
47
N, M, K
0.595
12
0.45
65
0.150 [3.80mm]
0.150 [3.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL3828-680
68
N, M, K
0.79
9
0.38
55
0.150 [3.80mm]
0.150 [3.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL3828-101
100
N, M, K
1.15
8
0.32
48
0.150 [3.80mm]
0.150 [3.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4818-1R0
1
N, M, K
0.025
140
3.6
51
0.189 [4.80mm]
0.189 [4.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4818-1R5
1.5
N, M, K
0.035
105
3
47
0.189 [4.80mm]
0.189 [4.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4818-2R2
2.2
N, M, K
0.045
90
2.43
33
0.189 [4.80mm]
0.189 [4.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4818-3R3
3.3
N, M, K
0.055
70
2.1
31
0.189 [4.80mm]
0.189 [4.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4818-3R9
3.9
N, M, K
0.07
65
1.9
27
0.189 [4.80mm]
0.189 [4.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4818-4R7
4.7
N, M, K
0.08
55
1.8
26
0.189 [4.80mm]
0.189 [4.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4818-5R6
5.6
N, M, K
0.09
50
1.35
23
0.189 [4.80mm]
0.189 [4.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4818-6R8
6.8
N, M, K
0.1
45
1.25
22
0.189 [4.80mm]
0.189 [4.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4818-8R2
8.2
N, M, K
0.114
40
1.15
19
0.189 [4.80mm]
0.189 [4.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4818-100
10
N, M, K
0.14
37
1.05
18
0.189 [4.80mm]
0.189 [4.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4818-120
12
N, M, K
0.17
34
0.95
16
0.189 [4.80mm]
0.189 [4.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4818-150
15
N, M, K
0.22
30
0.87
13
0.189 [4.80mm]
0.189 [4.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4818-180
18
N, M, K
0.28
28
0.79
14
0.189 [4.80mm]
0.189 [4.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4818-220
22
N, M, K
0.36
25
0.72
125
0.189 [4.80mm]
0.189 [4.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4818-270
27
N, M, K
0.4
22
0.66
115
0.189 [4.80mm]
0.189 [4.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4818-330
33
N, M, K
0.5
20
0.36
9
0.189 [4.80mm]
0.189 [4.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4818-390
39
N, M, K
0.54
17
0.53
8
0.189 [4.80mm]
0.189 [4.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4818-470
47
N, M, K
0.63
16
0.47
75
0.189 [4.80mm]
0.189 [4.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4828-1R2
1.2
N, M, K
0.024
155
3
5
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4828-1R8
1.8
N, M, K
0.03
105
2.5
46
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4828-2R7
2.7
N, M, K
0.034
80
2.2
4
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4828-3R9
3.9
N, M, K
0.047
60
1.8
34
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4828-4R7
4.7
N, M, K
0.054
50
1.6
3
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4828-6R8
6.8
N, M, K
0.074
40
1.3
26
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4828-7R4
7.4
N, M, K
0.087
38
1.28
25
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4828-8R2
8.2
N, M, K
0.087
35
1.25
24
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4828-100
10
N, M, K
0.1
30
1.1
23
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4828-120
12
N, M, K
0.125
27
0.95
2
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4828-150
15
N, M, K
0.145
25
0.92
18
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4828-180
18
N, M, K
0.16
22
0.8
17
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4828-220
22
N, M, K
0.185
20
0.68
155
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4828-270
27
N, M, K
0.24
18
0.65
145
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4828-330
33
N, M, K
0.26
15
0.6
14
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4828-390
39
N, M, K
0.265
14
0.58
13
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4828-470
47
N, M, K
0.27
13
0.47
12
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4828-560
56
N, M, K
0.32
12
0.4
105
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4828-680
68
N, M, K
0.37
11
0.38
9
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4828-820
82
N, M, K
0.48
10
0.35
85
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4828-101
100
N, M, K
0.6
85
0.33
7
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4828-121
120
N, M, K
0.76
8
0.3
65
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4828-151
150
N, M, K
0.86
7
0.28
6
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4828-181
180
N, M, K
1.08
6
0.26
55
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4828-221
220
N, M, K
1.25
55
0.24
5
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4828-271
270
N, M, K
1.7
5
0.21
45
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4828-331
330
N, M, K
1.8
45
0.2
4
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL4828-391
390
N, M, K
2.4
4
0.17
35
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5818-1R0
1
N, M, K
0.031
100
3.9
48
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5818-2R0
2
N, M, K
0.043
83
3.2
35
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5818-3R0
3
N, M, K
0.075
73
2.7
265
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5818-3R9
3.9
N, M, K
0.094
63
2.4
24
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5818-5R0
5
N, M, K
0.108
56
2.1
22
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5818-6R2
6.1
N, M, K
0.123
51
1.9
2
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5818-7R5
7.5
N, M, K
0.152
43
1.75
17
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5818-9R0
9
N, M, K
0.185
38
1.6
16
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5818-100
10
N, M, K
0.235
30
1.45
15
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5818-120
12
N, M, K
0.25
29
1.35
145
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5818-150
15
N, M, K
0.3
25
1.2
13
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5818-180
18
N, M, K
0.365
23
1.15
12
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5818-220
22
N, M, K
0.475
21
0.98
105
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5818-270
27
N, M, K
0.51
20
0.9
95
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5818-330
33
N, M, K
0.57
18
0.83
9
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5818-390
39
N, M, K
0.71
15
0.75
85
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5818-470
47
N, M, K
0.81
14
0.68
8
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5818-560
56
N, M, K
0.845
13
0.63
75
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5818-680
68
N, M, K
1.205
11
0.56
58
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5818-820
82
N, M, K
1.42
10
0.52
55
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5818-101
100
N, M, K
1.89
9
0.47
52
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5818-121
120
N, M, K
2.11
8
0.42
5
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5818-151
150
N, M, K
2.675
7
0.38
44
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5818-181
180
N, M, K
3.245
6
0.34
35
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5818-221
220
N, M, K
4.08
5
0.32
33
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5828-2R6
2.6
N, M, K
0.03
78
3.15
45
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5828-3R3
3.3
N, M, K
0.035
70
2.8
44
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5828-4R7
4.7
N, M, K
0.04
48
2.54
4
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5828-5R3
5.3
N, M, K
0.042
46
2.2
38
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5828-6R2
6.2
N, M, K
0.057
41
2.1
35
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5828-8R2
8.2
N, M, K
0.063
37
1.62
3
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5828-100
10
N, M, K
0.083
32
1.55
26
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5828-120
12
N, M, K
0.1
25
1.5
25
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5828-150
15
N, M, K
0.115
25
1.35
225
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5828-180
18
N, M, K
0.13
22
1.3
215
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5828-220
22
N, M, K
0.16
19
1.15
175
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5828-270
27
N, M, K
0.18
18
1.05
165
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5828-330
33
N, M, K
0.23
15
0.92
14
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5828-390
39
N, M, K
0.26
14
0.86
137
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5828-470
47
N, M, K
0.305
13
0.78
133
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5828-560
56
N, M, K
0.395
11
0.7
113
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5828-680
68
N, M, K
0.47
10
0.65
103
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5828-820
82
N, M, K
0.53
9
0.6
95
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5828-101
100
N, M, K
0.645
8
0.53
8
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5828-151
150
N, M, K
0.91
7
0.45
8
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5828-181
180
N, M, K
1.1
55
0.42
64
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5828-221
220
N, M, K
1.2
5
0.37
62
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5828-331
330
N, M, K
2.1
4
0.3
46
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5828-681
680
N, M, K
4.8
3
0.21
31
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL5828-102
1000
N, M, K
7.3
2
0.13
21
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6822-1R0
1
N, M, K
0.019
109
4.4
58
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6822-1R5
1.5
N, M, K
0.022
77
3.5
5
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6822-2R2
2.2
N, M, K
0.027
72
2.7
48
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6822-3R3
3.3
N, M, K
0.033
62
2.4
43
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6822-5R0
5
N, M, K
0.04
48
2
36
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6822-6R2
6.2
N, M, K
0.057
42
1.7
34
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6822-7R5
7.5
N, M, K
0.064
36
1.55
32
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6822-100
10
N, M, K
0.088
33
1.35
27
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6822-120
12
N, M, K
0.09
32
1.25
265
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6822-150
15
N, M, K
0.11
23
1.1
245
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6822-180
18
N, M, K
0.13
22
1
225
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6822-220
22
N, M, K
0.165
21
0.92
2
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6822-270
27
N, M, K
0.22
19
0.8
175
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6822-330
33
N, M, K
0.235
18
0.75
16
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6822-390
39
N, M, K
0.285
15
0.64
15
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6822-470
47
N, M, K
0.345
14
0.6
135
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6822-560
56
N, M, K
0.39
13
0.56
12
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6822-680
68
N, M, K
0.48
12
0.52
115
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6822-820
82
N, M, K
0.54
10
0.45
11
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6822-101
100
N, M, K
0.68
95
0.42
95
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6822-121
120
N, M, K
0.76
8
0.39
82
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6822-151
150
N, M, K
1.1
5
0.34
73
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6822-181
180
N, M, K
1.2
7
0.31
68
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6822-221
220
N, M, K
1.38
55
0.28
65
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6822-271
270
N, M, K
1.77
52
0.24
55
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6822-331
330
N, M, K
2
5
0.23
51
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6822-391
390
N, M, K
2.6
48
0.21
46
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6822-471
470
N, M, K
3.2
4
0.19
42
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6822-561
560
N, M, K
3.58
38
0.18
39
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6822-681
680
N, M, K
4.3
32
0.16
36
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6822-821
820
N, M, K
5.5
3
0.14
32
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6822-102
1000
N, M, K
6.85
26
0.13
28
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6828-2R5
2.5
N, M, K
0.03
77
3.4
49
0.268 [6.80mm]
0.268 [6.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6828-3R3
3.3
N, M, K
0.033
63
3
47
0.268 [6.80mm]
0.268 [6.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6828-4R3
4.3
N, M, K
0.043
55
2.6
4
0.268 [6.80mm]
0.268 [6.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6828-5R0
5
N, M, K
0.048
48
2.3
38
0.268 [6.80mm]
0.268 [6.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6828-6R4
6.4
N, M, K
0.06
42
2.1
34
0.268 [6.80mm]
0.268 [6.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6828-7R7
7.7
N, M, K
0.07
37
1.9
32
0.268 [6.80mm]
0.268 [6.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6828-100
10
N, M, K
0.084
33
1.75
29
0.268 [6.80mm]
0.268 [6.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6828-150
15
N, M, K
0.145
24
1.4
22
0.268 [6.80mm]
0.268 [6.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6828-220
22
N, M, K
0.18
20
1.15
2
0.268 [6.80mm]
0.268 [6.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6828-330
33
N, M, K
0.205
15
0.92
18
0.268 [6.80mm]
0.268 [6.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6828-470
47
N, M, K
0.29
13
8
14
0.268 [6.80mm]
0.268 [6.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6828-680
68
N, M, K
0.41
10
0.67
12
0.268 [6.80mm]
0.268 [6.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6828-101
100
N, M, K
0.055
8
0.55
1
0.268 [6.80mm]
0.268 [6.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6828-151
150
N, M, K
0.89
6
0.44
8
0.268 [6.80mm]
0.268 [6.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6828-221
220
N, M, K
1.2
55
0.36
6
0.268 [6.80mm]
0.268 [6.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6828-331
330
N, M, K
1.74
45
0.3
55
0.268 [6.80mm]
0.268 [6.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6828-471
470
N, M, K
2.54
35
0.25
45
0.268 [6.80mm]
0.268 [6.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6828-681
680
N, M, K
3.56
3
0.21
35
0.268 [6.80mm]
0.268 [6.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
LPPL6828-102
1000
N, M, K
4.48
25
0.17
3
0.268 [6.80mm]
0.268 [6.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1205-2R5
2.5
M,K,J
0.024
5
0.500 [12.7mm]
0.500 [12.7mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1205-5R0
5
M,K,J
0.035
4
0.500 [12.7mm]
0.500 [12.7mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1205-7R5
7.5
M,K,J
0.04
35
0.500 [12.7mm]
0.500 [12.7mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1205-100
10
M,K,J
0.054
3
0.500 [12.7mm]
0.500 [12.7mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1205-120
12
M,K,J
0.065
28
0.500 [12.7mm]
0.500 [12.7mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1205-150
15
M,K,J
0.07
27
0.500 [12.7mm]
0.500 [12.7mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1205-180
18
M,K,J
0.082
26
0.500 [12.7mm]
0.500 [12.7mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1205-220
22
M,K,J
0.095
24
0.500 [12.7mm]
0.500 [12.7mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1205-250
25
M,K,J
0.12
2
0.500 [12.7mm]
0.500 [12.7mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1205-330
33
M,K,J
0.145
18
0.500 [12.7mm]
0.500 [12.7mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1205-390
39
M,K,J
0.16
165
0.500 [12.7mm]
0.500 [12.7mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1205-500
50
M,K,J
0.2
15
0.500 [12.7mm]
0.500 [12.7mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1205-560
56
M,K,J
0.24
14
0.500 [12.7mm]
0.500 [12.7mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1205-680
68
M,K,J
0.28
13
0.500 [12.7mm]
0.500 [12.7mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1205-750
75
M,K,J
0.33
12
0.500 [12.7mm]
0.500 [12.7mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1205-101
100
M,K,J
0.4
1
0.500 [12.7mm]
0.500 [12.7mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1205-121
120
M,K,J
0.5
9
0.500 [12.7mm]
0.500 [12.7mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1205-151
150
M,K,J
0.58
8
0.500 [12.7mm]
0.500 [12.7mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1205-181
180
M,K,J
0.75
7
0.500 [12.7mm]
0.500 [12.7mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1205-221
220
M,K,J
0.84
65
0.500 [12.7mm]
0.500 [12.7mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1205-271
270
M,K,J
1
6
0.500 [12.7mm]
0.500 [12.7mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1205-331
330
M,K,J
1.34
54
0.500 [12.7mm]
0.500 [12.7mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1205-391
390
M,K,J
1.5
5
0.500 [12.7mm]
0.500 [12.7mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1205-471
470
M,K,J
1.98
45
0.500 [12.7mm]
0.500 [12.7mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1205-561
560
M,K,J
2.2
4
0.500 [12.7mm]
0.500 [12.7mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1205-681
680
M,K,J
2.4
35
0.500 [12.7mm]
0.500 [12.7mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1206-821
820
M,K,J
3
3
0.500 [12.7mm]
0.500 [12.7mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1206-2R5
2.5
M,K,J
0.016
62
0.500 [12.7mm]
0.500 [12.7mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1206-5R0
5
M,K,J
0.022
47
0.500 [12.7mm]
0.500 [12.7mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1206-7R5
7.5
M,K,J
0.025
38
0.500 [12.7mm]
0.500 [12.7mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1206-100
10
M,K,J
0.035
33
0.500 [12.7mm]
0.500 [12.7mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1206-120
12
M,K,J
0.038
3
0.500 [12.7mm]
0.500 [12.7mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1206-150
15
M,K,J
0.042
28
0.500 [12.7mm]
0.500 [12.7mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1206-180
18
M,K,J
0.05
25
0.500 [12.7mm]
0.500 [12.7mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1206-220
22
M,K,J
0.052
23
0.500 [12.7mm]
0.500 [12.7mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1206-270
27
M,K,J
0.068
2
0.500 [12.7mm]
0.500 [12.7mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1206-330
33
M,K,J
0.09
19
0.500 [12.7mm]
0.500 [12.7mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1206-390
39
M,K,J
0.1
175
0.500 [12.7mm]
0.500 [12.7mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1206-470
47
M,K,J
0.13
16
0.500 [12.7mm]
0.500 [12.7mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1206-560
56
M,K,J
0.155
145
0.500 [12.7mm]
0.500 [12.7mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1206-680
68
M,K,J
0.17
13
0.500 [12.7mm]
0.500 [12.7mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1206-820
82
M,K,J
0.185
12
0.500 [12.7mm]
0.500 [12.7mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1206-101
100
M,K,J
0.22
11
0.500 [12.7mm]
0.500 [12.7mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1206-121
120
M,K,J
0.26
1
0.500 [12.7mm]
0.500 [12.7mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1206-151
150
M,K,J
0.32
9
0.500 [12.7mm]
0.500 [12.7mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1206-181
180
M,K,J
0.38
8
0.500 [12.7mm]
0.500 [12.7mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1206-221
220
M,K,J
0.46
7
0.500 [12.7mm]
0.500 [12.7mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1206-271
270
M,K,J
0.52
65
0.500 [12.7mm]
0.500 [12.7mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1206-331
330
M,K,J
0.66
6
0.500 [12.7mm]
0.500 [12.7mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1206-391
390
M,K,J
0.87
55
0.500 [12.7mm]
0.500 [12.7mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1206-471
470
M,K,J
0.97
5
0.500 [12.7mm]
0.500 [12.7mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1206-561
560
M,K,J
1.32
45
0.500 [12.7mm]
0.500 [12.7mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1206-681
680
M,K,J
1.5
4
0.500 [12.7mm]
0.500 [12.7mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1206-821
820
M,K,J
1.7
35
0.500 [12.7mm]
0.500 [12.7mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1206-102
1000
M,K,J
2.3
3
0.500 [12.7mm]
0.500 [12.7mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1206-122
1200
M,K,J
2.65
25
0.500 [12.7mm]
0.500 [12.7mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1206-152
1500
M,K,J
3.5
2
0.500 [12.7mm]
0.500 [12.7mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1208-2R5
2.5
M,K,J
0.0114
78
0.500 [12.7mm]
0.500 [12.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1208-4R5
4.5
M,K,J
0.014
68
0.500 [12.7mm]
0.500 [12.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1208-6R5
6.5
M,K,J
0.018
65
0.500 [12.7mm]
0.500 [12.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1208-100
10
M,K,J
0.021
54
0.500 [12.7mm]
0.500 [12.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1208-120
12
M,K,J
0.025
49
0.500 [12.7mm]
0.500 [12.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1208-150
15
M,K,J
0.036
45
0.500 [12.7mm]
0.500 [12.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1208-180
18
M,K,J
0.04
39
0.500 [12.7mm]
0.500 [12.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1208-220
22
M,K,J
0.043
36
0.500 [12.7mm]
0.500 [12.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1208-270
27
M,K,J
0.048
34
0.500 [12.7mm]
0.500 [12.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1208-330
33
M,K,J
0.062
3
0.500 [12.7mm]
0.500 [12.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1208-390
39
M,K,J
0.076
27
0.500 [12.7mm]
0.500 [12.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1208-470
47
M,K,J
0.085
25
0.500 [12.7mm]
0.500 [12.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1208-560
56
M,K,J
0.11
23
0.500 [12.7mm]
0.500 [12.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1208-680
68
M,K,J
0.135
21
0.500 [12.7mm]
0.500 [12.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1208-820
82
M,K,J
0.15
19
0.500 [12.7mm]
0.500 [12.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1208-101
100
M,K,J
0.17
17
0.500 [12.7mm]
0.500 [12.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1208-121
120
M,K,J
0.19
15
0.500 [12.7mm]
0.500 [12.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1208-151
150
M,K,J
0.24
14
0.500 [12.7mm]
0.500 [12.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1208-181
180
M,K,J
0.27
13
0.500 [12.7mm]
0.500 [12.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1208-221
220
M,K,J
0.38
11
0.500 [12.7mm]
0.500 [12.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1208-271
270
M,K,J
0.4
1
0.500 [12.7mm]
0.500 [12.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1208-331
330
M,K,J
0.65
9
0.500 [12.7mm]
0.500 [12.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1208-391
390
M,K,J
0.67
85
0.500 [12.7mm]
0.500 [12.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1208-471
470
M,K,J
0.85
8
0.500 [12.7mm]
0.500 [12.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1208-561
560
M,K,J
0.9
7
0.500 [12.7mm]
0.500 [12.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1208-681
680
M,K,J
1
65
0.500 [12.7mm]
0.500 [12.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1208-821
820
M,K,J
1.15
6
0.500 [12.7mm]
0.500 [12.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1208-102
1000
M,K,J
1.65
55
0.500 [12.7mm]
0.500 [12.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1208-122
1200
M,K,J
2
4
0.500 [12.7mm]
0.500 [12.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1208-152
1500
M,K,J
2.35
36
0.500 [12.7mm]
0.500 [12.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1240-100
10
M,K,J
0.032
17
2.52
27
4
4
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1240-120
12
M,K,J
0.038
16
2.52
25
3.6
38
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1240-150
15
M,K,J
0.047
16
2.52
22
3.2
35
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1240-180
18
M,K,J
0.055
14
2.52
20
3
32
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1240-220
22
M,K,J
0.0675
18
2.52
16
2.6
3
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1240-270
27
M,K,J
0.085
16
2.52
155
2.35
255
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1240-330
33
M,K,J
0.097
19
2.52
15
2.1
23
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1240-390
39
M,K,J
0.12
14
2.52
14
2
2.115
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1240-470
47
M,K,J
0.135
19
2.52
13
1.8
2
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1240-560
56
M,K,J
0.17
16
2.52
12
1.65
18
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1240-680
68
M,K,J
0.2
19
2.52
11
1.5
15
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1240-820
82
M,K,J
0.25
16
2.52
10
1.35
135
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1240-101
100
M,K,J
0.3
14
0.796
8
1.2
125
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1240-121
120
M,K,J
0.37
12
0.796
78
1.15
12
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1240-151
150
M,K,J
0.44
12
0.796
75
1.05
11
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1240-181
180
M,K,J
0.55
12
0.796
7
0.95
98
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1240-221
220
M,K,J
0.6
12
0.796
66
0.9
92
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1240-271
270
M,K,J
0.78
10
0.796
6
0.8
8
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1240-331
330
M,K,J
0.95
12
0.796
55
0.75
75
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1240-391
390
M,K,J
1.15
12
0.796
5
0.65
7
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1240-471
470
M,K,J
1.35
12
0.796
45
0.6
62
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1240-561
560
M,K,J
1.5
12
0.796
4
0.52
55
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1240-681
680
M,K,J
2
14
0.796
38
0.48
5
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1240-821
820
M,K,J
2.4
10
0.796
35
0.42
45
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1240-102
1000
M,K,J
3
16
0.252
28
0.4
42
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1258-1R0
1
Z,M,K,J
0.01
26
7.96
100
15
8
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1258-1R8
1.8
Z,M,K,J
0.013
24
7.96
80
14
75
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1258-2R2
2.2
Z,M,K,J
0.014
22
7.96
55
11.4
7
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1258-3R3
3.3
Z,M,K,J
0.016
20
7.96
42
9.7
7
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1258-4R7
4.7
Z,M,K,J
0.02
19
7.96
33
8
7
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1258-5R6
5.6
Z,M,K,J
0.022
19
7.96
30
7.5
64
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1258-6R8
6.8
Z,M,K,J
0.023
20
7.96
27
6.7
59
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1258-8R2
8.2
Z,M,K,J
0.025
18
7.96
26
6
48
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1258-100
10
Z,M,K,J
0.028
32
2.52
22
5.5
4
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1258-120
12
Z,M,K,J
0.032
27
2.52
20
5.1
37
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1258-150
15
Z,M,K,J
0.04
25
2.52
18
4.6
35
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1258-180
18
Z,M,K,J
0.045
28
2.52
16
4.1
33
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1258-220
22
Z,M,K,J
0.052
29
2.52
15
3.7
31
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1258-270
27
Z,M,K,J
0.065
26
2.52
13
3.2
29
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1258-330
33
Z,M,K,J
0.075
27
2.52
124
3
27
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1258-390
39
Z,M,K,J
0.08
22
2.52
12
2.8
26
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1258-470
47
Z,M,K,J
0.1
22
2.52
116
2.6
25
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1258-560
56
Z,M,K,J
0.12
24
2.52
105
2.5
24
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1258-680
68
Z,M,K,J
0.13
22
2.52
10
2.3
23
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1258-820
82
Z,M,K,J
0.16
25
2.52
86
2
22
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1258-101
100
Z,M,K,J
0.19
26
0.796
78
1.8
21
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1258-121
120
Z,M,K,J
0.25
26
0.796
68
1.65
185
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1258-151
150
Z,M,K,J
0.28
20
0.796
64
1.55
166
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1258-181
180
Z,M,K,J
0.32
26
0.796
61
1.3
158
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1258-221
220
Z,M,K,J
0.42
22
0.796
55
1.2
135
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1258-271
270
Z,M,K,J
0.48
20
0.796
43
1.1
13
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1258-331
330
Z,M,K,J
0.63
22
0.796
4
1
116
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1258-391
390
Z,M,K,J
0.7
20
0.796
36
0.95
108
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1258-471
470
Z,M,K,J
0.9
18
0.796
3
0.85
96
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1258-561
560
Z,M,K,J
1
22
0.796
28
0.8
88
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1258-681
680
Z,M,K,J
1.2
18
0.796
26
0.75
8
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1258-821
820
Z,M,K,J
1.6
20
0.796
25
0.68
73
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1258-102
1000
Z,M,K,J
1.85
30
0.252
24
0.6
68
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1260-1R0
1
N,M,K,J
0.0078
26
7.96
100
10
94
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1260-1R5
1.5
N,M,K,J
0.0095
24
7.96
86
9
88
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1260-2R2
2.2
N,M,K,J
0.0105
22
7.96
70
8.5
82
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1260-3R3
3.3
N,M,K,J
0.012
20
7.96
40
7.8
76
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1260-4R7
4.7
N,M,K,J
0.0155
19
7.96
367
7
68
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1260-5R6
5.6
N,M,K,J
0.0162
19
7.96
33
6.9
67
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1260-6R8
6.8
N,M,K,J
0.018
20
7.96
282
6.5
63
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1260-8R2
8.2
N,M,K,J
0.0195
18
7.96
24
5.8
57
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1260-100
10
N,M,K,J
0.02
32
2.52
321
5.5
55
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1260-120
12
N,M,K,J
0.023
27
2.52
194
5
52
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1260-150
15
N,M,K,J
0.027
25
2.52
176
4.6
5
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1260-180
18
N,M,K,J
0.036
28
2.52
155
3.9
42
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1260-220
22
N,M,K,J
0.043
29
2.52
134
3.7
4
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1260-270
27
N,M,K,J
0.045
26
2.52
127
3.3
36
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1260-330
33
N,M,K,J
0.06
27
2.52
997
2.8
3
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1260-390
39
N,M,K,J
0.07
22
2.52
104
2.7
28
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1260-470
47
N,M,K,J
0.086
22
2.52
763
2.5
26
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1260-560
56
N,M,K,J
0.1
24
2.52
792
2.2
23
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1260-680
68
N,M,K,J
0.115
22
2.52
743
2.1
21
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1260-820
82
N,M,K,J
0.145
25
2.52
685
1.9
195
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1260-101
100
N,M,K,J
0.18
26
0.796
607
1.7
17
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1260-121
120
N,M,K,J
0.21
26
0.796
55
1.65
165
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1260-151
150
N,M,K,J
0.26
20
0.796
5
1.55
155
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1260-181
180
N,M,K,J
0.32
26
0.796
45
1.4
14
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1260-221
220
N,M,K,J
0.38
22
0.796
42
1.3
138
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1260-271
270
N,M,K,J
0.45
20
0.796
36
1.2
13
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1260-331
330
N,M,K,J
0.58
22
0.796
32
1.1
115
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1260-391
390
N,M,K,J
0.7
20
0.796
28
1
108
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1260-471
470
N,M,K,J
0.82
18
0.796
26
0.9
95
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1260-561
560
N,M,K,J
1
22
0.796
24
0.8
88
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1260-681
680
N,M,K,J
1.15
18
0.796
22
0.75
8
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1260-821
820
N,M,K,J
1.5
20
0.796
2
0.63
73
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1260-102
1000
N,M,K,J
1.7
30
0.252
18
0.6
68
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1278-1R0
1.4
M,K,J
0.011
80
18
10
0.472 [12.0mm]
0.472 [12.0mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1278-1R8
4.7
M,K,J
0.02
30
11
62
0.472 [12.0mm]
0.472 [12.0mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1278-2R2
6
M,K,J
0.024
21
10
6
0.472 [12.0mm]
0.472 [12.0mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1278-3R3
8.2
M,K,J
0.028
20
8.5
59
0.472 [12.0mm]
0.472 [12.0mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1278-4R7
10
M,K,J
0.03
17
8
57
0.472 [12.0mm]
0.472 [12.0mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1278-5R6
12
M,K,J
0.032
15
7.5
52
0.472 [12.0mm]
0.472 [12.0mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1278-6R8
15
M,K,J
0.038
13
6.8
49
0.472 [12.0mm]
0.472 [12.0mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1278-8R2
18
M,K,J
0.043
12
6.3
45
0.472 [12.0mm]
0.472 [12.0mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1278-100
22
M,K,J
0.05
11
5.7
4
0.472 [12.0mm]
0.472 [12.0mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1278-120
27
M,K,J
0.06
10
5
36
0.472 [12.0mm]
0.472 [12.0mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1278-150
33
M,K,J
0.08
95
4.7
31
0.472 [12.0mm]
0.472 [12.0mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1278-180
39
M,K,J
0.085
85
4.6
3
0.472 [12.0mm]
0.472 [12.0mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1278-220
47
M,K,J
0.1
75
3.8
29
0.472 [12.0mm]
0.472 [12.0mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1278-270
56
M,K,J
0.11
7
3.5
27
0.472 [12.0mm]
0.472 [12.0mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1278-330
68
M,K,J
0.12
65
3.2
26
0.472 [12.0mm]
0.472 [12.0mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1278-390
82
M,K,J
0.15
5
3
23
0.472 [12.0mm]
0.472 [12.0mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1278-470
100
M,K,J
0.18
45
2.6
2
0.472 [12.0mm]
0.472 [12.0mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1278-560
120
M,K,J
0.23
43
2.5
19
0.472 [12.0mm]
0.472 [12.0mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1278-680
150
M,K,J
0.27
41
2.2
18
0.472 [12.0mm]
0.472 [12.0mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1278-820
180
M,K,J
0.3
4
2
17
0.472 [12.0mm]
0.472 [12.0mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1278-101
220
M,K,J
0.4
34
1.8
16
0.472 [12.0mm]
0.472 [12.0mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1278-121
270
M,K,J
0.53
31
1.6
12
0.472 [12.0mm]
0.472 [12.0mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1278-151
330
M,K,J
0.6
29
1.5
1
0.472 [12.0mm]
0.472 [12.0mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1278-181
390
M,K,J
0.68
27
1.3
1
0.472 [12.0mm]
0.472 [12.0mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1278-221
470
M,K,J
0.88
22
1.2
9
0.472 [12.0mm]
0.472 [12.0mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1278-271
560
M,K,J
0.96
2
1.1
8
0.472 [12.0mm]
0.472 [12.0mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1278-331
680
M,K,J
1.3
17
1
75
0.472 [12.0mm]
0.472 [12.0mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1278-391
820
M,K,J
1.5
14
0.95
7
0.472 [12.0mm]
0.472 [12.0mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1278-471
1000
M,K,J
1.7
13
0.85
68
0.472 [12.0mm]
0.472 [12.0mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1280-2R4
2.4
N,M,K,J
0.01
30
7.96
36
12
92
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1280-3R9
3.9
N,M,K,J
0.014
28
7.96
34
10.5
84
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1280-4R7
4.7
N,M,K,J
0.0155
22
7.96
30
8.8
82
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1280-6R8
6.8
N,M,K,J
0.0185
20
7.96
22
8
76
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1280-8R2
8.2
N,M,K,J
0.0205
22
2.52
20
6.8
62
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1280-100
10
N,M,K,J
0.0195
24
2.52
17
6.6
6
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1280-120
12
N,M,K,J
0.028
26
2.52
15
6.3
56
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1280-150
15
N,M,K,J
0.0285
26
2.52
13
5
52
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1280-180
18
N,M,K,J
0.035
24
2.52
12
4.6
48
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1280-220
22
N,M,K,J
0.0386
20
2.52
11
4.1
43
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1280-270
27
N,M,K,J
0.052
26
2.52
10
3.7
39
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1280-330
33
N,M,K,J
0.057
28
2.52
95
3.3
35
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1280-390
39
N,M,K,J
0.07
24
2.52
85
3.1
32
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1280-470
47
N,M,K,J
0.08
24
2.52
75
2.8
29
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1280-560
56
N,M,K,J
0.1
24
2.52
7
2.5
26
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1280-680
68
N,M,K,J
0.12
20
2.52
65
2.3
24
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1280-820
82
N,M,K,J
0.13
20
2.52
5
2.2
23
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1280-101
100
N,M,K,J
0.15
18
0.796
45
2
21
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1280-121
120
N,M,K,J
0.2
16
0.796
43
1.95
195
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1280-151
150
N,M,K,J
0.27
24
0.796
41
1.9
185
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1280-181
180
N,M,K,J
0.3
24
0.796
4
1.88
175
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1280-221
220
N,M,K,J
0.4
24
0.796
34
1.7
16
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1280-271
270
N,M,K,J
0.45
20
0.796
31
1.6
12
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1280-331
330
N,M,K,J
0.6
18
0.796
29
1.4
11
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1280-391
390
N,M,K,J
0.68
20
0.796
27
1.4
1
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1280-471
470
N,M,K,J
0.88
20
0.796
22
1.25
9
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1280-561
560
N,M,K,J
0.96
20
0.796
2
1.15
8
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1280-681
680
N,M,K,J
1.3
26
0.796
17
0.97
75
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1280-821
820
N,M,K,J
1.5
20
0.796
14
0.94
7
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1280-102
1000
N,M,K,J
1.7
40
0.252
13
0.8
68
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SDPL1280-122
1200
N,M,K,J
2.2
40
0.252
11
0.65
55
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ACMWC3225-220
22
800
Z, N, V, M
0.4
4
0.126 [3.2mm]
0.098 [2.5mm]
0.095 [2.4mm]
Termination Options:
RoHS-compliant, lead-free (standard). Consist of Ag alloy followed by Nickel, then Au plating.
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
AEQ-Q200, Grade 1 rated
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 50% from initial impedance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -40°C for 1000 hours. Part inductance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: Temperature +85°C, 1000 hours. Part inductance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part inductance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3 times per axis. Part inductance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, each axis. Part inductance shall be within +/- 50% from initial impedance and no body damage.
ACMWC3225-510
51
2600
Z, N, V, M
1.5
3
0.126 [3.2mm]
0.098 [2.5mm]
0.095 [2.4mm]
Termination Options:
RoHS-compliant, lead-free (standard). Consist of Ag alloy followed by Nickel, then Au plating.
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
AEQ-Q200, Grade 1 rated
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 50% from initial impedance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -40°C for 1000 hours. Part inductance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: Temperature +85°C, 1000 hours. Part inductance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part inductance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3 times per axis. Part inductance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, each axis. Part inductance shall be within +/- 50% from initial impedance and no body damage.
ACMWC3225-101
100
5200
Z, N, V, M
3.3
15
0.126 [3.2mm]
0.098 [2.5mm]
0.095 [2.4mm]
Termination Options:
RoHS-compliant, lead-free (standard). Consist of Ag alloy followed by Nickel, then Au plating.
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH. 1 year shelf life.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
AEQ-Q200, Grade 1 rated
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 1000 hours. Part inductance shall be within +/- 50% from initial impedance and no body damage.
Low Temperature Exposure: MIL-STD-202, Method 108, -40°C for 1000 hours. Part inductance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: Temperature +85°C, 1000 hours. Part inductance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204. 1.5mm amplitude, 10 55Hz for 2 hours in each axis. Part shall have no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part inductance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 245°C. Terminal shall be covered by 90% with fresh solder.
Terminal Strength: IEC 60068-2-21. Terminal and body shall not be damaged by forces applied.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3 times per axis. Part inductance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, each axis. Part inductance shall be within +/- 50% from initial impedance and no body damage.
ACMFC1560-701
7.5
700
0.01
5
0.354 [9.0mm]
0.276 [7.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ACMFC9045-701
7.5
700
0.01
5
0.354 [9.0mm]
0.276 [7.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL3818-1R0
1
N, M, K
0.037
165
2.1
36
0.150 [3.80mm]
0.150 [3.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL3818-1R5
1.5
N, M, K
0.047
125
1.6
31
0.150 [3.80mm]
0.150 [3.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL3818-2R2
2.2
N, M, K
0.06
95
1.4
26
0.150 [3.80mm]
0.150 [3.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL3818-2R7
2.7
N, M, K
0.065
90
1.3
25
0.150 [3.80mm]
0.150 [3.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL3818-3R3
3.3
N, M, K
0.085
75
1.15
21
0.150 [3.80mm]
0.150 [3.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL3818-3R9
3.9
N, M, K
0.105
70
1
2
0.150 [3.80mm]
0.150 [3.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL3818-4R7
4.7
N, M, K
0.12
60
0.95
19
0.150 [3.80mm]
0.150 [3.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL3818-6R8
6.8
N, M, K
0.16
50
0.8
16
0.150 [3.80mm]
0.150 [3.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL3818-100
10
N, M, K
0.235
40
0.65
13
0.150 [3.80mm]
0.150 [3.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL3818-150
15
N, M, K
0.34
30
0.55
105
0.150 [3.80mm]
0.150 [3.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL3818-220
22
N, M, K
0.5
25
0.43
8
0.150 [3.80mm]
0.150 [3.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL3818-330
33
N, M, K
0.74
20
0.34
65
0.150 [3.80mm]
0.150 [3.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL3818-470
47
N, M, K
1.03
15
0.3
56
0.150 [3.80mm]
0.150 [3.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL3818-680
68
N, M, K
1.6
13
0.24
48
0.150 [3.80mm]
0.150 [3.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL3818-101
100
N, M, K
2.6
11
0.2
34
0.150 [3.80mm]
0.150 [3.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL3818-221
220
N, M, K
5.7
6
0.16
26
0.150 [3.80mm]
0.150 [3.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL3828-3R3
3.3
N, M, K
0.048
64
1.7
25
0.150 [3.80mm]
0.150 [3.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL3828-4R7
4.7
N, M, K
0.066
55
1.48
24
0.150 [3.80mm]
0.150 [3.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL3828-6R8
6.8
N, M, K
0.11
36
1.16
16
0.150 [3.80mm]
0.150 [3.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL3828-100
10
N, M, K
0.154
27
0.95
15
0.150 [3.80mm]
0.150 [3.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL3828-150
15
N, M, K
0.2
23
0.8
13
0.150 [3.80mm]
0.150 [3.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL3828-220
22
N, M, K
0.33
20
0.68
1
0.150 [3.80mm]
0.150 [3.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL3828-330
33
N, M, K
0.49
19
0.54
7
0.150 [3.80mm]
0.150 [3.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL3828-470
47
N, M, K
0.595
12
0.45
65
0.150 [3.80mm]
0.150 [3.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL3828-680
68
N, M, K
0.79
9
0.38
55
0.150 [3.80mm]
0.150 [3.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL3828-101
100
N, M, K
1.15
8
0.32
48
0.150 [3.80mm]
0.150 [3.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4818-1R0
1
N, M, K
0.025
140
3.6
51
0.189 [4.80mm]
0.189 [4.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4818-1R5
1.5
N, M, K
0.035
105
3
47
0.189 [4.80mm]
0.189 [4.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4818-2R2
2.2
N, M, K
0.045
90
2.43
33
0.189 [4.80mm]
0.189 [4.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4818-3R3
3.3
N, M, K
0.055
70
2.1
31
0.189 [4.80mm]
0.189 [4.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4818-3R9
3.9
N, M, K
0.07
65
1.9
27
0.189 [4.80mm]
0.189 [4.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4818-4R7
4.7
N, M, K
0.08
55
1.8
26
0.189 [4.80mm]
0.189 [4.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4818-5R6
5.6
N, M, K
0.09
50
1.35
23
0.189 [4.80mm]
0.189 [4.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4818-6R8
6.8
N, M, K
0.1
45
1.25
22
0.189 [4.80mm]
0.189 [4.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4818-8R2
8.2
N, M, K
0.114
40
1.15
19
0.189 [4.80mm]
0.189 [4.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4818-100
10
N, M, K
0.14
37
1.05
18
0.189 [4.80mm]
0.189 [4.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4818-120
12
N, M, K
0.17
34
0.95
16
0.189 [4.80mm]
0.189 [4.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4818-150
15
N, M, K
0.22
30
0.87
13
0.189 [4.80mm]
0.189 [4.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4818-180
18
N, M, K
0.28
28
0.79
14
0.189 [4.80mm]
0.189 [4.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4818-220
22
N, M, K
0.36
25
0.72
125
0.189 [4.80mm]
0.189 [4.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4818-270
27
N, M, K
0.4
22
0.66
115
0.189 [4.80mm]
0.189 [4.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4818-330
33
N, M, K
0.5
20
0.36
9
0.189 [4.80mm]
0.189 [4.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4818-390
39
N, M, K
0.54
17
0.53
8
0.189 [4.80mm]
0.189 [4.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4818-470
47
N, M, K
0.63
16
0.47
75
0.189 [4.80mm]
0.189 [4.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4828-1R2
1.2
N, M, K
0.024
155
3
5
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4828-1R8
1.8
N, M, K
0.03
105
2.5
46
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4828-2R7
2.7
N, M, K
0.034
80
2.2
4
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4828-3R9
3.9
N, M, K
0.047
60
1.8
34
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4828-4R7
4.7
N, M, K
0.054
50
1.6
3
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4828-6R8
6.8
N, M, K
0.074
40
1.3
26
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4828-7R4
7.4
N, M, K
0.087
38
1.28
25
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4828-8R2
8.2
N, M, K
0.087
35
1.25
24
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4828-100
10
N, M, K
0.1
30
1.1
23
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4828-120
12
N, M, K
0.125
27
0.95
2
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4828-150
15
N, M, K
0.145
25
0.92
18
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4828-180
18
N, M, K
0.16
22
0.8
17
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4828-220
22
N, M, K
0.185
20
0.68
155
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4828-270
27
N, M, K
0.24
18
0.65
145
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4828-330
33
N, M, K
0.26
15
0.6
14
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4828-390
39
N, M, K
0.265
14
0.58
13
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4828-470
47
N, M, K
0.27
13
0.47
12
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4828-560
56
N, M, K
0.32
12
0.4
105
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4828-680
68
N, M, K
0.37
11
0.38
9
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4828-820
82
N, M, K
0.48
10
0.35
85
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4828-101
100
N, M, K
0.6
85
0.33
7
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4828-121
120
N, M, K
0.76
8
0.3
65
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4828-151
150
N, M, K
0.86
7
0.28
6
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4828-181
180
N, M, K
1.08
6
0.26
55
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4828-221
220
N, M, K
1.25
55
0.24
5
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4828-271
270
N, M, K
1.7
5
0.21
45
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4828-331
330
N, M, K
1.8
45
0.2
4
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL4828-391
390
N, M, K
2.4
4
0.17
35
0.189 [4.80mm]
0.189 [4.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5818-1R0
1
N, M, K
0.031
100
3.9
48
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5818-2R0
2
N, M, K
0.043
83
3.2
35
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5818-3R0
3
N, M, K
0.075
73
2.7
265
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5818-3R9
3.9
N, M, K
0.094
63
2.4
24
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5818-5R0
5
N, M, K
0.108
56
2.1
22
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5818-6R2
6.1
N, M, K
0.123
51
1.9
2
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5818-7R5
7.5
N, M, K
0.152
43
1.75
17
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5818-9R0
9
N, M, K
0.185
38
1.6
16
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5818-100
10
N, M, K
0.235
30
1.45
15
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5818-120
12
N, M, K
0.25
29
1.35
145
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5818-150
15
N, M, K
0.3
25
1.2
13
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5818-180
18
N, M, K
0.365
23
1.15
12
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5818-220
22
N, M, K
0.475
21
0.98
105
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5818-270
27
N, M, K
0.51
20
0.9
95
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5818-330
33
N, M, K
0.57
18
0.83
9
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5818-390
39
N, M, K
0.71
15
0.75
85
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5818-470
47
N, M, K
0.81
14
0.68
8
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5818-560
56
N, M, K
0.845
13
0.63
75
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5818-680
68
N, M, K
1.205
11
0.56
58
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5818-820
82
N, M, K
1.42
10
0.52
55
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5818-101
100
N, M, K
1.89
9
0.47
52
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5818-121
120
N, M, K
2.11
8
0.42
5
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5818-151
150
N, M, K
2.675
7
0.38
44
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5818-181
180
N, M, K
3.245
6
0.34
35
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5818-221
220
N, M, K
4.08
5
0.32
33
0.228 [5.80mm]
0.228 [5.80mm]
0.071 [1.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5828-2R6
2.6
N, M, K
0.03
78
3.15
45
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5828-3R3
3.3
N, M, K
0.035
70
2.8
44
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5828-4R7
4.7
N, M, K
0.04
48
2.54
4
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5828-5R3
5.3
N, M, K
0.042
46
2.2
38
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5828-6R2
6.2
N, M, K
0.057
41
2.1
35
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5828-8R2
8.2
N, M, K
0.063
37
1.62
3
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5828-100
10
N, M, K
0.083
32
1.55
26
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5828-120
12
N, M, K
0.1
25
1.5
25
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5828-150
15
N, M, K
0.115
25
1.35
225
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5828-180
18
N, M, K
0.13
22
1.3
215
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5828-220
22
N, M, K
0.16
19
1.15
175
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5828-270
27
N, M, K
0.18
18
1.05
165
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5828-330
33
N, M, K
0.23
15
0.92
14
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5828-390
39
N, M, K
0.26
14
0.86
137
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5828-470
47
N, M, K
0.305
13
0.78
133
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5828-560
56
N, M, K
0.395
11
0.7
113
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5828-680
68
N, M, K
0.47
10
0.65
103
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5828-820
82
N, M, K
0.53
9
0.6
95
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5828-101
100
N, M, K
0.645
8
0.53
8
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5828-151
150
N, M, K
0.91
7
0.45
8
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5828-181
180
N, M, K
1.1
55
0.42
64
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5828-221
220
N, M, K
1.2
5
0.37
62
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5828-331
330
N, M, K
2.1
4
0.3
46
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5828-681
680
N, M, K
4.8
3
0.21
31
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL5828-102
1000
N, M, K
7.3
2
0.13
21
0.228 [5.80mm]
0.228 [5.80mm]
0.110 [2.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6822-1R0
1
N, M, K
0.019
109
4.4
58
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6822-1R5
1.5
N, M, K
0.022
77
3.5
5
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6822-2R2
2.2
N, M, K
0.027
72
2.7
48
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6822-3R3
3.3
N, M, K
0.033
62
2.4
43
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6822-5R0
5
N, M, K
0.04
48
2
36
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6822-6R2
6.2
N, M, K
0.057
42
1.7
34
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6822-7R5
7.5
N, M, K
0.064
36
1.55
32
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6822-100
10
N, M, K
0.088
33
1.35
27
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6822-120
12
N, M, K
0.09
32
1.25
265
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6822-150
15
N, M, K
0.11
23
1.1
245
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6822-180
18
N, M, K
0.13
22
1
225
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6822-220
22
N, M, K
0.165
21
0.92
2
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6822-270
27
N, M, K
0.22
19
0.8
175
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6822-330
33
N, M, K
0.235
18
0.75
16
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6822-390
39
N, M, K
0.285
15
0.64
15
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6822-470
47
N, M, K
0.345
14
0.6
135
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6822-560
56
N, M, K
0.39
13
0.56
12
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6822-680
68
N, M, K
0.48
12
0.52
115
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6822-820
82
N, M, K
0.54
10
0.45
11
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6822-101
100
N, M, K
0.68
95
0.42
95
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6822-121
120
N, M, K
0.76
8
0.39
82
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6822-151
150
N, M, K
1.1
5
0.34
73
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6822-181
180
N, M, K
1.2
7
0.31
68
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6822-221
220
N, M, K
1.38
55
0.28
65
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6822-271
270
N, M, K
1.77
52
0.24
55
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6822-331
330
N, M, K
2
5
0.23
51
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6822-391
390
N, M, K
2.6
48
0.21
46
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6822-471
470
N, M, K
3.2
4
0.19
42
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6822-561
560
N, M, K
3.58
38
0.18
39
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6822-681
680
N, M, K
4.3
32
0.16
36
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6822-821
820
N, M, K
5.5
3
0.14
32
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6822-102
1000
N, M, K
6.85
26
0.13
28
0.268 [6.80mm]
0.268 [6.80mm]
0.106 [2.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6828-2R5
2.5
N, M, K
0.03
77
3.4
49
0.268 [6.80mm]
0.268 [6.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6828-3R3
3.3
N, M, K
0.033
63
3
47
0.268 [6.80mm]
0.268 [6.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6828-4R3
4.3
N, M, K
0.043
55
2.6
4
0.268 [6.80mm]
0.268 [6.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6828-5R0
5
N, M, K
0.048
48
2.3
38
0.268 [6.80mm]
0.268 [6.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6828-6R4
6.4
N, M, K
0.06
42
2.1
34
0.268 [6.80mm]
0.268 [6.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6828-7R7
7.7
N, M, K
0.07
37
1.9
32
0.268 [6.80mm]
0.268 [6.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6828-100
10
N, M, K
0.084
33
1.75
29
0.268 [6.80mm]
0.268 [6.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6828-150
15
N, M, K
0.145
24
1.4
22
0.268 [6.80mm]
0.268 [6.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6828-220
22
N, M, K
0.18
20
1.15
2
0.268 [6.80mm]
0.268 [6.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6828-330
33
N, M, K
0.205
15
0.92
18
0.268 [6.80mm]
0.268 [6.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6828-470
47
N, M, K
0.29
13
8
14
0.268 [6.80mm]
0.268 [6.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6828-680
68
N, M, K
0.41
10
0.67
12
0.268 [6.80mm]
0.268 [6.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6828-101
100
N, M, K
0.055
8
0.55
1
0.268 [6.80mm]
0.268 [6.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6828-151
150
N, M, K
0.89
6
0.44
8
0.268 [6.80mm]
0.268 [6.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6828-221
220
N, M, K
1.2
55
0.36
6
0.268 [6.80mm]
0.268 [6.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6828-331
330
N, M, K
1.74
45
0.3
55
0.268 [6.80mm]
0.268 [6.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6828-471
470
N, M, K
2.54
35
0.25
45
0.268 [6.80mm]
0.268 [6.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6828-681
680
N, M, K
3.56
3
0.21
35
0.268 [6.80mm]
0.268 [6.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ALPPL6828-102
1000
N, M, K
4.48
25
0.17
3
0.268 [6.80mm]
0.268 [6.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +150°C for 1000 cycles.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current.Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Mechanical shock: MIL-STD-202, method 213. 100g, 6ms pulse, half-sine, 12.3ft,sec, 3X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 260°C, 10 seconds. Part impedance shall be within +/- 50% from initial impedance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
ASDPL1240-100
10
M,K,J
0.032
17
2.52
27
4
4
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1240-120
12
M,K,J
0.038
16
2.52
25
3.6
38
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1240-150
15
M,K,J
0.047
16
2.52
22
3.2
35
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1240-180
18
M,K,J
0.055
14
2.52
20
3
32
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1240-220
22
M,K,J
0.0675
18
2.52
16
2.6
3
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1240-270
27
M,K,J
0.085
16
2.52
155
2.35
255
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1240-330
33
M,K,J
0.097
19
2.52
15
2.1
23
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1240-390
39
M,K,J
0.12
14
2.52
14
2
2.115
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1240-470
47
M,K,J
0.135
19
2.52
13
1.8
2
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1240-560
56
M,K,J
0.17
16
2.52
12
1.65
18
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1240-680
68
M,K,J
0.2
19
2.52
11
1.5
15
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1240-820
82
M,K,J
0.25
16
2.52
10
1.35
135
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1240-101
100
M,K,J
0.3
14
0.796
8
1.2
125
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1240-121
120
M,K,J
0.37
12
0.796
78
1.15
12
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1240-151
150
M,K,J
0.44
12
0.796
75
1.05
11
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1240-181
180
M,K,J
0.55
12
0.796
7
0.95
98
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1240-221
220
M,K,J
0.6
12
0.796
66
0.9
92
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1240-271
270
M,K,J
0.78
10
0.796
6
0.8
8
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1240-331
330
M,K,J
0.95
12
0.796
55
0.75
75
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1240-391
390
M,K,J
1.15
12
0.796
5
0.65
7
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1240-471
470
M,K,J
1.35
12
0.796
45
0.6
62
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1240-561
560
M,K,J
1.5
12
0.796
4
0.52
55
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1240-681
680
M,K,J
2
14
0.796
38
0.48
5
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1240-821
820
M,K,J
2.4
10
0.796
35
0.42
45
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1240-102
1000
M,K,J
3
16
0.252
28
0.4
42
0.492 [12.5mm]
0.492 [12.5mm]
0.157 [4.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1260-1R0
1
N,M,K,J
0.0078
26
7.96
100
10
94
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1260-1R5
1.5
N,M,K,J
0.0095
24
7.96
86
9
88
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1260-2R2
2.2
N,M,K,J
0.0105
22
7.96
70
8.5
82
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1260-3R3
3.3
N,M,K,J
0.012
20
7.96
40
7.8
76
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1260-4R7
4.7
N,M,K,J
0.0155
19
7.96
367
7
68
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1260-5R6
5.6
N,M,K,J
0.0162
19
7.96
33
6.9
67
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1260-6R8
6.8
N,M,K,J
0.018
20
7.96
282
6.5
63
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1260-8R2
8.2
N,M,K,J
0.0195
18
7.96
24
5.8
57
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1260-100
10
N,M,K,J
0.02
32
2.52
321
5.5
55
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1260-120
12
N,M,K,J
0.023
27
2.52
194
5
52
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1260-150
15
N,M,K,J
0.027
25
2.52
176
4.6
5
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1260-180
18
N,M,K,J
0.036
28
2.52
155
3.9
42
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1260-220
22
N,M,K,J
0.043
29
2.52
134
3.7
4
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1260-270
27
N,M,K,J
0.045
26
2.52
127
3.3
36
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1260-330
33
N,M,K,J
0.06
27
2.52
997
2.8
3
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1260-390
39
N,M,K,J
0.07
22
2.52
104
2.7
28
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1260-470
47
N,M,K,J
0.086
22
2.52
763
2.5
26
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1260-560
56
N,M,K,J
0.1
24
2.52
792
2.2
23
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1260-680
68
N,M,K,J
0.115
22
2.52
743
2.1
21
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1260-820
82
N,M,K,J
0.145
25
2.52
685
1.9
195
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1260-101
100
N,M,K,J
0.18
26
0.796
607
1.7
17
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1260-121
120
N,M,K,J
0.21
26
0.796
55
1.65
165
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1260-151
150
N,M,K,J
0.26
20
0.796
5
1.55
155
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1260-181
180
N,M,K,J
0.32
26
0.796
45
1.4
14
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1260-221
220
N,M,K,J
0.38
22
0.796
42
1.3
138
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1260-271
270
N,M,K,J
0.45
20
0.796
36
1.2
13
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1260-331
330
N,M,K,J
0.58
22
0.796
32
1.1
115
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1260-391
390
N,M,K,J
0.7
20
0.796
28
1
108
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1260-471
470
N,M,K,J
0.82
18
0.796
26
0.9
95
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1260-561
560
N,M,K,J
1
22
0.796
24
0.8
88
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1260-681
680
N,M,K,J
1.15
18
0.796
22
0.75
8
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1260-821
820
N,M,K,J
1.5
20
0.796
2
0.63
73
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1260-102
1000
N,M,K,J
1.7
30
0.252
18
0.6
68
0.492 [12.5mm]
0.492 [12.5mm]
0.238 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1280-2R4
2.4
N,M,K,J
0.01
30
7.96
36
12
92
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1280-3R9
3.9
N,M,K,J
0.014
28
7.96
34
10.5
84
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1280-4R7
4.7
N,M,K,J
0.0155
22
7.96
30
8.8
82
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1280-6R8
6.8
N,M,K,J
0.0185
20
7.96
22
8
76
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1280-8R2
8.2
N,M,K,J
0.0205
22
2.52
20
6.8
62
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1280-100
10
N,M,K,J
0.0195
24
2.52
17
6.6
6
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1280-120
12
N,M,K,J
0.028
26
2.52
15
6.3
56
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1280-150
15
N,M,K,J
0.0285
26
2.52
13
5
52
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1280-180
18
N,M,K,J
0.035
24
2.52
12
4.6
48
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1280-220
22
N,M,K,J
0.0386
20
2.52
11
4.1
43
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1280-270
27
N,M,K,J
0.052
26
2.52
10
3.7
39
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1280-330
33
N,M,K,J
0.057
28
2.52
95
3.3
35
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1280-390
39
N,M,K,J
0.07
24
2.52
85
3.1
32
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1280-470
47
N,M,K,J
0.08
24
2.52
75
2.8
29
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1280-560
56
N,M,K,J
0.1
24
2.52
7
2.5
26
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1280-680
68
N,M,K,J
0.12
20
2.52
65
2.3
24
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1280-820
82
N,M,K,J
0.13
20
2.52
5
2.2
23
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1280-101
100
N,M,K,J
0.15
18
0.796
45
2
21
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1280-121
120
N,M,K,J
0.2
16
0.796
43
1.95
195
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1280-151
150
N,M,K,J
0.27
24
0.796
41
1.9
185
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1280-181
180
N,M,K,J
0.3
24
0.796
4
1.88
175
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1280-221
220
N,M,K,J
0.4
24
0.796
34
1.7
16
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1280-271
270
N,M,K,J
0.45
20
0.796
31
1.6
12
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1280-331
330
N,M,K,J
0.6
18
0.796
29
1.4
11
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1280-391
390
N,M,K,J
0.68
20
0.796
27
1.4
1
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1280-471
470
N,M,K,J
0.88
20
0.796
22
1.25
9
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1280-561
560
N,M,K,J
0.96
20
0.796
2
1.15
8
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1280-681
680
N,M,K,J
1.3
26
0.796
17
0.97
75
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1280-821
820
N,M,K,J
1.5
20
0.796
14
0.94
7
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1280-102
1000
N,M,K,J
1.7
40
0.252
13
0.8
68
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASDPL1280-122
1200
N,M,K,J
2.2
40
0.252
11
0.65
55
0.472 [12.0mm]
0.472 [12.0mm]
0.295 [7.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: 55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1806-100
10
N,M,K
0.04
56
2.52
19
8.2
4
0.717 [18.2mm]
0.551 [14.0mm]
0.268 [6.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1806-150
15
N,M,K
0.052
53
2.52
175
7.2
36
0.717 [18.2mm]
0.551 [14.0mm]
0.268 [6.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1806-220
22
N,M,K
0.07
51
2.52
16
6.2
3
0.717 [18.2mm]
0.551 [14.0mm]
0.268 [6.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1806-330
33
N,M,K
0.1
44
2.52
10
5
25
0.717 [18.2mm]
0.551 [14.0mm]
0.268 [6.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1806-470
47
N,M,K
0.13
40
2.52
8
4.2
2
0.717 [18.2mm]
0.551 [14.0mm]
0.268 [6.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1806-680
68
N,M,K
0.2
37
2.52
6
3.4
16
0.717 [18.2mm]
0.551 [14.0mm]
0.268 [6.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1806-101
100
N,M,K
0.32
40
0.796
46
2.6
13
0.717 [18.2mm]
0.551 [14.0mm]
0.268 [6.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1806-151
150
N,M,K
0.5
39
0.796
43
2.3
105
0.717 [18.2mm]
0.551 [14.0mm]
0.268 [6.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1806-221
220
N,M,K
0.6
29
0.796
35
1.9
1
0.717 [18.2mm]
0.551 [14.0mm]
0.268 [6.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1806-331
330
N,M,K
0.92
30
0.796
3
1
8
0.717 [18.2mm]
0.551 [14.0mm]
0.268 [6.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1806-471
470
N,M,K
1.15
27
0.796
24
1.3
64
0.717 [18.2mm]
0.551 [14.0mm]
0.268 [6.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1806-681
680
N,M,K
1.7
19
0.796
21
1.1
54
0.717 [18.2mm]
0.551 [14.0mm]
0.268 [6.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1806-102
1000
N,M,K
2.45
46
0.252
15
0.9
45
0.717 [18.2mm]
0.551 [14.0mm]
0.268 [6.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASBPL1806-100
10
N,M,K
0.04
56
2.52
19
8.2
4
0.236 [6.0mm]
0.236 [6.0mm]
0.150 [3.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASBPL1806-150
15
N,M,K
0.052
53
2.52
175
7.2
36
0.236 [6.0mm]
0.236 [6.0mm]
0.150 [3.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASBPL1806-220
22
N,M,K
0.07
51
2.52
16
6.2
3
0.236 [6.0mm]
0.236 [6.0mm]
0.150 [3.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASBPL1806-330
33
N,M,K
0.1
44
2.52
10
5
25
0.236 [6.0mm]
0.236 [6.0mm]
0.150 [3.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASBPL1806-470
47
N,M,K
0.13
40
2.52
8
4.2
2
0.236 [6.0mm]
0.236 [6.0mm]
0.150 [3.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASBPL1806-680
68
N,M,K
0.2
37
2.52
6
3.4
16
0.236 [6.0mm]
0.236 [6.0mm]
0.150 [3.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASBPL1806-101
100
N,M,K
0.32
40
0.796
46
2.6
13
0.236 [6.0mm]
0.236 [6.0mm]
0.150 [3.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASBPL1806-151
150
N,M,K
0.5
39
0.796
43
2.3
105
0.236 [6.0mm]
0.236 [6.0mm]
0.150 [3.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASBPL1806-221
220
N,M,K
0.6
29
0.796
35
1.9
1
0.236 [6.0mm]
0.236 [6.0mm]
0.150 [3.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASBPL1806-331
330
N,M,K
0.92
30
0.796
3
1
8
0.236 [6.0mm]
0.236 [6.0mm]
0.150 [3.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASBPL1806-471
470
N,M,K
1.15
27
0.796
24
1.3
64
0.236 [6.0mm]
0.236 [6.0mm]
0.150 [3.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASBPL1806-681
680
N,M,K
1.7
19
0.796
21
1.1
54
0.236 [6.0mm]
0.236 [6.0mm]
0.150 [3.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASBPL1806-102
1000
N,M,K
2.45
46
0.252
15
0.9
45
0.236 [6.0mm]
0.236 [6.0mm]
0.150 [3.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1045-2R7
2.7
N,M,K
0.0161
4.9
37
0.398 [10.1mm]
0.398 [10.1mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1045-4R7
4.7
N,M,K
0.22
3.8
32
0.398 [10.1mm]
0.398 [10.1mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1045-100
10
N,M,K
0.364
3
25
0.398 [10.1mm]
0.398 [10.1mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1045-150
15
N,M,K
0.472
2.4
22
0.398 [10.1mm]
0.398 [10.1mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1045-220
22
N,M,K
0.591
2.1
19
0.398 [10.1mm]
0.398 [10.1mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1045-330
33
N,M,K
0.815
1.6
17
0.398 [10.1mm]
0.398 [10.1mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1045-470
47
N,M,K
0.11
1.4
15
0.398 [10.1mm]
0.398 [10.1mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1045-680
68
N,M,K
0.14
1.2
13
0.398 [10.1mm]
0.398 [10.1mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1045-101
100
N,M,K
0.23
1
11
0.398 [10.1mm]
0.398 [10.1mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1045-151
150
N,M,K
0.35
0.79
81
0.398 [10.1mm]
0.398 [10.1mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1045-221
220
N,M,K
0.49
0.65
7
0.398 [10.1mm]
0.398 [10.1mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1045-331
330
N,M,K
0.74
0.54
58
0.398 [10.1mm]
0.398 [10.1mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1045-471
470
N,M,K
1.08
0.4
47
0.398 [10.1mm]
0.398 [10.1mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1045-681
680
N,M,K
1.6
0.35
38
0.398 [10.1mm]
0.398 [10.1mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1045-102
1000
N,M,K
2.4
0.32
29
0.398 [10.1mm]
0.398 [10.1mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1045-152
1500
N,M,K
3.4
0.22
26
0.398 [10.1mm]
0.398 [10.1mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL0805-2R2
2.2
M,K
0.04
18
7.96
75
2.5
25
0.413 [10.5mm]
0.315 [8.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL0805-3R9
3.9
M,K
0.055
20
7.96
50
2.1
21
0.413 [10.5mm]
0.315 [8.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL0805-5R6
5.6
M,K
0.065
20
7.96
40
1.95
195
0.413 [10.5mm]
0.315 [8.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL0805-8R2
8.2
M,K
0.08
19
7.96
32
1.75
175
0.413 [10.5mm]
0.315 [8.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL0805-100
10
M,K
0.1
40
2.52
28
1.5
15
0.413 [10.5mm]
0.315 [8.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL0805-120
12
M,K
0.12
40
2.52
24
1.4
14
0.413 [10.5mm]
0.315 [8.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL0805-150
15
M,K
0.14
40
2.52
22
1.3
13
0.413 [10.5mm]
0.315 [8.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL0805-180
18
M,K
0.16
40
2.52
19
1.2
12
0.413 [10.5mm]
0.315 [8.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL0805-220
22
M,K
0.18
38
2.52
17
1.1
11
0.413 [10.5mm]
0.315 [8.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL0805-270
27
M,K
0.2
35
2.52
155
1
1
0.413 [10.5mm]
0.315 [8.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL0805-330
33
M,K
0.24
40
2.52
135
0.92
92
0.413 [10.5mm]
0.315 [8.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL0805-390
39
M,K
0.26
35
2.52
12
0.84
84
0.413 [10.5mm]
0.315 [8.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL0805-470
47
M,K
0.28
32
2.52
105
0.75
75
0.413 [10.5mm]
0.315 [8.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL0805-560
56
M,K
0.38
30
2.52
95
0.68
68
0.413 [10.5mm]
0.315 [8.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL0805-680
68
M,K
0.44
28
2.52
9
0.6
6
0.413 [10.5mm]
0.315 [8.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL0805-820
82
M,K
0.55
28
2.52
85
0.54
54
0.413 [10.5mm]
0.315 [8.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL0805-101
100
M,K
0.6
45
0.796
75
0.5
5
0.413 [10.5mm]
0.315 [8.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL0805-121
120
M,K
0.75
42
0.796
7
0.45
45
0.413 [10.5mm]
0.315 [8.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL0805-151
150
M,K
0.9
39
0.796
65
0.4
4
0.413 [10.5mm]
0.315 [8.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL0805-181
180
M,K
1.05
41
0.796
48
0.35
35
0.413 [10.5mm]
0.315 [8.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL0805-221
220
M,K
1.18
38
0.796
45
0.3
3
0.413 [10.5mm]
0.315 [8.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL0805-271
270
M,K
1.4
37
0.796
42
0.27
27
0.413 [10.5mm]
0.315 [8.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL0805-331
330
M,K
1.8
36
0.796
38
0.24
24
0.413 [10.5mm]
0.315 [8.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL0805-471
470
M,K
2.25
34
0.796
35
0.2
2
0.413 [10.5mm]
0.315 [8.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL0805-561
560
M,K
3
32
0.796
3
0.18
18
0.413 [10.5mm]
0.315 [8.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL0805-681
680
M,K
3.4
32
0.796
28
0.17
17
0.413 [10.5mm]
0.315 [8.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL0805-821
820
M,K
4
35
0.796
25
0.16
16
0.413 [10.5mm]
0.315 [8.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL0805-102
1000
M,K
5
35
0.252
22
0.15
15
0.413 [10.5mm]
0.315 [8.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1608-1R0
1
M,K
0.04
10
500
250
3
12
0.256 [6.5mm]
0.173 [4.4mm]
0.114 [2.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1608-1R5
1.5
M,K
0.045
20
500
125
2.8
92
0.256 [6.5mm]
0.173 [4.4mm]
0.114 [2.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1608-2R2
2.2
M,K
0.05
25
500
120
1.8
8
0.256 [6.5mm]
0.173 [4.4mm]
0.114 [2.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1608-3R3
3.3
M,K
0.055
40
200
120
1.6
62
0.256 [6.5mm]
0.173 [4.4mm]
0.114 [2.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1608-4R7
4.7
M,K
0.06
40
200
105
1.4
5
0.256 [6.5mm]
0.173 [4.4mm]
0.114 [2.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1608-6R8
6.8
M,K
0.065
40
200
50
1.2
4
0.256 [6.5mm]
0.173 [4.4mm]
0.114 [2.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1608-100
10
M,K
0.075
40
200
38
1
32
0.256 [6.5mm]
0.173 [4.4mm]
0.114 [2.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1608-150
15
M,K
0.09
40
100
33
0.8
26
0.256 [6.5mm]
0.173 [4.4mm]
0.114 [2.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1608-220
22
M,K
0.11
40
100
25
0.7
24
0.256 [6.5mm]
0.173 [4.4mm]
0.114 [2.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1608-330
33
M,K
0.119
40
100
20
0.6
16
0.256 [6.5mm]
0.173 [4.4mm]
0.114 [2.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1608-470
47
M,K
0.23
40
100
20
0.5
14
0.256 [6.5mm]
0.173 [4.4mm]
0.114 [2.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1608-680
68
M,K
0.29
40
100
15
0.4
12
0.256 [6.5mm]
0.173 [4.4mm]
0.114 [2.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1608-101
100
M,K
0.48
40
100
10
0.3
1
0.256 [6.5mm]
0.173 [4.4mm]
0.114 [2.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1608-151
150
M,K
0.59
40
100
9
0.26
8
0.256 [6.5mm]
0.173 [4.4mm]
0.114 [2.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1608-221
220
M,K
0.77
40
100
6
0.22
7
0.256 [6.5mm]
0.173 [4.4mm]
0.114 [2.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1608-331
330
M,K
1.4
40
100
5
0.2
5
0.256 [6.5mm]
0.173 [4.4mm]
0.114 [2.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1608-471
470
M,K
1.8
40
100
4
0.19
45
0.256 [6.5mm]
0.173 [4.4mm]
0.114 [2.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1608-561
560
M,K
2
40
100
35
0.185
43
0.256 [6.5mm]
0.173 [4.4mm]
0.114 [2.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1608-681
680
M,K
2.2
40
100
3
0.18
4
0.256 [6.5mm]
0.173 [4.4mm]
0.114 [2.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1608-102
1000
M,K
3.4
40
100
2
0.15
28
0.256 [6.5mm]
0.173 [4.4mm]
0.114 [2.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1608-152
1500
M,K
4.2
50
100
2
0.12
24
0.256 [6.5mm]
0.173 [4.4mm]
0.114 [2.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1608-222
2200
M,K
8.5
50
100
2
0.1
2
0.256 [6.5mm]
0.173 [4.4mm]
0.114 [2.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1608-332
3300
M,K
11
50
100
1
0.08
18
0.256 [6.5mm]
0.173 [4.4mm]
0.114 [2.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1608-472
4700
M,K
13.9
50
100
1
0.06
14
0.256 [6.5mm]
0.173 [4.4mm]
0.114 [2.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1608-682
6800
M,K
25
50
100
1
0.04
12
0.256 [6.5mm]
0.173 [4.4mm]
0.114 [2.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1608-103
10000
M,K
32.8
50
100
8
0.02
1
0.256 [6.5mm]
0.173 [4.4mm]
0.114 [2.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7032-2R2
2.2
M,K
0.022
12
7.96
2.6
265
0.276 [7.0mm]
0.276 [7.0mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7032-3R3
3.3
M,K
0.027
16
7.96
2.2
24
0.276 [7.0mm]
0.276 [7.0mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7032-4R7
4.7
M,K
0.042
16
7.96
2
2
0.276 [7.0mm]
0.276 [7.0mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7032-6R8
6.8
M,K
0.054
17
7.96
1.8
16
0.276 [7.0mm]
0.276 [7.0mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7032-100
10
M,K
0.068
25
2.52
1.6
14
0.276 [7.0mm]
0.276 [7.0mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7032-150
15
M,K
0.095
22
2.52
1.2
11
0.276 [7.0mm]
0.276 [7.0mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7032-220
22
M,K
0.135
20
2.52
1.05
96
0.276 [7.0mm]
0.276 [7.0mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7032-330
33
M,K
0.2
23
2.52
0.86
76
0.276 [7.0mm]
0.276 [7.0mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7032-470
47
M,K
0.27
26
2.52
0.7
67
0.276 [7.0mm]
0.276 [7.0mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7032-680
68
M,K
0.38
22
2.52
0.67
6
0.276 [7.0mm]
0.276 [7.0mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7032-101
100
M,K
0.54
28
0.796
0.5
45
0.276 [7.0mm]
0.276 [7.0mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7032-151
150
M,K
0.8
35
0.796
0.38
37
0.276 [7.0mm]
0.276 [7.0mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7032-221
220
M,K
1.3
47
0.796
0.32
3
0.276 [7.0mm]
0.276 [7.0mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7032-331
330
M,K
1.9
46
0.796
0.24
22
0.276 [7.0mm]
0.276 [7.0mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7032-471
470
M,K
2.4
34
0.796
0.2
2
0.276 [7.0mm]
0.276 [7.0mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7032-681
680
M,K
3.75
58
0.796
0.15
16
0.276 [7.0mm]
0.276 [7.0mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7032-102
1000
M,K
5.4
70
0.252
0.14
15
0.276 [7.0mm]
0.276 [7.0mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASBPL7032-2R2
2.2
M,K
0.022
12
7.96
2.6
265
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASBPL7032-3R3
3.3
M,K
0.027
16
7.96
2.2
24
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASBPL7032-4R7
4.7
M,K
0.042
16
7.96
2
2
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASBPL7032-6R8
6.8
M,K
0.054
17
7.96
1.8
16
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASBPL7032-100
10
M,K
0.068
25
2.52
1.6
14
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASBPL7032-150
15
M,K
0.095
22
2.52
1.2
11
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASBPL7032-220
22
M,K
0.135
20
2.52
1.05
96
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASBPL7032-330
33
M,K
0.2
23
2.52
0.86
76
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASBPL7032-470
47
M,K
0.27
26
2.52
0.7
67
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASBPL7032-680
68
M,K
0.38
22
2.52
0.67
6
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASBPL7032-101
100
M,K
0.54
28
0.796
0.5
45
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASBPL7032-151
150
M,K
0.8
35
0.796
0.38
37
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASBPL7032-221
220
M,K
1.3
47
0.796
0.32
3
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASBPL7032-331
330
M,K
1.9
46
0.796
0.24
22
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASBPL7032-471
470
M,K
2.4
34
0.796
0.2
2
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASBPL7032-681
680
M,K
3.75
58
0.796
0.15
16
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
ASBPL7032-102
1000
M,K
5.4
70
0.252
0.14
15
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 150°C for 1000 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 1000 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 1000 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +150°C, 1000 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Mechanical Shock: MIL-STD-202, Method 213, 100g, 6ms, half-sine, 12.3ft/sec, 3X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7045-1R0
1
M,K
0.02
10
7.96
160
6
52
0.276 [7.0mm]
0.276 [7.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7045-2R2
2.2
M,K
0.022
10
7.96
95
4.2
42
0.276 [7.0mm]
0.276 [7.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7045-3R3
3.3
M,K
0.027
12
7.96
90
3.3
35
0.276 [7.0mm]
0.276 [7.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7045-3R9
3.9
M,K
0.03
12
7.96
75
3.2
34
0.276 [7.0mm]
0.276 [7.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7045-4R7
4.7
M,K
0.033
12
7.96
60
2.8
33
0.276 [7.0mm]
0.276 [7.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7045-5R6
5.6
M,K
0.035
12
7.96
50
2.5
32
0.276 [7.0mm]
0.276 [7.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7045-6R8
6.8
M,K
0.036
12
7.96
40
2.4
31
0.276 [7.0mm]
0.276 [7.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7045-8R2
8.2
M,K
0.04
12
7.96
24
2
3
0.276 [7.0mm]
0.276 [7.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7045-100
10
M,K
0.048
40
2.52
23
1.9
27
0.276 [7.0mm]
0.276 [7.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7045-120
12
M,K
0.054
40
2.52
20
1.8
24
0.276 [7.0mm]
0.276 [7.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7045-150
15
M,K
0.062
40
2.52
17
1.5
22
0.276 [7.0mm]
0.276 [7.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7045-180
18
M,K
0.07
40
2.52
16
1.4
21
0.276 [7.0mm]
0.276 [7.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7045-220
22
M,K
0.08
40
2.52
15
1.3
19
0.276 [7.0mm]
0.276 [7.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7045-270
27
M,K
0.1
30
2.52
135
1.15
18
0.276 [7.0mm]
0.276 [7.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7045-330
33
M,K
0.12
30
2.52
11
1
16
0.276 [7.0mm]
0.276 [7.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7045-390
39
M,K
0.13
30
2.52
105
0.95
15
0.276 [7.0mm]
0.276 [7.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7045-470
47
M,K
0.16
30
2.52
10
0.9
14
0.276 [7.0mm]
0.276 [7.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7045-560
56
M,K
0.18
25
2.52
9
0.8
13
0.276 [7.0mm]
0.276 [7.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7045-680
68
M,K
0.21
25
2.52
85
0.75
12
0.276 [7.0mm]
0.276 [7.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7045-820
82
M,K
0.27
25
2.52
65
0.65
11
0.276 [7.0mm]
0.276 [7.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7045-101
100
M,K
0.3
40
0.796
6
0.6
1
0.276 [7.0mm]
0.276 [7.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7045-121
120
M,K
0.38
40
0.796
55
0.55
9
0.276 [7.0mm]
0.276 [7.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7045-151
150
M,K
0.46
40
0.796
5
0.5
8
0.276 [7.0mm]
0.276 [7.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7045-181
180
M,K
0.6
40
0.796
47
0.45
66
0.276 [7.0mm]
0.276 [7.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7045-221
220
M,K
0.69
40
0.796
45
0.4
64
0.276 [7.0mm]
0.276 [7.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7045-271
270
M,K
0.7
40
0.796
4
0.3
62
0.276 [7.0mm]
0.276 [7.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7045-331
330
M,K
0.73
40
0.796
38
0.27
6
0.276 [7.0mm]
0.276 [7.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7045-391
390
M,K
1
50
0.796
36
0.25
54
0.276 [7.0mm]
0.276 [7.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7045-471
470
M,K
1.1
50
0.796
32
0.23
5
0.276 [7.0mm]
0.276 [7.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7045-561
560
M,K
1.34
50
0.796
29
0.21
45
0.276 [7.0mm]
0.276 [7.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7045-681
680
M,K
1.6
50
0.796
25
0.2
4
0.276 [7.0mm]
0.276 [7.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7045-821
820
M,K
1.85
50
0.796
24
0.18
37
0.276 [7.0mm]
0.276 [7.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL7045-102
1000
M,K
2.37
90
0.252
22
0.16
33
0.276 [7.0mm]
0.276 [7.0mm]
0.177 [4.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL6038-1R0
1
M,K
0.018
3.7
4
0.236 [6.0mm]
0.236 [6.0mm]
0.150 [3.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL6038-1R5
1.5
M,K
0.02
3.4
34
0.236 [6.0mm]
0.236 [6.0mm]
0.150 [3.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL6038-2R2
2.2
M,K
0.03
2.7
265
0.236 [6.0mm]
0.236 [6.0mm]
0.150 [3.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL6038-3R3
3.3
M,K
0.033
2.5
22
0.236 [6.0mm]
0.236 [6.0mm]
0.150 [3.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL6038-4R7
4.7
M,K
0.4
2.2
19
0.236 [6.0mm]
0.236 [6.0mm]
0.150 [3.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL6038-6R8
6.8
M,K
0.05
2
16
0.236 [6.0mm]
0.236 [6.0mm]
0.150 [3.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL6038-100
10
M,K
0.65
1.8
13
0.236 [6.0mm]
0.236 [6.0mm]
0.150 [3.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL6038-150
15
M,K
0.1
1.15
11
0.236 [6.0mm]
0.236 [6.0mm]
0.150 [3.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL6038-220
22
M,K
0.15
1
85
0.236 [6.0mm]
0.236 [6.0mm]
0.150 [3.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL6038-330
33
M,K
0.22
0.85
65
0.236 [6.0mm]
0.236 [6.0mm]
0.150 [3.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL6038-470
47
M,K
0.3
0.7
55
0.236 [6.0mm]
0.236 [6.0mm]
0.150 [3.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL6038-680
68
M,K
0.39
0.6
45
0.236 [6.0mm]
0.236 [6.0mm]
0.150 [3.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL6038-101
100
M,K
0.57
0.46
38
0.236 [6.0mm]
0.236 [6.0mm]
0.150 [3.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL6038-151
150
M,K
0.9
0.34
32
0.236 [6.0mm]
0.236 [6.0mm]
0.150 [3.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL6038-221
220
M,K
1.25
0.29
27
0.236 [6.0mm]
0.236 [6.0mm]
0.150 [3.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL6038-331
330
M,K
1.85
0.23
22
0.236 [6.0mm]
0.236 [6.0mm]
0.150 [3.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL6038-471
470
M,K
2.7
0.2
19
0.236 [6.0mm]
0.236 [6.0mm]
0.150 [3.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL6038-681
680
M,K
3.8
0.17
15
0.236 [6.0mm]
0.236 [6.0mm]
0.150 [3.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL6038-102
1000
M,K
5.8
0.14
13
0.236 [6.0mm]
0.236 [6.0mm]
0.150 [3.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL6028-1R0
1
M,K
0.022
3.8
3
0.236 [6.0mm]
0.236 [6.0mm]
0.110 [2.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL6028-1R5
1.5
M,K
0.025
3.2
25
0.236 [6.0mm]
0.236 [6.0mm]
0.110 [2.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL6028-2R2
2.2
M,K
0.032
3
22
0.236 [6.0mm]
0.236 [6.0mm]
0.110 [2.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL6028-3R3
3.3
M,K
0.044
1.92
155
0.236 [6.0mm]
0.236 [6.0mm]
0.110 [2.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL6028-4R7
4.7
M,K
0.05
1.8
135
0.236 [6.0mm]
0.236 [6.0mm]
0.110 [2.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL6028-6R8
6.8
M,K
0.07
1.45
12
0.236 [6.0mm]
0.236 [6.0mm]
0.110 [2.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL6028-100
10
M,K
0.105
1.2
1
0.236 [6.0mm]
0.236 [6.0mm]
0.110 [2.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL6028-150
15
M,K
0.14
1
8
0.236 [6.0mm]
0.236 [6.0mm]
0.110 [2.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL6028-220
22
M,K
0.22
0.8
65
0.236 [6.0mm]
0.236 [6.0mm]
0.110 [2.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL6028-330
33
M,K
0.28
0.65
55
0.236 [6.0mm]
0.236 [6.0mm]
0.110 [2.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL6028-470
47
M,K
0.38
0.55
48
0.236 [6.0mm]
0.236 [6.0mm]
0.110 [2.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL6028-680
68
M,K
0.6
0.45
38
0.236 [6.0mm]
0.236 [6.0mm]
0.110 [2.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL6028-101
100
M,K
0.84
0.38
31
0.236 [6.0mm]
0.236 [6.0mm]
0.110 [2.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL6028-151
150
M,K
1.2
0.3
26
0.236 [6.0mm]
0.236 [6.0mm]
0.110 [2.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL6028-221
220
M,K
1.7
0.25
22
0.236 [6.0mm]
0.236 [6.0mm]
0.110 [2.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL6028-331
330
M,K
2.45
0.2
17
0.236 [6.0mm]
0.236 [6.0mm]
0.110 [2.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL6028-471
470
M,K
3.6
0.17
14
0.236 [6.0mm]
0.236 [6.0mm]
0.110 [2.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL6028-681
680
M,K
5.4
0.13
11
0.236 [6.0mm]
0.236 [6.0mm]
0.110 [2.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL6028-102
1000
M,K
8.2
0.11
9
0.236 [6.0mm]
0.236 [6.0mm]
0.110 [2.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1005-1R0
1
M,K
0.017
25
7.96
120
11
58
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1005-1R5
1.5
M,K
0.02
25
7.96
100
9
53
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1005-2R2
2.2
M,K
0.027
25
7.96
90
7.7
47
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1005-3R0
3
M,K
0.03
25
7.96
80
6.38
42
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1005-4R7
4.7
M,K
0.04
25
7.96
50
5.4
34
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1005-7R0
7
M,K
0.055
22
7.96
32
4.4
28
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1005-100
10
M,K
0.065
48
2.52
30
3.7
27
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1005-120
12
M,K
0.08
45
2.52
25
3.3
26
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1005-150
15
M,K
0.09
40
2.52
20
3
23
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1005-180
18
M,K
0.09
35
2.52
19
2.8
22
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1005-220
22
M,K
0.1
42
2.52
18
2.6
2
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1005-270
27
M,K
0.12
40
2.52
17
2.4
19
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1005-330
33
M,K
0.16
40
2.52
15
2.1
16
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1005-390
39
M,K
0.18
40
2.52
13
1.9
15
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1005-470
47
M,K
0.19
35
2.52
12
1.8
143
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1005-560
56
M,K
0.21
35
2.52
11
1.6
14
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1005-680
68
M,K
0.34
35
2.52
9
1.4
11
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1005-820
82
M,K
0.38
35
2.52
8
1.3
1
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1005-101
100
M,K
0.42
35
0.796
75
1.2
9
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1005-121
120
M,K
0.46
30
0.796
72
1.1
85
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1005-151
150
M,K
0.52
28
0.796
32
1
78
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1005-181
180
M,K
0.7
28
0.796
58
0.9
7
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1005-221
220
M,K
0.8
30
0.796
52
0.8
65
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1005-271
270
M,K
1.1
30
0.796
48
0.7
54
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1005-331
330
M,K
1.2
30
0.796
45
0.65
5
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1005-391
390
M,K
1.4
25
0.796
42
0.6
48
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1005-471
470
M,K
1.6
40
0.796
3
0.55
44
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1005-561
560
M,K
1.8
40
0.796
27
0.5
42
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1005-681
680
M,K
2.3
37
0.796
26
0.47
36
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1005-821
820
M,K
2.6
37
0.796
25
0.42
34
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1005-102
1000
M,K
3.2
65
0.252
2
0.38
3
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1005-122
1200
M,K
3.6
58
0.252
2
0.35
28
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1005-152
1500
M,K
5.2
53
0.252
16
0.3
24
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1005-182
1800
M,K
5.7
65
0.252
14
0.28
22
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1005-222
2200
M,K
6.5
55
0.252
14
0.26
21
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1005-272
2700
M,K
8.6
55
0.252
12
0.23
19
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1005-332
3300
M,K
10
50
0.252
12
0.21
18
0.500 [12.7mm]
0.394 [10.0mm]
0.193 [4.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1003-1R8
1.8
M,K
0.038
10
7.96
V
3
0.500 [12.7mm]
0.398 [10.1mm]
0.106 [2.7mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1003-2R2
2.2
M,K
0.045
11
7.96
3.4
276
0.500 [12.7mm]
0.398 [10.1mm]
0.106 [2.7mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1003-3R0
3
M,K
0.062
11
7.96
2.6
22
0.500 [12.7mm]
0.398 [10.1mm]
0.106 [2.7mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1003-3R9
3.9
M,K
0.07
10
7.96
2.4
21
0.500 [12.7mm]
0.398 [10.1mm]
0.106 [2.7mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1003-4R7
4.7
M,K
0.078
10
7.96
2.3
19
0.500 [12.7mm]
0.398 [10.1mm]
0.106 [2.7mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1003-7R5
7.5
M,K
0.1
10
7.96
1.7
144
0.500 [12.7mm]
0.398 [10.1mm]
0.106 [2.7mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1003-100
10
M,K
0.145
18
2.52
1.5
124
0.500 [12.7mm]
0.398 [10.1mm]
0.106 [2.7mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1003-120
12
M,K
0.185
20
2.52
1.3
11
0.500 [12.7mm]
0.398 [10.1mm]
0.106 [2.7mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1003-150
15
M,K
0.2
20
2.52
1.2
102
0.500 [12.7mm]
0.398 [10.1mm]
0.106 [2.7mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1003-180
18
M,K
0.27
20
2.52
1.1
9
0.500 [12.7mm]
0.398 [10.1mm]
0.106 [2.7mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1003-220
22
M,K
0.3
17
2.52
1
8
0.500 [12.7mm]
0.398 [10.1mm]
0.106 [2.7mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1003-270
27
M,K
0.4
17
2.52
0.9
75
0.500 [12.7mm]
0.398 [10.1mm]
0.106 [2.7mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1003-330
33
M,K
0.45
17
2.52
0.85
7
0.500 [12.7mm]
0.398 [10.1mm]
0.106 [2.7mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1003-390
39
M,K
0.56
18
2.52
0.8
65
0.500 [12.7mm]
0.398 [10.1mm]
0.106 [2.7mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1003-470
47
M,K
0.65
18
2.52
0.72
6
0.500 [12.7mm]
0.398 [10.1mm]
0.106 [2.7mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1003-560
56
M,K
0.68
15
2.52
0.65
52
0.500 [12.7mm]
0.398 [10.1mm]
0.106 [2.7mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1003-680
68
M,K
0.8
15
2.52
0.58
48
0.500 [12.7mm]
0.398 [10.1mm]
0.106 [2.7mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1003-820
82
M,K
1.2
20
2.52
0.52
42
0.500 [12.7mm]
0.398 [10.1mm]
0.106 [2.7mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1003-101
100
M,K
1.4
23
0.796
0.48
4
0.500 [12.7mm]
0.398 [10.1mm]
0.106 [2.7mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1003-121
120
M,K
1.52
22
0.796
0.44
35
0.500 [12.7mm]
0.398 [10.1mm]
0.106 [2.7mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1003-151
150
M,K
1.8
23
0.796
0.4
32
0.500 [12.7mm]
0.398 [10.1mm]
0.106 [2.7mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1003-181
180
M,K
2.2
20
0.796
0.35
28
0.500 [12.7mm]
0.398 [10.1mm]
0.106 [2.7mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1003-221
220
M,K
2.2
20
0.796
0.32
26
0.500 [12.7mm]
0.398 [10.1mm]
0.106 [2.7mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1003-271
270
M,K
3.1
26
0.796
0.28
22
0.500 [12.7mm]
0.398 [10.1mm]
0.106 [2.7mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1003-331
330
M,K
3.6
26
0.796
0.26
2
0.500 [12.7mm]
0.398 [10.1mm]
0.106 [2.7mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1003-391
390
M,K
4.6
28
0.796
0.22
18
0.500 [12.7mm]
0.398 [10.1mm]
0.106 [2.7mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
SBPL1003-471
470
M,K
5.1
28
0.796
0.2
16
0.500 [12.7mm]
0.398 [10.1mm]
0.106 [2.7mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –55°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Burn-In: MIL-PRF-27, temperature +125°C, 96 hours, rated current. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Vibration: MIL-STD-202, Method 204, 10-2000-10Hz, 20 mins, 5g, 12X each axis. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 1.8kg for 60 seconds. Inductor shall have no mechanical damage.
MCPL1030-R16
0.16
M,K
0.00121
88
42
0.429 [10.9mm]
0.425 [10.8mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1030-R30
0.3
M,K
0.0017
68
35
0.429 [10.9mm]
0.425 [10.8mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1030-R56
0.56
M,K
0.00275
44
32
0.429 [10.9mm]
0.425 [10.8mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1030-1R0
1
M,K
0.00495
35
23
0.429 [10.9mm]
0.425 [10.8mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1030-2R2
2.2
M,K
0.013
25
15
0.429 [10.9mm]
0.425 [10.8mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1060-R18
0.18
M,K
0.0006
120
46
0.429 [10.9mm]
0.425 [10.8mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1060-R40
0.4
M,K
0.00088
82
368
0.429 [10.9mm]
0.425 [10.8mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1060-R68
0.68
M,K
0.00155
52
339
0.429 [10.9mm]
0.425 [10.8mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1060-1R2
1.2
M,K
0.00275
43
263
0.429 [10.9mm]
0.425 [10.8mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1060-1R5
1.5
M,K
0.0033
36
244
0.429 [10.9mm]
0.425 [10.8mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1060-2R2
2.2
M,K
0.0044
32
20
0.429 [10.9mm]
0.425 [10.8mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1060-3R3
3.3
M,K
0.0075
26
168
0.429 [10.9mm]
0.425 [10.8mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1060-4R7
4.7
M,K
0.0102
25
14
0.429 [10.9mm]
0.425 [10.8mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1090-1R0
1
M,K
0.00165
40
335
0.429 [10.9mm]
0.425 [10.8mm]
0.354 [9.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1090-2R2
2.2
M,K
0.0025
33
32
0.429 [10.9mm]
0.425 [10.8mm]
0.354 [9.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1090-3R3
3.3
M,K
0.0039
26
25
0.429 [10.9mm]
0.425 [10.8mm]
0.354 [9.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1090-4R7
4.7
M,K
0.006
25
24
0.429 [10.9mm]
0.425 [10.8mm]
0.354 [9.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1090-5R6
5.6
M,K
0.0068
23.6
212
0.429 [10.9mm]
0.425 [10.8mm]
0.354 [9.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1090-6R8
6.8
M,K
0.0084
21.8
185
0.429 [10.9mm]
0.425 [10.8mm]
0.354 [9.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1090-8R2
8.2
M,K
0.0115
18.3
171
0.429 [10.9mm]
0.425 [10.8mm]
0.354 [9.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1090-100
10
M,K
0.0131
17.5
155
0.429 [10.9mm]
0.425 [10.8mm]
0.354 [9.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1090-150
15
M,K
0.017
15.5
138
0.429 [10.9mm]
0.425 [10.8mm]
0.354 [9.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1090-220
22
M,K
0.0245
13.5
118
0.429 [10.9mm]
0.425 [10.8mm]
0.354 [9.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1090-330
33
M,K
0.0399
10.5
9
0.429 [10.9mm]
0.425 [10.8mm]
0.354 [9.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1350-R63
0.63
M,K
0.0017
74.5
37
0.583 [14.8mm]
0.543 [13.8mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1350-R93
0.93
M,K
0.0022
60.5
33
0.583 [14.8mm]
0.543 [13.8mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1350-1R0
1
M,K
0.0023
58.5
32
0.583 [14.8mm]
0.543 [13.8mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1350-1R3
1.3
M,K
0.0027
56.5
31
0.583 [14.8mm]
0.543 [13.8mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1350-1R5
1.5
M,K
0.0035
50.5
30
0.583 [14.8mm]
0.543 [13.8mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1350-2R2
2.2
M,K
0.0048
46.5
24
0.583 [14.8mm]
0.543 [13.8mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1350-3R0
3
M,K
0.0065
37.5
21
0.583 [14.8mm]
0.543 [13.8mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1508-1R0
1
M,K
0.001
73.5
575
0.657 [16.7mm]
0.618 [15.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1508-1R3
1.3
M,K
0.0014
65
467
0.657 [16.7mm]
0.618 [15.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1508-1R8
1.8
M,K
0.0018
57
438
0.657 [16.7mm]
0.618 [15.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1508-2R0
2
M,K
0.0021
51
399
0.657 [16.7mm]
0.618 [15.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1508-3R0
3
M,K
0.003
43
344
0.657 [16.7mm]
0.618 [15.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1508-3R3
3.3
M,K
0.0032
43
31
0.657 [16.7mm]
0.618 [15.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1508-4R5
4.5
M,K
0.0042
34.2
27
0.657 [16.7mm]
0.618 [15.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1508-5R3
5.3
M,K
0.0047
33
265
0.657 [16.7mm]
0.618 [15.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1508-6R1
6.1
M,K
0.00585
31
226
0.657 [16.7mm]
0.618 [15.7mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1510-1R0
1
M,K
0.0011
80
58
0.657 [16.7mm]
0.618 [15.7mm]
0.433 [11.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1510-3R3
3.3
M,K
0.0031
43
35
0.657 [16.7mm]
0.618 [15.7mm]
0.433 [11.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1510-4R7
4.7
M,K
0.004
39
29
0.657 [16.7mm]
0.618 [15.7mm]
0.433 [11.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1510-5R6
5.6
M,K
0.0042
37
28
0.657 [16.7mm]
0.618 [15.7mm]
0.433 [11.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1510-6R8
6.8
M,K
0.0047
36
26
0.657 [16.7mm]
0.618 [15.7mm]
0.433 [11.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1510-8R2
8.2
M,K
0.0069
30
24
0.657 [16.7mm]
0.618 [15.7mm]
0.433 [11.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1510-100
10
M,K
0.0075
26.3
22
0.657 [16.7mm]
0.618 [15.7mm]
0.433 [11.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1510-150
15
M,K
0.013
23
18
0.657 [16.7mm]
0.618 [15.7mm]
0.433 [11.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1510-220
22
M,K
0.015
18.7
14
0.657 [16.7mm]
0.618 [15.7mm]
0.433 [11.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL1510-330
33
M,K
0.021
16.7
12
0.657 [16.7mm]
0.618 [15.7mm]
0.433 [11.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL4020-R47
0.04
M,K
0.00155
40
34
0.177 [4.5mm]
0.177 [4.5mm]
0.087 [2.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL4020-R22
0.22
M,K
0.0038
16
155
0.177 [4.5mm]
0.177 [4.5mm]
0.087 [2.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL4020-R47
0.47
M,K
0.0067
10.5
125
0.177 [4.5mm]
0.177 [4.5mm]
0.087 [2.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL4020-R56
0.56
M,K
0.008
10.3
12
0.177 [4.5mm]
0.177 [4.5mm]
0.087 [2.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL4020-R68
0.68
M,K
0.0086
8.6
107
0.177 [4.5mm]
0.177 [4.5mm]
0.087 [2.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL4020-R82
0.82
M,K
0.011
7.4
103
0.177 [4.5mm]
0.177 [4.5mm]
0.087 [2.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL4020-1R0
1
M,K
0.0135
7
86
0.177 [4.5mm]
0.177 [4.5mm]
0.087 [2.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL4020-1R2
1.2
M,K
0.016
6.7
83
0.177 [4.5mm]
0.177 [4.5mm]
0.087 [2.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL4020-1R5
1.5
M,K
0.0185
5.5
81
0.177 [4.5mm]
0.177 [4.5mm]
0.087 [2.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL4020-2R2
2.2
M,K
0.0235
5.2
72
0.177 [4.5mm]
0.177 [4.5mm]
0.087 [2.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL4030-R33
0.33
M,K
0.004
16.3
175
0.177 [4.5mm]
0.177 [4.5mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL4030-R47
0.47
M,K
0.0045
13
156
0.177 [4.5mm]
0.177 [4.5mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL4030-R56
0.56
M,K
0.0056
11.9
14
0.177 [4.5mm]
0.177 [4.5mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL4030-1R0
1
M,K
0.0098
8.1
91
0.177 [4.5mm]
0.177 [4.5mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL4030-1R2
1.2
M,K
0.0108
8
89
0.177 [4.5mm]
0.177 [4.5mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL4030-1R5
1.5
M,K
0.0129
7
81
0.177 [4.5mm]
0.177 [4.5mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL4030-2R2
2.2
M,K
0.0198
5.6
76
0.177 [4.5mm]
0.177 [4.5mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL4030-3R3
3.3
M,K
0.0255
5
63
0.177 [4.5mm]
0.177 [4.5mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL4030-4R7
4.7
M,K
0.037
4
54
0.177 [4.5mm]
0.177 [4.5mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL4040-3R3
3.3
M,K
0.025
5.2
66
0.177 [4.5mm]
0.177 [4.5mm]
0.161 [4.1mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL4040-4R7
4.7
M,K
0.035
4.7
6
0.177 [4.5mm]
0.177 [4.5mm]
0.161 [4.1mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL4040-5R6
5.6
M,K
0.0445
4.3
56
0.177 [4.5mm]
0.177 [4.5mm]
0.161 [4.1mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL4040-6R8
6.8
M,K
0.055
3.6
5
0.177 [4.5mm]
0.177 [4.5mm]
0.161 [4.1mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL5020-R16
0.16
M,K
0.0038
24.5
18
0.226 [5.75mm]
0.226 [5.75mm]
0.087 [2.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL5020-R33
0.33
M,K
0.0043
17
167
0.226 [5.75mm]
0.226 [5.75mm]
0.087 [2.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL5020-R56
0.56
M,K
0.0062
12.2
126
0.226 [5.75mm]
0.226 [5.75mm]
0.087 [2.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL5020-R68
0.68
M,K
0.0088
11.7
108
0.226 [5.75mm]
0.226 [5.75mm]
0.087 [2.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL5020-1R0
1
M,K
0.0093
9.5
96
0.226 [5.75mm]
0.226 [5.75mm]
0.087 [2.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL5020-1R2
1.2
M,K
0.0135
8.7
9
0.226 [5.75mm]
0.226 [5.75mm]
0.087 [2.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL5030-R16
0.16
M,K
0.0027
28.5
20
0.226 [5.75mm]
0.226 [5.75mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL5030-R33
0.33
M,K
0.0039
22
175
0.226 [5.75mm]
0.226 [5.75mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL5030-R47
0.47
M,K
0.0045
20.3
168
0.226 [5.75mm]
0.226 [5.75mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL5030-R56
0.56
M,K
0.0046
19.1
162
0.226 [5.75mm]
0.226 [5.75mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL5030-R68
0.68
M,K
0.0049
12.5
136
0.226 [5.75mm]
0.226 [5.75mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL5030-1R0
1
M,K
0.0083
11.5
108
0.226 [5.75mm]
0.226 [5.75mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL5030-1R2
1.2
M,K
0.0088
11
105
0.226 [5.75mm]
0.226 [5.75mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL5030-1R8
1.8
M,K
0.0112
9.6
98
0.226 [5.75mm]
0.226 [5.75mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL5030-2R2
2.2
M,K
0.0145
8.5
88
0.226 [5.75mm]
0.226 [5.75mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL5030-3R3
3.3
M,K
0.0199
7
82
0.226 [5.75mm]
0.226 [5.75mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL5030-4R7
4.7
M,K
0.028
5.4
71
0.226 [5.75mm]
0.226 [5.75mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL5050-R16
0.16
M,K
0.0027
28.5
20
0.226 [5.75mm]
0.226 [5.75mm]
0.201 [5.1mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL5050-R33
0.33
M,K
0.0039
22
175
0.226 [5.75mm]
0.226 [5.75mm]
0.201 [5.1mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL5050-R47
0.47
M,K
0.0045
20.3
168
0.226 [5.75mm]
0.226 [5.75mm]
0.201 [5.1mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL5050-R56
0.56
M,K
0.0046
19.1
162
0.226 [5.75mm]
0.226 [5.75mm]
0.201 [5.1mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL5050-R68
0.68
M,K
0.0049
12.5
136
0.226 [5.75mm]
0.226 [5.75mm]
0.201 [5.1mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL5050-1R0
1
M,K
0.0083
11.5
108
0.226 [5.75mm]
0.226 [5.75mm]
0.201 [5.1mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL5050-1R2
1.2
M,K
0.0088
11
105
0.226 [5.75mm]
0.226 [5.75mm]
0.201 [5.1mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL5050-1R8
1.8
M,K
0.0112
9.6
98
0.226 [5.75mm]
0.226 [5.75mm]
0.201 [5.1mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL5050-2R2
2.2
M,K
0.0145
8.5
88
0.226 [5.75mm]
0.226 [5.75mm]
0.201 [5.1mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL5050-3R3
3.3
M,K
0.0199
7
82
0.226 [5.75mm]
0.226 [5.75mm]
0.201 [5.1mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL5050-4R7
4.7
M,K
0.028
5.4
71
0.226 [5.75mm]
0.226 [5.75mm]
0.201 [5.1mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL6030-R18
0.18
M,K
0.0015
39
32
0.270 [6.85mm]
0.270 [6.85mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL6030-R33
0.3
M,K
0.0025
30
25
0.270 [6.85mm]
0.270 [6.85mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL6030-R47
0.47
M,K
0.0031
29.5
23
0.270 [6.85mm]
0.270 [6.85mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL5030-R56
0.56
M,K
0.0035
29
22
0.270 [6.85mm]
0.270 [6.85mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL5030-R68
0.68
M,K
0.0047
25
20
0.270 [6.85mm]
0.270 [6.85mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL5030-1R0
1
M,K
0.0065
23
18
0.270 [6.85mm]
0.270 [6.85mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL5030-1R2
1.2
M,K
0.00704
22
16
0.270 [6.85mm]
0.270 [6.85mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL5030-1R8
1.8
M,K
0.0105
18.2
14
0.270 [6.85mm]
0.270 [6.85mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL5030-2R2
2.2
M,K
0.0125
15.9
10
0.270 [6.85mm]
0.270 [6.85mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL5030-3R3
3.3
M,K
0.023
12.2
8
0.270 [6.85mm]
0.270 [6.85mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL6030-4R7
4.7
M,K
0.0355
8
65
0.270 [6.85mm]
0.270 [6.85mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL6060-2R2
2.2
M,K
0.00714
16
16
0.270 [6.85mm]
0.270 [6.85mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL6060-3R3
3.3
M,K
0.012
12
12
0.270 [6.85mm]
0.270 [6.85mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL6060-4R7
4.7
M,K
0.015
10.5
11
0.270 [6.85mm]
0.270 [6.85mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL6060-5R6
5.6
M,K
0.0173
0
10
0.270 [6.85mm]
0.270 [6.85mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL6060-6R8
6.8
M,K
0.0202
9.2
9
0.270 [6.85mm]
0.270 [6.85mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL6060-8R2
8.2
M,K
0.0275
8.4
8
0.270 [6.85mm]
0.270 [6.85mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL6060-100
10
M,K
0.0305
7.6
7
0.270 [6.85mm]
0.270 [6.85mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL6060-150
15
M,K
0.0483
6
55
0.270 [6.85mm]
0.270 [6.85mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL7030-R16
0.16
M,K
0.00126
60
325
0.319 [8.1mm]
0.307 [7.8mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL7030-R30
0.3
M,K
0.00192
41
276
0.319 [8.1mm]
0.307 [7.8mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL7030-R60
0.6
M,K
0.004
36
23
0.319 [8.1mm]
0.307 [7.8mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL7030-1R0
1
M,K
0.0055
28
218
0.319 [8.1mm]
0.307 [7.8mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL7030-1R5
1.5
M,K
0.00836
23.5
15
0.319 [8.1mm]
0.307 [7.8mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL7030-2R2
2.2
M,K
0.0121
18
129
0.319 [8.1mm]
0.307 [7.8mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL7030-2R7
2.7
M,K
0.0141
13
114
0.319 [8.1mm]
0.307 [7.8mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL7030-3R3
3.3
M,K
0.0185
12.3
10
0.319 [8.1mm]
0.307 [7.8mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL7030-4R7
4.7
M,K
0.0276
10.1
9
0.319 [8.1mm]
0.307 [7.8mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL7030-5R6
5.6
M,K
0.0316
9.8
73
0.319 [8.1mm]
0.307 [7.8mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL7030-6R8
6.8
M,K
0.0375
8.7
68
0.319 [8.1mm]
0.307 [7.8mm]
0.126 [3.2mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL7070-R80
0.8
M,K
0.00239
37.8
258
0.319 [8.1mm]
0.307 [7.8mm]
0.276 [7.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL7070-1R0
1
M,K
0.00265
34.8
25
0.319 [8.1mm]
0.307 [7.8mm]
0.276 [7.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL7070-1R2
1.2
M,K
0.0033
31.2
216
0.319 [8.1mm]
0.307 [7.8mm]
0.276 [7.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL7070-1R8
1.8
M,K
0.0048
25
21
0.319 [8.1mm]
0.307 [7.8mm]
0.276 [7.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL7070-2R2
2.2
M,K
0.00645
19.6
178
0.319 [8.1mm]
0.307 [7.8mm]
0.276 [7.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL7070-3R3
3.3
M,K
0.0087
19.4
151
0.319 [8.1mm]
0.307 [7.8mm]
0.276 [7.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL7070-4R7
4.7
M,K
0.0138
15.2
136
0.319 [8.1mm]
0.307 [7.8mm]
0.276 [7.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL7070-5R6
5.6
M,K
0.014
13
114
0.319 [8.1mm]
0.307 [7.8mm]
0.276 [7.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL7070-6R8
6.8
M,K
0.0195
12.8
92
0.319 [8.1mm]
0.307 [7.8mm]
0.276 [7.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL8050-1R0
1
M,K
0.00415
41
295
0.354 [9.0mm]
0.335 [8.5mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL8050-1R5
1.5
M,K
0.0057
29.5
28
0.354 [9.0mm]
0.335 [8.5mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL8050-2R2
2.2
M,K
0.00815
27
20
0.354 [9.0mm]
0.335 [8.5mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL8050-3R3
3.3
M,K
0.0125
18.5
18
0.354 [9.0mm]
0.335 [8.5mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL8050-4R7
4.7
M,K
0.0164
15
14
0.354 [9.0mm]
0.335 [8.5mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL8050-100
10
M,K
0.0455
9.5
85
0.354 [9.0mm]
0.335 [8.5mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL8050-150
15
M,K
0.0575
8.5
8
0.354 [9.0mm]
0.335 [8.5mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL8050-220
22
M,K
0.0685
7
7
0.354 [9.0mm]
0.335 [8.5mm]
0.197 [5.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL8080-R68
0.68
M,K
0.00175
38
37
0.354 [9.0mm]
0.335 [8.5mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL8080-1R0
1
M,K
0.00232
31
34
0.354 [9.0mm]
0.335 [8.5mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL8080-1R5
1.5
M,K
0.0035
28
28
0.354 [9.0mm]
0.335 [8.5mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL8080-2R2
2.2
M,K
0.00425
24
215
0.354 [9.0mm]
0.335 [8.5mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL8080-3R3
3.3
M,K
0.0075
20
18
0.354 [9.0mm]
0.335 [8.5mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL8080-4R7
4.7
M,K
0.00954
17.4
146
0.354 [9.0mm]
0.335 [8.5mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL8080-6R8
6.8
M,K
0.0145
14
11
0.354 [9.0mm]
0.335 [8.5mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL8080-100
10
M,K
0.022
11
9
0.354 [9.0mm]
0.335 [8.5mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL8080-150
15
M,K
0.028
9
85
0.354 [9.0mm]
0.335 [8.5mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
MCPL8080-220
22
M,K
0.0345
7.5
7
0.354 [9.0mm]
0.335 [8.5mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
HCPL1030-R20
0.2
M,K
0.00095
65
22
0.441 [11.20mm]
0.402 [10.20mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1030-R47
0.47
M,K
0.0025
40
18
0.441 [11.20mm]
0.402 [10.20mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1030-1R0
1
M,K
0.0047
25
15
0.441 [11.20mm]
0.402 [10.20mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1030-1R5
1.5
M,K
0.0076
22
12
0.441 [11.20mm]
0.402 [10.20mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1030-2R2
2.2
M,K
0.0133
18
9
0.441 [11.20mm]
0.402 [10.20mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1030-2R5
2.5
M,K
0.0133
15
9
0.441 [11.20mm]
0.402 [10.20mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1040-1R0
1
M,K
0.0035
41
16
0.441 [11.20mm]
0.402 [10.20mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1040-1R5
1.5
M,K
0.0055
33
14
0.441 [11.20mm]
0.402 [10.20mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1040-2R2
2.2
M,K
0.0079
28
11
0.441 [11.20mm]
0.402 [10.20mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1040-2R7
2.7
M,K
0.0079
22
11
0.441 [11.20mm]
0.402 [10.20mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1040-3R5
3.5
M,K
0.01
19
95
0.441 [11.20mm]
0.402 [10.20mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1040-4R5
4.5
M,K
0.013
16
8
0.441 [11.20mm]
0.402 [10.20mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1040-5R6
5.6
M,K
0.0158
14.5
72
0.441 [11.20mm]
0.402 [10.20mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1040-6R8
6.8
M,K
0.0236
13
56
0.441 [11.20mm]
0.402 [10.20mm]
0.157 [4.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1050-R82
0.82
M,K
0.0015
36
23
0.441 [11.20mm]
0.402 [10.20mm]
0.185 [4.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1050-1R2
1.2
M,K
0.00235
32
19
0.441 [11.20mm]
0.402 [10.20mm]
0.185 [4.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1050-1R8
1.8
M,K
0.00345
27
17
0.441 [11.20mm]
0.402 [10.20mm]
0.185 [4.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1050-2R5
2.5
M,K
0.0047
23
15
0.441 [11.20mm]
0.402 [10.20mm]
0.185 [4.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1050-3R3
3.3
M,K
0.0065
19
13
0.441 [11.20mm]
0.402 [10.20mm]
0.185 [4.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1050-4R2
4.2
M,K
0.0085
17
11
0.441 [11.20mm]
0.402 [10.20mm]
0.185 [4.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1050-5R6
5.6
M,K
0.0099
14
103
0.441 [11.20mm]
0.402 [10.20mm]
0.185 [4.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1050-6R8
6.8
M,K
0.0121
12.5
9
0.441 [11.20mm]
0.402 [10.20mm]
0.185 [4.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1050-8R2
8.2
M,K
0.0151
11.5
81
0.441 [11.20mm]
0.402 [10.20mm]
0.185 [4.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1050-100
10
M,K
0.0189
10.2
71
0.441 [11.20mm]
0.402 [10.20mm]
0.185 [4.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1060-1R0
1
M,K
0.0019
40
21
0.441 [11.20mm]
0.402 [10.20mm]
0.224 [5.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1060-1R5
1.5
M,K
0.00285
34
19
0.441 [11.20mm]
0.402 [10.20mm]
0.224 [5.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1060-2R2
2.2
M,K
0.0042
29
16
0.441 [11.20mm]
0.402 [10.20mm]
0.224 [5.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1060-2R9
2.9
M,K
0.00515
26
14
0.441 [11.20mm]
0.402 [10.20mm]
0.224 [5.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1060-3R8
3.8
M,K
0.0068
22
12
0.441 [11.20mm]
0.402 [10.20mm]
0.224 [5.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1060-4R7
4.7
M,K
0.0082
21
108
0.441 [11.20mm]
0.402 [10.20mm]
0.224 [5.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1060-5R6
5.6
M,K
0.0106
18
96
0.441 [11.20mm]
0.402 [10.20mm]
0.224 [5.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1060-6R8
6.8
M,K
0.0125
16.5
87
0.441 [11.20mm]
0.402 [10.20mm]
0.224 [5.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1060-8R2
8.2
M,K
0.0156
15
78
0.441 [11.20mm]
0.402 [10.20mm]
0.224 [5.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1060-100
10
M,K
0.0187
12.5
62
0.441 [11.20mm]
0.402 [10.20mm]
0.224 [5.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1060-150
15
M,K
0.024
10.5
56
0.441 [11.20mm]
0.402 [10.20mm]
0.224 [5.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1060-220
22
M,K
0.0363
8.8
45
0.441 [11.20mm]
0.402 [10.20mm]
0.224 [5.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1060-270
27
M,K
0.0485
8
4
0.441 [11.20mm]
0.402 [10.20mm]
0.224 [5.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1235-R68
0.68
M,K
0.00182
45
22
0.543 [13.80mm]
0.504 [12.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1235-1R5
1.2
M,K
0.00335
32
17
0.543 [13.80mm]
0.504 [12.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1235-2R2
2.2
M,K
0.006555
22
14
0.543 [13.80mm]
0.504 [12.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1235-3R3
3.3
M,K
0.00645
18
12
0.543 [13.80mm]
0.504 [12.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1235-4R7
4.7
M,K
0.0135
15.2
9
0.543 [13.80mm]
0.504 [12.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1235-5R6
5.6
M,K
0.0219
14.5
68
0.543 [13.80mm]
0.504 [12.80mm]
0.126 [3.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1250-R82
0.82
M,K
0.00185
55
27
0.543 [13.80mm]
0.504 [12.80mm]
0.185 [4.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1250-1R0
1
M,K
0.00165
51
25
0.543 [13.80mm]
0.504 [12.80mm]
0.185 [4.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1250-1R6
1.6
M,K
0.00265
43
22
0.543 [13.80mm]
0.504 [12.80mm]
0.185 [4.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1250-2R2
2.2
M,K
0.00388
35
18
0.543 [13.80mm]
0.504 [12.80mm]
0.185 [4.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1250-3R3
3.3
M,K
0.00535
30
165
0.543 [13.80mm]
0.504 [12.80mm]
0.185 [4.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1250-4R5
4.5
M,K
0.0075
26
14
0.543 [13.80mm]
0.504 [12.80mm]
0.185 [4.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1250-5R6
5.6
M,K
0.0092
23
12
0.543 [13.80mm]
0.504 [12.80mm]
0.185 [4.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1250-6R8
6.8
M,K
0.0118
20.5
11
0.543 [13.80mm]
0.504 [12.80mm]
0.185 [4.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1250-8R2
8.2
M,K
0.0138
17.5
103
0.543 [13.80mm]
0.504 [12.80mm]
0.185 [4.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1250-100
10
M,K
0.0155
16
88
0.543 [13.80mm]
0.504 [12.80mm]
0.185 [4.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1265-1R3
1.3
M,K
0.00195
50
25
0.543 [13.80mm]
0.504 [12.80mm]
0.244 [6.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1265-2R0
2
M,K
0.0026
41
23
0.543 [13.80mm]
0.504 [12.80mm]
0.244 [6.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1265-2R7
2.7
M,K
0.00375
35
20
0.543 [13.80mm]
0.504 [12.80mm]
0.244 [6.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1265-3R6
3.6
M,K
0.00485
30
17
0.543 [13.80mm]
0.504 [12.80mm]
0.244 [6.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1265-4R7
4.7
M,K
0.00625
27
14
0.543 [13.80mm]
0.504 [12.80mm]
0.244 [6.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1265-5R8
5.8
M,K
0.00797
24
135
0.543 [13.80mm]
0.504 [12.80mm]
0.244 [6.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1265-7R3
7.3
M,K
0.0065
18.5
13
0.543 [13.80mm]
0.504 [12.80mm]
0.244 [6.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1265-9R2
9.2
M,K
0.00835
16.3
12
0.543 [13.80mm]
0.504 [12.80mm]
0.244 [6.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1265-110
11
M,K
0.0102
15
11
0.543 [13.80mm]
0.504 [12.80mm]
0.244 [6.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1265-130
13
M,K
0.0117
13.5
10
0.543 [13.80mm]
0.504 [12.80mm]
0.244 [6.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1265-150
15
M,K
0.0141
12.5
9
0.543 [13.80mm]
0.504 [12.80mm]
0.244 [6.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1265-180
18
M,K
0.0175
11.2
85
0.543 [13.80mm]
0.504 [12.80mm]
0.244 [6.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1265-220
22
M,K
0.0215
10.7
8
0.543 [13.80mm]
0.504 [12.80mm]
0.244 [6.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1265-270
27
M,K
0.0275
9.5
65
0.543 [13.80mm]
0.504 [12.80mm]
0.244 [6.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1265-330
33
M,K
0.0303
8.8
55
0.543 [13.80mm]
0.504 [12.80mm]
0.244 [6.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1265-390
39
M,K
0.0465
8
45
0.543 [13.80mm]
0.504 [12.80mm]
0.244 [6.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1265-470
47
M,K
0.0627
7.2
4
0.543 [13.80mm]
0.504 [12.80mm]
0.244 [6.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1275-1R0
1
M,K
0.001
68
32
0.543 [13.80mm]
0.504 [12.80mm]
0.287 [7.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1275-1R5
1.5
M,K
0.00161
54
28
0.543 [13.80mm]
0.504 [12.80mm]
0.287 [7.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1275-2R2
2.2
M,K
0.00245
45
24
0.543 [13.80mm]
0.504 [12.80mm]
0.287 [7.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1275-3R3
3.3
M,K
0.0031
37
22
0.543 [13.80mm]
0.504 [12.80mm]
0.287 [7.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1275-4R7
4.7
M,K
0.00425
30
19
0.543 [13.80mm]
0.504 [12.80mm]
0.287 [7.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1275-5R6
5.6
M,K
0.0053
27
17
0.543 [13.80mm]
0.504 [12.80mm]
0.287 [7.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1275-6R8
6.8
M,K
0.00695
25.5
14
0.543 [13.80mm]
0.504 [12.80mm]
0.287 [7.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1275-8R2
8.2
M,K
0.0081
23
12
0.543 [13.80mm]
0.504 [12.80mm]
0.287 [7.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1275-100
10
M,K
0.0101
21
11
0.543 [13.80mm]
0.504 [12.80mm]
0.287 [7.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1275-120
12
M,K
0.0117
19.5
10
0.543 [13.80mm]
0.504 [12.80mm]
0.287 [7.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1275-150
15
M,K
0.0138
16
93
0.543 [13.80mm]
0.504 [12.80mm]
0.287 [7.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1275-180
18
M,K
0.0167
14.5
85
0.543 [13.80mm]
0.504 [12.80mm]
0.287 [7.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1275-220
22
M,K
0.0178
12
8
0.543 [13.80mm]
0.504 [12.80mm]
0.287 [7.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1275-270
27
M,K
0.0265
11.4
7
0.543 [13.80mm]
0.504 [12.80mm]
0.287 [7.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1275-330
33
M,K
0.0325
10.6
3
0.543 [13.80mm]
0.504 [12.80mm]
0.287 [7.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1275-390
39
M,K
0.036
9
55
0.543 [13.80mm]
0.504 [12.80mm]
0.287 [7.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1275-470
47
M,K
0.046
8.2
5
0.543 [13.80mm]
0.504 [12.80mm]
0.287 [7.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1275-560
56
M,K
0.069
7.5
4
0.543 [13.80mm]
0.504 [12.80mm]
0.287 [7.30mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1809-1R3
1.3
M,K
0.001
67
36
0.760 [19.30mm]
0.717 [18.20mm]
0.360 [8.90mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1809-2R0
2
M,K
0.0014
58
325
0.760 [19.30mm]
0.717 [18.20mm]
0.360 [8.90mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1809-2R7
2.7
M,K
0.00185
50
315
0.760 [19.30mm]
0.717 [18.20mm]
0.360 [8.90mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1809-3R6
3.6
M,K
0.0026
43
25
0.760 [19.30mm]
0.717 [18.20mm]
0.360 [8.90mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1809-4R7
4.7
M,K
0.0035
39
225
0.760 [19.30mm]
0.717 [18.20mm]
0.360 [8.90mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1809-5R6
5.6
M,K
0.0037
35
21
0.760 [19.30mm]
0.717 [18.20mm]
0.360 [8.90mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1809-6R8
6.8
M,K
0.0047
31
185
0.760 [19.30mm]
0.717 [18.20mm]
0.360 [8.90mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1809-8R5
8.5
M,K
0.00555
28
18
0.760 [19.30mm]
0.717 [18.20mm]
0.360 [8.90mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1809-100
10
M,K
0.0069
26
16
0.760 [19.30mm]
0.717 [18.20mm]
0.360 [8.90mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1809-150
15
M,K
0.0095
22
14
0.760 [19.30mm]
0.717 [18.20mm]
0.360 [8.90mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1809-220
22
M,K
0.0141
17.5
11
0.760 [19.30mm]
0.717 [18.20mm]
0.360 [8.90mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1809-330
33
M,K
0.023
14
85
0.760 [19.30mm]
0.717 [18.20mm]
0.360 [8.90mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1809-470
47
M,K
0.0388
11.5
68
0.760 [19.30mm]
0.717 [18.20mm]
0.360 [8.90mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL1809-560
56
M,K
0.0415
10.8
65
0.760 [19.30mm]
0.717 [18.20mm]
0.360 [8.90mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL2212-3R3
3.3
M,K
0.0012
70
32
0.886 [22.50mm]
0.866 [22.00mm]
0.472 [12.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL2212-4R7
4.7
M,K
0.0017
58
30
0.886 [22.50mm]
0.866 [22.00mm]
0.472 [12.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL2212-6R8
6.8
M,K
0.0027
48
26
0.886 [22.50mm]
0.866 [22.00mm]
0.472 [12.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL2212-8R2
8.2
M,K
0.0032
45
24
0.886 [22.50mm]
0.866 [22.00mm]
0.472 [12.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL2212-100
10
M,K
0.0039
40
21
0.886 [22.50mm]
0.866 [22.00mm]
0.472 [12.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL2212-120
12
M,K
0.0048
37
195
0.886 [22.50mm]
0.866 [22.00mm]
0.472 [12.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL2212-150
15
M,K
0.0055
32
18
0.886 [22.50mm]
0.866 [22.00mm]
0.472 [12.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL2212-220
22
M,K
0.0083
27
15
0.886 [22.50mm]
0.866 [22.00mm]
0.472 [12.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL2212-330
33
M,K
0.0135
22
115
0.886 [22.50mm]
0.866 [22.00mm]
0.472 [12.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL2212-390
39
M,K
0.0198
20.5
95
0.886 [22.50mm]
0.866 [22.00mm]
0.472 [12.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL2212-470
47
M,K
0.0214
18.5
9
0.886 [22.50mm]
0.866 [22.00mm]
0.472 [12.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL2212-560
56
M,K
0.0233
17
82
0.886 [22.50mm]
0.866 [22.00mm]
0.472 [12.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL2212-680
68
M,K
0.0303
15
75
0.886 [22.50mm]
0.866 [22.00mm]
0.472 [12.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL2212-820
82
M,K
0.0337
13.8
7
0.886 [22.50mm]
0.866 [22.00mm]
0.472 [12.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL2212-101
100
M,K
0.0408
12.5
61
0.886 [22.50mm]
0.866 [22.00mm]
0.472 [12.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL5030-R20
0.2
M,K
0.0018
23
19
0.232 [5.90mm]
0.209 [5.30mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL5030-R36
0.36
M,K
0.0033
15
14
0.232 [5.90mm]
0.209 [5.30mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL5030-R60
0.6
M,K
0.0051
12.2
12
0.232 [5.90mm]
0.209 [5.30mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL5030-R90
0.85
M,K
0.00815
10
9
0.232 [5.90mm]
0.209 [5.30mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL5030-1R2
1.2
M,K
0.0119
8
75
0.232 [5.90mm]
0.209 [5.30mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL5030-1R6
1.6
M,K
0.0163
7.3
65
0.232 [5.90mm]
0.209 [5.30mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL5030-2R0
2
M,K
0.02
6.5
6
0.232 [5.90mm]
0.209 [5.30mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL5050-R82
0.82
M,K
0.0042
14
14
0.232 [5.90mm]
0.209 [5.30mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL5050-1R1
1.1
M,K
0.0057
12
12
0.232 [5.90mm]
0.209 [5.30mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL5050-1R7
1.7
M,K
0.00925
9.3
93
0.232 [5.90mm]
0.209 [5.30mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL5050-2R1
2.1
M,K
0.0116
8.2
82
0.232 [5.90mm]
0.209 [5.30mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL5050-3R4
3.4
M,K
0.0189
6.5
65
0.232 [5.90mm]
0.209 [5.30mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL5050-4R6
4.6
M,K
0.024
5.6
56
0.232 [5.90mm]
0.209 [5.30mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL5050-5R8
5.8
M,K
0.0385
5
45
0.232 [5.90mm]
0.209 [5.30mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL5050-6R8
6.8
M,K
0.0405
4.3
43
0.232 [5.90mm]
0.209 [5.30mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL5050-8R2
8.2
M,K
0.047
3.8
38
0.232 [5.90mm]
0.209 [5.30mm]
0.197 [5.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL6030-R10
0.1
M,K
0.0009
70
23
0.276 [7.00mm]
0.272 [6.90mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL6030-R22
0.22
M,K
0.0019
48
19
0.276 [7.00mm]
0.272 [6.90mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL6030-R47
0.47
M,K
0.004
34
145
0.276 [7.00mm]
0.272 [6.90mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL6030-1R0
1
M,K
0.0065
18.5
115
0.276 [7.00mm]
0.272 [6.90mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL6030-1R5
1.5
M,K
0.0091
15
87
0.276 [7.00mm]
0.272 [6.90mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL6030-2R2
2.2
M,K
0.0124
12
78
0.276 [7.00mm]
0.272 [6.90mm]
0.118 [3.00mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL6040-R68
0.68
M,K
0.0032
30
175
0.276 [7.00mm]
0.272 [6.90mm]
0.146 [3.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL6040-1R0
1
M,K
0.0045
24
155
0.276 [7.00mm]
0.272 [6.90mm]
0.146 [3.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL6040-1R5
1.5
M,K
0.0062
18
115
0.276 [7.00mm]
0.272 [6.90mm]
0.146 [3.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL6040-2R2
2.2
M,K
0.0121
16
9
0.276 [7.00mm]
0.272 [6.90mm]
0.146 [3.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL6040-3R5
3.5
M,K
0.0173
14
68
0.276 [7.00mm]
0.272 [6.90mm]
0.146 [3.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL6040-4R7
4.7
M,K
0.0212
11
64
0.276 [7.00mm]
0.272 [6.90mm]
0.146 [3.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL6040-5R6
5.6
M,K
0.023
9.5
55
0.276 [7.00mm]
0.272 [6.90mm]
0.146 [3.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL6040-6R5
6.5
M,K
0.0362
8.2
46
0.276 [7.00mm]
0.272 [6.90mm]
0.146 [3.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL6050-1R0
1
M,K
0.0041
27
15
0.276 [7.00mm]
0.272 [6.90mm]
0.185 [4.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL6050-1R5
1.5
M,K
0.00475
22.5
135
0.276 [7.00mm]
0.272 [6.90mm]
0.185 [4.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL6050-2R0
2
M,K
0.0064
19.5
118
0.276 [7.00mm]
0.272 [6.90mm]
0.185 [4.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL6050-2R7
2.7
M,K
0.0082
16.5
103
0.276 [7.00mm]
0.272 [6.90mm]
0.185 [4.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL6050-3R3
3.3
M,K
0.0098
15.3
9
0.276 [7.00mm]
0.272 [6.90mm]
0.185 [4.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL6050-3R9
3.9
M,K
0.0142
14
8
0.276 [7.00mm]
0.272 [6.90mm]
0.185 [4.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL6050-4R7
4.7
M,K
0.017
12.7
65
0.276 [7.00mm]
0.272 [6.90mm]
0.185 [4.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL6050-5R6
5.6
M,K
0.0221
11.4
62
0.276 [7.00mm]
0.272 [6.90mm]
0.185 [4.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL6050-6R8
6.8
M,K
0.0236
10.3
6
0.276 [7.00mm]
0.272 [6.90mm]
0.185 [4.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL6050-7R6
7.6
M,K
0.024
8.3
55
0.276 [7.00mm]
0.272 [6.90mm]
0.185 [4.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL6050-8R8
8.8
M,K
0.0249
7.9
48
0.276 [7.00mm]
0.272 [6.90mm]
0.185 [4.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL6050-100
10
M,K
0.0305
7.4
44
0.276 [7.00mm]
0.272 [6.90mm]
0.185 [4.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
HCPL6050-130
13
M,K
0.0444
6.5
31
0.276 [7.00mm]
0.272 [6.90mm]
0.185 [4.70mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
SLPL127-1R0
1
M,K
0.0006
100
54
1.094 [27.8mm]
1.016 [25.8mm]
0.470 [11.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL127-1R5
1.5
M,K
0.0006
67
54
1.094 [27.8mm]
1.016 [25.8mm]
0.470 [11.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL127-2R2
2.2
M,K
0.00082
68
473
1.094 [27.8mm]
1.016 [25.8mm]
0.470 [11.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL127-3R3
3.3
M,K
0.00106
60.3
425
1.094 [27.8mm]
1.016 [25.8mm]
0.470 [11.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL127-4R7
4.7
M,K
0.00167
53.5
372
1.094 [27.8mm]
1.016 [25.8mm]
0.470 [11.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL127-6R8
6.8
M,K
0.002
44.1
35
1.094 [27.8mm]
1.016 [25.8mm]
0.470 [11.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL127-100
10
M,K
0.0023
34.9
331
1.094 [27.8mm]
1.016 [25.8mm]
0.470 [11.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL127-150
15
M,K
0.0023
23
331
1.094 [27.8mm]
1.016 [25.8mm]
0.470 [11.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1045-R18
0.18
M,K
7.8E-5
38
24
0.409 [10.4mm]
0.417 [10.6mm]
0.189 [4.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1045-R39
0.39
M,K
0.00134
25
20
0.409 [10.4mm]
0.417 [10.6mm]
0.189 [4.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1045-R68
0.68
M,K
0.0025
19
15
0.409 [10.4mm]
0.417 [10.6mm]
0.189 [4.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1045-1R0
1
M,K
0.0036
15
12
0.409 [10.4mm]
0.417 [10.6mm]
0.189 [4.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1045-1R5
1.5
M,K
0.0056
12.7
10
0.409 [10.4mm]
0.417 [10.6mm]
0.189 [4.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1045-2R1
2.1
M,K
0.0076
11
85
0.409 [10.4mm]
0.417 [10.6mm]
0.189 [4.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1045-2R8
2.8
M,K
0.0115
9.5
7
0.409 [10.4mm]
0.417 [10.6mm]
0.189 [4.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1045-3R5
3.5
M,K
0.0128
8.3
65
0.409 [10.4mm]
0.417 [10.6mm]
0.189 [4.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1045-4R4
4.4
M,K
0.0178
7.5
56
0.409 [10.4mm]
0.417 [10.6mm]
0.189 [4.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1045-5R3
5.3
M,K
0.0235
6.8
48
0.409 [10.4mm]
0.417 [10.6mm]
0.189 [4.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1056-R60
0.6
M,K
0.00155
26
19
0.409 [10.4mm]
0.417 [10.6mm]
0.232 [5.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1056-R92
0.92
M,K
0.0025
21
16
0.409 [10.4mm]
0.417 [10.6mm]
0.232 [5.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1056-1R3
1.3
M,K
0.00322
18
14
0.409 [10.4mm]
0.417 [10.6mm]
0.232 [5.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1056-1R8
1.8
M,K
0.00471
15.4
125
0.409 [10.4mm]
0.417 [10.6mm]
0.232 [5.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1056-2R4
2.4
M,K
0.00634
13
11
0.409 [10.4mm]
0.417 [10.6mm]
0.232 [5.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1056-3R0
3
M,K
0.00792
11.5
10
0.409 [10.4mm]
0.417 [10.6mm]
0.232 [5.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1056-4R7
4.7
M,K
0.0133
9.5
77
0.409 [10.4mm]
0.417 [10.6mm]
0.232 [5.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1056-5R6
5.6
M,K
0.0179
9
68
0.409 [10.4mm]
0.417 [10.6mm]
0.232 [5.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1056-6R5
6.5
M,K
0.0189
8.5
65
0.409 [10.4mm]
0.417 [10.6mm]
0.232 [5.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1056-7R5
7.5
M,K
0.0248
7.8
56
0.409 [10.4mm]
0.417 [10.6mm]
0.232 [5.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1056-8R8
8.8
M,K
0.0263
7.2
54
0.409 [10.4mm]
0.417 [10.6mm]
0.232 [5.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1056-100
10
M,K
0.0283
6.8
52
0.409 [10.4mm]
0.417 [10.6mm]
0.232 [5.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1065-R33
0.33
M,K
0.00115
36
23
0.409 [10.4mm]
0.417 [10.6mm]
0.268 [6.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1065-R56
0.56
M,K
0.00155
29
20
0.409 [10.4mm]
0.417 [10.6mm]
0.268 [6.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1065-R85
0.85
M,K
0.00195
24
18
0.409 [10.4mm]
0.417 [10.6mm]
0.268 [6.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1065-1R2
1.2
M,K
0.0028
21
16
0.409 [10.4mm]
0.417 [10.6mm]
0.268 [6.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1065-1R6
1.6
M,K
0.00346
18
15
0.409 [10.4mm]
0.417 [10.6mm]
0.268 [6.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1065-2R2
2.2
M,K
0.0051
15.5
13
0.409 [10.4mm]
0.417 [10.6mm]
0.268 [6.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1065-2R7
2.7
M,K
0.0061
13.7
12
0.409 [10.4mm]
0.417 [10.6mm]
0.268 [6.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1065-3R4
3.4
M,K
0.00785
12.2
105
0.409 [10.4mm]
0.417 [10.6mm]
0.268 [6.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1065-4R1
4.1
M,K
0.0098
11.1
96
0.409 [10.4mm]
0.417 [10.6mm]
0.268 [6.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1065-5R8
5.8
M,K
0.0139
9.4
78
0.409 [10.4mm]
0.417 [10.6mm]
0.268 [6.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1065-6R8
6.8
M,K
0.0149
8.7
75
0.409 [10.4mm]
0.417 [10.6mm]
0.268 [6.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1065-8R8
8.8
M,K
0.0227
7.7
62
0.409 [10.4mm]
0.417 [10.6mm]
0.268 [6.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1065-100
10
M,K
0.0246
7.1
6
0.409 [10.4mm]
0.417 [10.6mm]
0.268 [6.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1065-150
15
M,K
0.0371
5.6
46
0.409 [10.4mm]
0.417 [10.6mm]
0.268 [6.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1250-R26
0.26
M,K
0.00071
40
25
0.508 [12.9mm]
0.516 [13.1mm]
0.209 [5.3mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1250-R60
0.6
M,K
0.0015
26
19
0.508 [12.9mm]
0.516 [13.1mm]
0.209 [5.3mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1250-1R0
1
M,K
0.0024
22
17
0.508 [12.9mm]
0.516 [13.1mm]
0.209 [5.3mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1250-1R6
1.6
M,K
0.0041
17
14
0.508 [12.9mm]
0.516 [13.1mm]
0.209 [5.3mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1250-2R4
2.4
M,K
0.006
14
12
0.508 [12.9mm]
0.516 [13.1mm]
0.209 [5.3mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1250-3R3
3.3
M,K
0.0077
12
10
0.508 [12.9mm]
0.516 [13.1mm]
0.209 [5.3mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1250-4R3
4.3
M,K
0.0101
10.5
9
0.508 [12.9mm]
0.516 [13.1mm]
0.209 [5.3mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1250-5R6
5.6
M,K
0.0123
9.5
8
0.508 [12.9mm]
0.516 [13.1mm]
0.209 [5.3mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1250-6R8
6.8
M,K
0.0168
8.5
7
0.508 [12.9mm]
0.516 [13.1mm]
0.209 [5.3mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1250-8R2
8.2
M,K
0.021
7.5
62
0.508 [12.9mm]
0.516 [13.1mm]
0.209 [5.3mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1250-100
10
M,K
0.0271
6.9
53
0.508 [12.9mm]
0.516 [13.1mm]
0.209 [5.3mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1250-130
13
M,K
0.039
6
45
0.508 [12.9mm]
0.516 [13.1mm]
0.209 [5.3mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1256-1R5
1.5
M,K
0.0029
20
17
0.508 [12.9mm]
0.516 [13.1mm]
0.232 [5.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1256-2R2
2.2
M,K
0.0043
17
14
0.508 [12.9mm]
0.516 [13.1mm]
0.232 [5.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1256-3R0
3
M,K
0.0062
14.5
115
0.508 [12.9mm]
0.516 [13.1mm]
0.232 [5.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1256-3R9
3.9
M,K
0.0084
12.6
10
0.508 [12.9mm]
0.516 [13.1mm]
0.232 [5.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1256-5R0
5
M,K
0.0106
11
9
0.508 [12.9mm]
0.516 [13.1mm]
0.232 [5.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1256-6R2
6.2
M,K
0.0129
10
8
0.508 [12.9mm]
0.516 [13.1mm]
0.232 [5.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1256-7R5
7.5
M,K
0.0154
9
73
0.508 [12.9mm]
0.516 [13.1mm]
0.232 [5.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1256-9R0
9
M,K
0.0205
8.5
65
0.508 [12.9mm]
0.516 [13.1mm]
0.232 [5.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1256-110
11
M,K
0.0253
7.5
59
0.508 [12.9mm]
0.516 [13.1mm]
0.232 [5.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1256-140
14
M,K
0.0345
6.5
48
0.508 [12.9mm]
0.516 [13.1mm]
0.232 [5.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1256-180
18
M,K
0.046
5.5
4
0.508 [12.9mm]
0.516 [13.1mm]
0.232 [5.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1260-R80
0.8
M,K
0.002
29
20
0.508 [12.9mm]
0.516 [13.1mm]
0.248 [6.3mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1260-1R0
1
M,K
0.002
28
20
0.508 [12.9mm]
0.516 [13.1mm]
0.248 [6.3mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1260-1R2
1.2
M,K
0.0021
21
19
0.508 [12.9mm]
0.516 [13.1mm]
0.248 [6.3mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1260-2R2
2.2
M,K
0.0026
19
17
0.508 [12.9mm]
0.516 [13.1mm]
0.248 [6.3mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1260-4R0
4
M,K
0.0063
13
115
0.508 [12.9mm]
0.516 [13.1mm]
0.248 [6.3mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1260-4R7
4.7
M,K
0.0078
11.5
95
0.508 [12.9mm]
0.516 [13.1mm]
0.248 [6.3mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1260-6R8
6.8
M,K
0.0102
10.5
82
0.508 [12.9mm]
0.516 [13.1mm]
0.248 [6.3mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1260-100
10
M,K
0.0135
7
8
0.508 [12.9mm]
0.516 [13.1mm]
0.248 [6.3mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1260-170
17
M,K
0.0235
5
55
0.508 [12.9mm]
0.516 [13.1mm]
0.248 [6.3mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1265-1R4
1.4
M,K
0.0025
25
18
0.508 [12.9mm]
0.516 [13.1mm]
0.272 [6.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1265-2R0
2
M,K
0.0035
21
16
0.508 [12.9mm]
0.516 [13.1mm]
0.272 [6.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1265-2R7
2.7
M,K
0.0044
18
14
0.508 [12.9mm]
0.516 [13.1mm]
0.272 [6.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1265-3R6
3.6
M,K
0.0064
16
12
0.508 [12.9mm]
0.516 [13.1mm]
0.272 [6.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1265-4R7
4.7
M,K
0.0078
14
11
0.508 [12.9mm]
0.516 [13.1mm]
0.272 [6.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1265-5R6
5.6
M,K
0.0095
12.5
10
0.508 [12.9mm]
0.516 [13.1mm]
0.272 [6.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1265-6R8
6.8
M,K
0.0126
11.5
85
0.508 [12.9mm]
0.516 [13.1mm]
0.272 [6.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1265-8R2
8.2
M,K
0.014
10.5
8
0.508 [12.9mm]
0.516 [13.1mm]
0.272 [6.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1265-100
10
M,K
0.016
9.5
73
0.508 [12.9mm]
0.516 [13.1mm]
0.272 [6.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1265-130
13
M,K
0.0235
8.5
63
0.508 [12.9mm]
0.516 [13.1mm]
0.272 [6.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1265-150
15
M,K
0.0267
7.9
58
0.508 [12.9mm]
0.516 [13.1mm]
0.272 [6.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1265-180
18
M,K
0.0322
6.5
53
0.508 [12.9mm]
0.516 [13.1mm]
0.272 [6.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1265-220
22
M,K
0.037
5.8
48
0.508 [12.9mm]
0.516 [13.1mm]
0.272 [6.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1265-270
27
M,K
0.047
5.3
42
0.508 [12.9mm]
0.516 [13.1mm]
0.272 [6.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1265-330
33
M,K
0.063
4.8
35
0.508 [12.9mm]
0.516 [13.1mm]
0.272 [6.9mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1275-1R2
1.2
M,K
0.0025
28
18
0.508 [12.9mm]
0.516 [13.1mm]
0.307 [7.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1275-1R8
1.8
M,K
0.00295
23
17
0.508 [12.9mm]
0.516 [13.1mm]
0.307 [7.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1275-2R5
2.5
M,K
0.0037
20
15
0.508 [12.9mm]
0.516 [13.1mm]
0.307 [7.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1275-3R3
3.3
M,K
0.00465
17.6
14
0.508 [12.9mm]
0.516 [13.1mm]
0.307 [7.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1275-4R2
4.2
M,K
0.006
15.7
12
0.508 [12.9mm]
0.516 [13.1mm]
0.307 [7.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1275-5R2
5.2
M,K
0.00805
14.2
105
0.508 [12.9mm]
0.516 [13.1mm]
0.307 [7.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1275-6R3
6.3
M,K
0.009
12.7
10
0.508 [12.9mm]
0.516 [13.1mm]
0.307 [7.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1275-7R5
7.5
M,K
0.0115
11.4
89
0.508 [12.9mm]
0.516 [13.1mm]
0.307 [7.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1275-8R8
8.8
M,K
0.0132
10.5
82
0.508 [12.9mm]
0.516 [13.1mm]
0.307 [7.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1275-100
10
M,K
0.0163
9.8
75
0.508 [12.9mm]
0.516 [13.1mm]
0.307 [7.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1275-150
15
M,K
0.0242
8.1
6
0.508 [12.9mm]
0.516 [13.1mm]
0.307 [7.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1275-230
23
M,K
0.0336
6.1
5
0.508 [12.9mm]
0.516 [13.1mm]
0.307 [7.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1275-280
28
M,K
0.042
5.5
45
0.508 [12.9mm]
0.516 [13.1mm]
0.307 [7.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1275-330
33
M,K
0.054
5
39
0.508 [12.9mm]
0.516 [13.1mm]
0.307 [7.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1275-390
39
M,K
0.0585
4.6
37
0.508 [12.9mm]
0.516 [13.1mm]
0.307 [7.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1275-470
47
M,K
0.0767
4.3
32
0.508 [12.9mm]
0.516 [13.1mm]
0.307 [7.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1275-560
56
M,K
0.0847
3.9
29
0.508 [12.9mm]
0.516 [13.1mm]
0.307 [7.8mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1290-6R8
6.8
M,K
0.015
18
9
0.508 [12.9mm]
0.516 [13.1mm]
0.354 [9.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1290-100
10
M,K
0.015
13
9
0.508 [12.9mm]
0.516 [13.1mm]
0.354 [9.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1290-150
15
M,K
0.015
9
9
0.508 [12.9mm]
0.516 [13.1mm]
0.354 [9.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1290-220
22
M,K
0.0231
6.8
77
0.508 [12.9mm]
0.516 [13.1mm]
0.354 [9.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1290-330
33
M,K
0.0231
4.4
77
0.508 [12.9mm]
0.516 [13.1mm]
0.354 [9.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1290-470
47
M,K
0.0231
3
77
0.508 [12.9mm]
0.516 [13.1mm]
0.354 [9.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1460-1R2
1.2
M,K
0.003
35
195
0.587 [14.9mm]
0.598 [15.2mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1460-1R5
1.5
M,K
0.003
27.5
195
0.587 [14.9mm]
0.598 [15.2mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1460-2R2
2.2
M,K
0.0046
24.5
15
0.587 [14.9mm]
0.598 [15.2mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1460-2R7
2.7
M,K
0.0046
20.5
15
0.587 [14.9mm]
0.598 [15.2mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1460-3R5
3.5
M,K
0.0068
18.7
12
0.587 [14.9mm]
0.598 [15.2mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1460-4R2
4.2
M,K
0.0068
17
12
0.587 [14.9mm]
0.598 [15.2mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1460-5R0
5
M,K
0.0101
15.2
95
0.587 [14.9mm]
0.598 [15.2mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1460-6R1
6.1
M,K
0.0101
13.5
95
0.587 [14.9mm]
0.598 [15.2mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1460-8R2
8.2
M,K
0.0138
11
82
0.587 [14.9mm]
0.598 [15.2mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1460-100
10
M,K
0.0138
9.5
82
0.587 [14.9mm]
0.598 [15.2mm]
0.236 [6.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1480-R40
0.4
M,K
0.0012
66
23
0.587 [14.9mm]
0.598 [15.2mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1480-R90
0.9
M,K
0.0015
45
215
0.587 [14.9mm]
0.598 [15.2mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1480-1R5
1.5
M,K
0.002
34
20
0.587 [14.9mm]
0.598 [15.2mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1480-2R4
2.4
M,K
0.0033
28
175
0.587 [14.9mm]
0.598 [15.2mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1480-3R4
3.4
M,K
0.005
23
16
0.587 [14.9mm]
0.598 [15.2mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1480-4R7
4.7
M,K
0.0061
19
125
0.587 [14.9mm]
0.598 [15.2mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1480-6R1
6.1
M,K
0.0078
18.5
11
0.587 [14.9mm]
0.598 [15.2mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1480-7R7
7.7
M,K
0.0096
15.5
10
0.587 [14.9mm]
0.598 [15.2mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1480-9R5
9.5
M,K
0.0133
14
85
0.587 [14.9mm]
0.598 [15.2mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL1480-470
47
M,K
0.0511
5
3
0.587 [14.9mm]
0.598 [15.2mm]
0.315 [8.0mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL2214-3R3
3.3
M,K
0.0019
52
365
0.846 [21.5mm]
0.836 [21.23mm]
0.570 [14.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL2214-6R8
6.8
M,K
0.0019
27
365
0.846 [21.5mm]
0.836 [21.23mm]
0.570 [14.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL2214-120
12
M,K
0.0044
23.2
235
0.846 [21.5mm]
0.836 [21.23mm]
0.570 [14.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL2214-220
22
M,K
0.0044
12.5
235
0.846 [21.5mm]
0.836 [21.23mm]
0.570 [14.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL2214-330
33
M,K
0.0126
13.5
128
0.846 [21.5mm]
0.836 [21.23mm]
0.570 [14.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
SLPL2214-470
47
M,K
0.0126
10
128
0.846 [21.5mm]
0.836 [21.23mm]
0.570 [14.5mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +125°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
EDPL1608-R22
0.22
M,K
0.04
5.5
34
0.063 [1.60mm]
0.031 [0.80mm]
0.031 [0.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 8N for 60 seconds. Inductor shall have no mechanical damage.
EDPL1608-R24
0.24
M,K
0.041
5.3
33
0.063 [1.60mm]
0.031 [0.80mm]
0.031 [0.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 8N for 60 seconds. Inductor shall have no mechanical damage.
EDPL1608-R47
0.47
M,K
0.1
4.1
26
0.063 [1.60mm]
0.031 [0.80mm]
0.031 [0.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 8N for 60 seconds. Inductor shall have no mechanical damage.
EDPL1608-R56
0.56
M,K
0.11
4
22
0.063 [1.60mm]
0.031 [0.80mm]
0.031 [0.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 8N for 60 seconds. Inductor shall have no mechanical damage.
EDPL1608-R68
0.68
M,K
0.13
3.3
21
0.063 [1.60mm]
0.031 [0.80mm]
0.031 [0.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 8N for 60 seconds. Inductor shall have no mechanical damage.
EDPL1608-1R0
1
M,K
0.2
3
2
0.063 [1.60mm]
0.031 [0.80mm]
0.031 [0.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 8N for 60 seconds. Inductor shall have no mechanical damage.
EDPL1608-2R2
2.2
M,K
0.26
1.5
14
0.063 [1.60mm]
0.031 [0.80mm]
0.031 [0.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 8N for 60 seconds. Inductor shall have no mechanical damage.
EDPL1608-4R7
4.7
M,K
0.7
1.2
1
0.063 [1.60mm]
0.031 [0.80mm]
0.031 [0.80mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 8N for 60 seconds. Inductor shall have no mechanical damage.
EDPL3212-R10
0.1
M,K
0.007
18
12
0.126 [3.20mm]
0.098 [2.50mm]
0.047 [1.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 8N for 60 seconds. Inductor shall have no mechanical damage.
EDPL3212-R22
0.22
M,K
0.01
11.5
92
0.126 [3.20mm]
0.098 [2.50mm]
0.047 [1.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 8N for 60 seconds. Inductor shall have no mechanical damage.
EDPL3212-R24
0.24
M,K
0.012
11
9
0.126 [3.20mm]
0.098 [2.50mm]
0.047 [1.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 8N for 60 seconds. Inductor shall have no mechanical damage.
EDPL3212-R33
0.33
M,K
0.014
10
84
0.126 [3.20mm]
0.098 [2.50mm]
0.047 [1.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 8N for 60 seconds. Inductor shall have no mechanical damage.
EDPL3212-R47
0.47
M,K
0.019
8.6
75
0.126 [3.20mm]
0.098 [2.50mm]
0.047 [1.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 8N for 60 seconds. Inductor shall have no mechanical damage.
EDPL3212-R68
0.68
M,K
0.023
8.1
73
0.126 [3.20mm]
0.098 [2.50mm]
0.047 [1.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 8N for 60 seconds. Inductor shall have no mechanical damage.
EDPL3212-1R0
1
M,K
0.03
6.6
53
0.126 [3.20mm]
0.098 [2.50mm]
0.047 [1.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 8N for 60 seconds. Inductor shall have no mechanical damage.
EDPL3212-1R5
1.5
M,K
0.044
5.1
47
0.126 [3.20mm]
0.098 [2.50mm]
0.047 [1.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 8N for 60 seconds. Inductor shall have no mechanical damage.
EDPL3212-2R2
2.2
M,K
0.07
4.6
36
0.126 [3.20mm]
0.098 [2.50mm]
0.047 [1.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 8N for 60 seconds. Inductor shall have no mechanical damage.
EDPL3212-3R3
3.3
M,K
0.095
3.7
29
0.126 [3.20mm]
0.098 [2.50mm]
0.047 [1.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 8N for 60 seconds. Inductor shall have no mechanical damage.
EDPL3212-4R7
4.7
M,K
0.135
2.9
23
0.126 [3.20mm]
0.098 [2.50mm]
0.047 [1.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 8N for 60 seconds. Inductor shall have no mechanical damage.
EDPL3212-6R8
6.8
M,K
0.21
2.8
22
0.126 [3.20mm]
0.098 [2.50mm]
0.047 [1.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 8N for 60 seconds. Inductor shall have no mechanical damage.
EDPL3212-100
10
M,K
0.23
2.3
21
0.126 [3.20mm]
0.098 [2.50mm]
0.047 [1.20mm]
Termination Options:
RoHS-compliant, lead-free (standard).
Tin-Lead (SnPb) termination available; add suffix “S” to part number.
Operating Temperature Range: –40°C to +150°C.
Storage Temperature Range: 5°C to 30°C, 10 to 60% RH.
Packaging Temperature Range (Tape & Reel): 5°C to 30°C, 10 to 60% RH.
Soldering Heat Resistance: Withstands up to three reflow cycles at +260°C for 40 seconds max per cycle; components must return to room temperature between cycles. See www.magneticcs.com/reflowprofile for recommended reflow refile.
Moisture Sensitivity Level (MSL): Level 1 per JEDEC J-STD-020 (unlimited floor life at 5°C to 30°C, 10 to 60% RH).
PCB Cleaning Compatibility: Qualified per MIL-STD-202, Method 215.
High Temperature Exposure: MIL-STD-202, Method 108, 125°C for 96 hours. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Thermal Cycling: JESD22-A 104, -40°C to +125°C for 100 cycles. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Humidity Testing: MIL-STD-202, Method 103. Temperature 85°C, 96 hours, humidity 85%. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to solvents: MIL-STD-202, Method 215. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Resistance to soldering heat: MIL-STD-202, Method 210. Solder temp 245°C, 10 seconds. Part inductance shall be within +/- 20% from initial inductance and no body damage.
Solderability: J-STD-002. Preheat 150°C, solder temp 240°C. Terminal shall be covered by 95% with fresh solder.
Terminal Strength: IEC 60068-2-21, 8N for 60 seconds. Inductor shall have no mechanical damage.
